Composition for forming silica based insulating layer, silica based insulating layer and method for manufacturing silica based insulating layer

Patent metadata

Field	Value
Publication number	US-9362030-B2
Application number	US-201414268193-A
Country	US
Kind code	B2
Filing date	May 2, 2014
Priority date	Aug 8, 2013
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

A composition for forming a silica-based insulation layer, a silica-based insulation layer, and a method of manufacturing the silica-based insulation layer, the composition including a solvent; and an organosilane-based condensation polymerization product, the organosilane-based condensation polymerization product being prepared from a compound mixture, the compound mixture including compounds represented by the following Chemical Formulae 1 and 2:

(R 1 ) 3 SiXSi(R 1 ) 3   [Chemical Formula 1]

R 2 e (Si)OR 3 4-e .  [Chemical Formula 2]

First claim

What is claimed is:

1. A composition for forming a silica-based insulation layer, the composition comprising:
a solvent; and
an organosilane-based condensation polymerization product, the organosilane-based condensation polymerization product being prepared from a compound mixture, the compound mixture including compounds represented by the following Chemical Formulae 1 and 2:
(R 1 ) 3 SiXSi(R 1 ) 3   [Chemical Formula 1]

wherein, in the above Chemical Formula 1,
R 1 is independently hydrogen, a hydroxy group, a substituted or unsubstituted C1 to C20 alkoxy group, a halogen-containing group, a silicon-containing group, or a combination thereof, and
X is a porogen-containing linking group, wherein the porogen includes polyethylene oxide (PEO), polypropylene oxide (PPO), or a copolymer of polyethylene oxide and polypropylene oxide,
R 2 e (Si)(OR 3 ) 4-e   [Chemical Formula 2]

wherein, in the above Chemical Formula 2,
e is an integer of 0 to 3,
R 2 is independently hydrogen, a hydroxy group, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C6 to C20 aryl group, a vinyl group, or a combination thereof, and
R 3 is hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C6 to C20 aryl group, a vinyl group, or a combination thereof.

2. The composition for forming a silica-based insulation layer as claimed in claim 1 , further comprising a pore-forming agent.

3. The composition for forming a silica-based insulation layer as claimed in claim 1 , further comprising a thermal acid generator.

4. The composition for forming a silica-based insulation layer as claimed in claim 1 , wherein the compound mixture further includes a compound represented by the following Chemical Formula 3:
(R 4 ) 3 Si(CH 2 ) m Si(R 4 ) 3   [Chemical Formula 3]

wherein, in the above Chemical Formula 3,
m is an integer of 1 to 6, and
R 4 is hydrogen, a hydroxy group, a substituted or unsubstituted C1 to C20 alkoxy group, a halogen-containing group, a silicon-containing group, or a combination thereof.

5. The composition for forming a silica-based insulation layer as claimed in claim 4 , wherein the organosilane-based condensation polymerization product includes a structural unit represented by the following Chemical Formula 4:

wherein, in the above Chemical Formula 4,
R 1 to R 4 , X, and M are the same as described with respect to Chemical Formulae 1 to 3, and
x, y, and z represent a relative mole ratio of each repeating unit, and satisfy the following relations: 0.05≦x≦0.50, 0.45≦y≦0.90, 0.05≦z≦0.50, and x+y+z=1.

6. The composition for forming a silica-based insulation layer as claimed in claim 1 , wherein the organosilane-based condensation polymerization product has a weight average molecular weight (Mw) of about 3,000 to about 20,000.

7. The composition for forming a silica-based insulation layer as claimed in claim 1 , wherein the organosilane-based condensation polymerization product is included in an amount of about 0.1 to about 50 wt %, based on a total weight of the composition.

8. A method of manufacturing a silica-based insulation layer, the method comprising:
coating the composition for forming a silica-based insulation layer as claimed in claim 1 on a substrate;
drying the substrate coated with the composition for forming a silica-based insulation layer; and
curing the resultant at about 150° C. to about 500° C. under an inert gas atmosphere.

Assignees

• Park Eun-Su
• Kwak Taek-Soo
• Na Yoong-Hee
• Song Hyun-Ji
• Lee Han-Song
• Hong Seung-Hee
• Cheil Ind Inc

Inventors

• Park Eun-Su
• Kwak Taek-Soo
• Na Yoong-Hee
• Song Hyun-Ji
• Lee Han-Song
• Hong Seung-Hee

Classifications

• H01B19/02 Primary

  Drying; Impregnating · CPC title

• C08G77/54

  Nitrogen-containing linkages · CPC title

• C09D183/14

  in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms (C09D183/10 takes precedence) · CPC title

• H01B19/04

  Treating the surfaces, e.g. applying coatings · CPC title

• H01B3/46

  silicones · CPC title