Polyamide resin, preparation method therefor, and molded product including same

US9359476B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9359476-B2
Application numberUS-201314655569-A
CountryUS
Kind codeB2
Filing dateMar 27, 2013
Priority dateDec 28, 2012
Publication dateJun 7, 2016
Grant dateJun 7, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The polyamide resin of the present invention is a polyamide resin containing an amine group and a carboxyl group, wherein the amine group concentration is about 200 to 300 μeq/g and two to six times as high as the carboxyl group concentration. The polyamide resin has excellent long-thermal stability.

First claim

Opening claim text (preview).

The invention claimed is: 1. A polyamide resin containing an amine group and a carboxyl group, wherein the amine group is present at a concentration of about 200 to about 300 μeq/g, and the concentration of the amine group is about 2 to about 6 times the concentration of the carboxyl group, and tensile strength maintenance rate of the polyamide resin evaluated by compounding 35 parts by weight of a glass fiber (GF) with respect to 100 parts by weight of the polyamide resin is 45% or more. 2. The polyamide resin of claim 1 , wherein the polyamide resin is obtained by polymerizing (A) a dicarboxylic acid component comprising (a1) an aromatic dicarboxylic acid and (B) a diamine component comprising (b1) an aliphatic diamine. 3. The polyamide resin of claim 2 , wherein the aromatic dicarboxylic acid (a1) comprises at least one of aromatic dicarboxylic acids having 8 to 20 carbon atoms. 4. The polyamide resin of claim 2 , wherein the aliphatic diamine (b1) comprises at least one of aliphatic diamines having 4 to 20 carbon atoms. 5. The polyamide resin of claim 2 , wherein the dicarboxylic acid component (A) further comprises (a2) an amine group-containing dicarboxylic acid. 6. The polyamide resin of claim 5 , wherein the amine group-containing dicarboxylic acid (a2) is represented by the following Formula 1: wherein R 1 is a hydrogen atom, or a hydrocarbon group having 1 to 10 carbon atoms, and R 2 is a linear, branched or cyclic hydrocarbon group having 1 to 20 carbon atoms, unsubstituted or substituted with a substituent selected from the group consisting of a C 1 -C 10 alkyl group, C 6 -C 18 aryl group, halogen, and a combination thereof. 7. The polyamide resin of claim 5 , wherein the dicarboxylic acid component (A) includes the amine group-containing dicarboxylic acid (a2) in an amount of about 0.1 to about 30 mol %, based on the total amount of the dicarboxylic acid component (A). 8. The polyamide resin of claim 1 , wherein the polyamide resin has an end group capped with an end capping agent comprising at least one of an aliphatic carboxylic acid and/or an aromatic carboxylic acid. 9. The polyamide resin of claim 1 , wherein the polyamide resin has an intrinsic viscosity of about 0.6 to about 1.5 dL/g, as measured in a 25° C. sulfuric acid solution using an Ubbelohde viscometer. 10. The polyamide resin of claim 1 , wherein the polyamide resin has a glass transition temperature (Tg) of about 120° C. or higher. 11. The polyamide resin of claim 1 , wherein the polyamide resin has a melting temperature (Tm) of about 280 to about 320° C., and a crystallization temperature (Tc) of about 260 to about 280° C. 12. A molded article comprising the polyamide resin defined in claim 1 . 13. A method for preparing a polyamide resin, comprising: polymerizing (A) a dicarboxylic acid component comprising (a1) an aromatic dicarboxylic acid and (B) a diamine component comprising (b1) an aliphatic diamine so that an amine group in the resin is present at a concentration of about 200 to about 300 μeq/g, and the concentration of the amine group is about 2 to about 6 times the concentration of a carboxyl group, wherein tensile strength maintenance rate of the polyamide resin evaluated by compounding 35 parts by weight of a glass fiber (GF) with respect to 100 parts by weight of the polyamide resin is 45% or more. 14. The method of claim 13 , wherein the dicarboxylic acid component (A) further comprises (a2) an amine group-containing dicarboxylic acid in an amount of about 0.1 to about 30 mol %, based on the total amount of the dicarboxylic acid component (A).

Assignees

Inventors

Classifications

  • Preparatory processes · CPC title

  • C08G69/265Primary

    from at least two different diamines or at least two different dicarboxylic acids · CPC title

  • Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

  • Manufacture of articles or shaped materials containing macromolecular substances (manufacture of semi-permeable membranes B01D67/00 - B01D71/00) · CPC title

  • Polymers modified by chemical after-treatment · CPC title

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Frequently asked questions

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What does patent US9359476B2 cover?
The polyamide resin of the present invention is a polyamide resin containing an amine group and a carboxyl group, wherein the amine group concentration is about 200 to 300 μeq/g and two to six times as high as the carboxyl group concentration. The polyamide resin has excellent long-thermal stability.
Who is the assignee on this patent?
Cheil Ind Inc
What technology area does this patent fall under?
Primary CPC classification C08G69/265. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 07 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).