Electronic device

Patent metadata

Field	Value
Publication number	US-9362240-B2
Application number	US-201314099016-A
Country	US
Kind code	B2
Filing date	Dec 6, 2013
Priority date	Dec 6, 2013
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

An electronic device includes multiple semiconductor chips in a single housing. Such semiconductor chips may comprise different semiconductor materials, for example they may comprise GaN. Using bonding clips instead of bonding wires is an efficient way of connecting such semiconductor chips to a substrate.

First claim

What is claimed is:

1. An electronic device, comprising:
a substrate;
a first semiconductor element comprising one or more first contact elements, the first semiconductor element arranged on the substrate;
a second semiconductor element comprising one or more second contact elements, the second semiconductor element arranged on the substrate; and
a bonding clip electrically connecting one or more of the first and second contact elements on the first and second semiconductor elements to the substrate,
wherein the first semiconductor element and the second semiconductor element are arranged on opposite sides of the substrate,
wherein the substrate comprises a leadframe or a direct bonded copper substrate.

2. The electronic device according to claim 1 , wherein the first semiconductor element comprises a III-V based semiconductor material.

3. The electronic device according to claim 2 , wherein the III-V based semiconductor material comprises a GaN based semiconductor material.

4. The electronic device according to claim 1 , wherein the second semiconductor element comprises a Si based semiconductor material.

5. The electronic device according to claim 1 , wherein the second semiconductor element comprises a diode, a MOSFET, an IGBT or a flyback diode.

6. The electronic device according to claim 1 , wherein the substrate comprises a plurality of lead elements.

7. The electronic device according to claim 1 , wherein the device comprises a single inline package (SIP).

8. An electronic device, comprising:
a first semiconductor element comprising first contact elements;
a second semiconductor element comprising second contact elements; and
a first substrate element and a second substrate element distinct from the first substrate element,
wherein the first semiconductor element and the second semiconductor element are arranged on the first substrate element,
wherein a source contact of the first semiconductor element and a drain contact of the second semiconductor element are electrically connected to the first substrate element,
wherein a gate contact of the first semiconductor element is connected to a source contact of the second semiconductor element and a drain contact of the first semiconductor element and the source contact of the second semiconductor element and a gate contact of the second semiconductor element are connected to the second substrate element.

9. The electronic device according to claim 8 , wherein the first semiconductor element comprises a III-V based semiconductor material.

10. The electronic device according to claim 9 , wherein the III-V based semiconductor material comprises GaN.

11. The electronic device according to claim 8 , wherein the first semiconductor element comprises a high electron mobility transistor (HEMT) and the second semiconductor element comprises a power MOSFET.

12. The electronic device according to claim 8 , wherein the second substrate element comprises a plurality of leads.

13. The electronic device according to claim 8 , wherein one or more of the connections comprises a bonding clip, the bonding clip comprising aluminum, nickel, silver, gold, copper or a metal alloy.

14. An electronic device, comprising:
a substrate;
a first semiconductor element comprising one or more first contact elements, the first semiconductor element arranged on the substrate;
a second semiconductor element comprising one or more second contact elements, the second semiconductor element arranged on the substrate; and
a bonding clip electrically connecting one or more of the first and second contact elements on the first and second semiconductor elements to the substrate,
wherein the first semiconductor element and the second semiconductor element are arranged on opposite side faces of the substrate,
wherein the device comprises a single inline package (SIP).

Assignees

• Infineon Technologies Austria

Inventors

• Hosseini Khalil
• Mahler Joachim
• Otremba Ralf
• Hoeglauer Josef
• Schredl Juergen
• Schloegel Xaver
• Schiess Klaus

Classifications

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/764

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/07653

  changes in shapes · CPC title

• H10W72/07652

  changes in structures or sizes · CPC title