LED module and LED lamp employing same

Patent metadata

Field	Value
Publication number	US-9360167-B2
Application number	US-201214345263-A
Country	US
Kind code	B2
Filing date	Sep 18, 2012
Priority date	Sep 20, 2011
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

Provided is an LED module with which wide light distribution may be obtained even with a small number of attached LED devices, and which has a simple structure which may be easily assembled. An LED module includes a column-shaped mounting substrate and a plurality of LED devices. The mounting substrate has a structure further including an insulation layer between a first copper plate and a second copper plate. When mounting the plurality of LED devices on a leading end part of the mounting substrate, the first copper plate is used as the plus-side electrode, and the second copper plate is used as the minus-side electrode.

First claim

What is claimed is:

1. An LED module comprising:
a column-shaped mounting substrate in which a first metal plate, an insulation layer, and a second metal plate are laminated in order, the mounting substrate having a long side in the surface direction of the first metal plate and the second metal plate, the length of the long side being greater than the thickness in the lamination direction; and
a plurality of LED devices connected to the first metal plate and to the second metal plate at a leading end part in the long side direction of the mounting substrate with the first metal plate as a plus-side electrode and the second metal plate as a minus-side electrode,
wherein the mounting substrate has a structure in which the insulation layer is sandwiched between the first metal plate and the second metal plate, and
each of the plurality of LED devices includes an LED die whose side surface and top surface are coated with a fluorescent resin, and is connected to the first metal plate and the second metal plate by solder so as to straddle the insulation layer.

2. The LED module according to claim 1 , wherein the mounting substrate has two side surfaces to which the insulation layer is exposed, and
part or all of the plurality of LED devices are mounted onto the two side surfaces.

3. The LED module according to claim 1 , wherein part of the plurality of LED devices are mounted onto an end surface of the leading end part in the long side direction of the mounting substrate.

4. The LED module according to claim 1 , wherein each of the plurality of LED devices includes a plurality of LED dies, and the plurality of LED dies is connected in series.

5. The LED module according to claim 1 , wherein each of the LED devices comprises any one of a reflective layer and a semi-transmissive reflective layer on the opposite surface of the surface mounted onto the mounting substrate.

6. The LED module according to claim 1 , wherein the first metal plate and the second metal plate are heat pipes.

7. An LED lamp comprising:
a globe;
a case for supporting the globe;
the LED module according to claim 1 in which the plurality of LED devices is arranged so as to be located in the vicinity of the center of the globe as a light source; and
a thermally conductive part coupled to the case and with which the LED module comes into contact.

8. The LED lamp according to claim 7 , wherein a rear end part of the LED module on the opposite side of the leading end part in the long side direction of the mounting substrate of the LED module comes into contact with the thermally conductive part, and electricity is supplied to the LED module at a middle part of the LED module located between the leading end part and the rear end part.

9. The LED lamp according to claim 8 , wherein the thermally conductive part comprises an insertion hole, and the rear end part of the LED module is inserted into the insertion hole.

10. The LED lamp according to claim 7 , further comprising a circuit substrate arranged on the globe side of the case, the circuit substrate having a through hole which the LED module penetrates, wherein electricity is supplied from the circuit substrate to the LED module.

11. The LED lamp according to claim 7 , wherein a middle part of the LED module located between the leading end part and a rear end part on the opposite side of the leading end part in the long side direction of the mounting substrate of the LED module comes into contact with the thermally conductive part, and electricity is supplied to the LED module at the rear end part of the LED module.

12. The LED lamp according to claim 11 , wherein the thermally conductive part comprises an opening, and the LED module penetrates the opening.

13. An LED lamp comprising:
a globe;
a case for supporting the globe;
an LED module including
a column-shaped mounting substrate in which a first metal plate, an insulation layer, and a second metal plate are laminated in order, the mounting substrate having a long side in the surface direction of the first metal plate and the second metal plate, the length of the long side being greater than the thickness in the lamination direction, and
a plurality of LED devices connected to the first metal plate and to the second metal plate at a leading end part in the long side direction of the mounting substrate with the first metal plate as a plus-side electrode and the second metal plate as a minus-side electrode, wherein the plurality of LED devices is arranged so as to be located in the vicinity of the center of the globe as a light source;
a thermally conductive part coupled to the case and with which the LED module comes into contact; and
a circuit substrate arranged on the globe side of the case, the circuit substrate having a through hole which the LED module penetrates, wherein electricity is supplied from the circuit substrate to the LED module.

Assignees

• Citizen Holdings Co Ltd
• Citizen Electronics

Inventors

• Imai Sadato
• Ishii Hirohiko

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H05K3/32

  electrically connecting electric components or wires to printed circuits · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title