Nanowire or 2D material strips interconnects in an integrated circuit cell

Patent metadata

Field	Value
Publication number	US-9361418-B2
Application number	US-201414312186-A
Country	US
Kind code	B2
Filing date	Jun 23, 2014
Priority date	Jun 23, 2014
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

An integrated circuit design tool includes a cell library. The cell library includes entries for a plurality of cells, entries in the cell library including specifications of particular cells in a computer executable language. At least one entry in the cell library can comprise a specification of physical structures and timing parameters of a circuit including a first transistor, a second transistor, and an interconnect connecting a terminal of the first transistor to a terminal of the second transistor, the interconnect comprising one or more nanowires or 2D material strips arranged in parallel. An integrated circuit including the circuit is described.

First claim

What is claimed is:

1. A computer system adapted to process a computer implemented representation of a circuit design, comprising:
a processor and a memory coupled to the processor, the memory storing instructions that, when executed by the processor, cause the processor to select cells from a cell library;
the cell library including entries for a plurality of cells, entries in the cell library including specifications of particular cells in a computer executable language; and
at least one entry in the cell library comprising a specification of physical structures and timing parameters of a circuit including:
a first transistor,
a second transistor, and
an interconnect connecting a terminal of the first transistor to a terminal of the second transistor, the interconnect comprising one or more nanowires or 2D material strips arranged in parallel,

wherein said one or more nanowires or 2D material strips of the interconnect includes/include a set of nanowires or 2D material strips disposed in a plurality of stacks.

2. The computer system of claim 1 , wherein said one or more nanowires or 2D material strips of the interconnect is/are disposed horizontally relative to a surface of a substrate.

3. The computer system of claim 1 , wherein the first transistor has a channel comprising a first set of nanowires or 2D material strips arranged in parallel, and the second transistor has a channel comprising a second set of nanowires or 2D material strips arranged in parallel.

4. The computer system of claim 1 , wherein the first transistor is configured for n-channel operation, and the second transistor is configured for p-channel operation.

5. The computer system of claim 1 , wherein a nanowire or 2D material strip in said one or more nanowires or 2D material strips has a minimum cross-sectional dimension which is less than 10 nanometers.

6. The computer system of claim 1 , wherein a nanowire or 2D material strip in said one or more nanowires or 2D material strips has a height and a width orthogonal to a longitudinal axis of the nanowire or 2D material strip, and the width is equal to or greater than two times the height.

7. The computer system of claim 1 , wherein the first transistor has a channel comprising a first set of nanowires or 2D material strips arranged in parallel and disposed horizontally relative to a surface of a substrate, and the second transistor has a channel comprising a second set of nanowires or 2D material strips arranged in parallel and disposed horizontally relative to the surface of the substrate, wherein said one or more nanowires or 2D material strips of the interconnect is/are disposed between the surface of the substrate and the first set of nanowires and the second set of nanowires.

8. The computer system of claim 1 , wherein the first transistor has a channel comprising a first set of nanowires or 2D material strips arranged in parallel and disposed vertically relative to a surface of a substrate, and the second transistor has a channel comprising a second set of nanowires or 2D material strips arranged in parallel and disposed vertically relative to the surface of the substrate, wherein said one or more nanowires or 2D material strips of the interconnect is/are disposed between the first set of nanowires and the second set of nanowires and the surface of the substrate.

9. The computer system of claim 1 , wherein
the instructions further include logic to utilize the specification in said at least one entry to determine a physical placement of the cell.

10. A computer program product, comprising:
a memory device having stored thereon a machine readable specification of a cell, the specification of the cell including computer readable parameters specifying structural features of a physical implementation of a circuit, the specification being executable by a computer running a placement process to control physical placement of the circuit with other circuits or components, the circuit comprising:
a first transistor,
a second transistor, and
an interconnect connecting a terminal of the first transistor to a terminal of the second transistor, the interconnect comprising one or more nanowires or 2D material strips arranged in parallel,
wherein said one or more nanowires or 2D material strips of the interconnect includes/include a set of nanowires or 2D material strips disposed in a plurality of stacks.

11. The computer program product of claim 10 , wherein said one or more nanowires or 2D material strips of the interconnect is/are disposed horizontally relative to a surface of a substrate.

12. The computer program product of claim 10 , wherein the first transistor has a channel comprising a first set of nanowires or 2D material strips arranged in parallel, and the second transistor has a channel comprising a second set of nanowires or 2D material strips arranged in parallel.

13. The computer program product of claim 10 , wherein the first transistor is configured for n-channel operation, and the second transistor is configured for p-channel operation.

14. The computer program product of claim 10 , wherein a nanowire or 2D material strip in said one or more nanowires or 2D material strips has a minimum cross-sectional dimension which is less than 10 nanometers.

15. The computer program product of claim 10 , wherein a nanowire or 2D material strip in said one or more nanowires or 2D material strips has a height and a width orthogonal to a longitudinal axis of the nanowire or 2D material strip, and the width is equal to or greater than two times the height.

16. The computer program product of claim 10 , wherein the first transistor has a channel comprising a first set of nanowires or 2D material strips arranged in parallel and disposed horizontally relative to a surface of a substrate, and the second transistor has a channel comprising a second set of nanowires or 2D material strips arranged in parallel and disposed horizontally relative to the surface of the substrate, wherein said one or more nanowires or 2D material strips of the interconnect is/are disposed between the surface of the substrate and the first set of nanowires and the second set of nanowires.

17. The computer program product of claim 10 , wherein the first transistor has a channel comprising a first set of nanowires or 2D material strips arranged in parallel and disposed vertically relative to a surface of a substrate, and the second transistor has a channel comprising a second set of nanowires or 2D material strips arranged in parallel and disposed vertically relative to the surface of the substrate, wherein said one or more nanowires or 2D material strips of the interconnect is/are disposed between the first set of nanowires and the second set of nanowires and the surface of the substrate.

18. A method for designing a circuit, comprising:
specifying a circuit including a first transistor, a second transistor, and an interconnect connecting a terminal of the first transistor to a terminal of the second transistor, the interconnect comprising one or more nanowires or 2D material strips arranged in parallel, to form a machine readable specification of circuit structures;
executing a process utilizing the machine readable specification of circuit structures to determine parameters used to simulate timing characteristics of a physical implementation of the circuit when placed with other circuits or components;
creating a machine readable specification of a cell including said parameters, the specification being executable by a computer running a placement process to control p

Assignees

• Synopsys Inc

Inventors

• Moroz Victor
• Kawa Jamil

Classifications

• H10W20/4451

  Semiconductor materials, e.g. polysilicon · CPC title

• H10W20/43

  Layouts of interconnections · CPC title

• H10W20/42

  Vias, e.g. via plugs · CPC title

• H10W20/0554

  of nanotubes or nanowires · CPC title

• H10W20/0698 Primary

  Local interconnections · CPC title