Low-temperature sealing glass frit and method for preparing composite filler in glass frit

Patent metadata

Field	Value
Publication number	US-9359248-B1
Application number	US-201514686564-A
Country	US
Kind code	B1
Filing date	Apr 14, 2015
Priority date	Dec 26, 2014
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

The invention discloses a lower-temperature sealing glass frit and a method for preparing a composite filler in the glass frit. The lower-temperature sealing glass frit includes a glass powder and a negative thermal expansion composite filler with an adjustable thermal expansion coefficient. The thermal expansion coefficient of the low-temperature sealing glass frit into which the composite material and the glass powder is mixed can be adjustable so that the thermal expansion coefficient of the low-temperature sealing glass frit can match the thermal expansion coefficient of glass substrates packaging an OLED device to thereby improve the yield of the packaged OLED device.

First claim

What is claimed is:

1. A glass frit comprising:
a glass powder; and
a negative thermal expansion composite filler including a plurality of composite materials and having an adjustable thermal expansion coefficient to be selected from a plurality of thermal expansion coefficients corresponding to preset composition ratios among the plurality of composite materials when the composite materials are mixed to form the negative thermal expansion composite filler.

2. The glass frit according to claim 1 , wherein the thermal expansion coefficient of the composite filler is adjustable in a range of −8.7×10 −6 /° C. to 0/° C.

3. The glass frit according to claim 1 , wherein the composite filler is a composite filler resulting from a chemical reaction of a mixture of an isotropic negative thermal expansion material and a zero thermal expansion material at high temperature.

4. The glass frit according to claim 3 , wherein the isotropic negative thermal expansion material is zirconium tungstate, and the zero thermal expansion material is silicon dioxide.

5. A glass frit, comprising:
a glass powder; and
a negative thermal expansion composite filler having an adjustable thermal expansion coefficient,
wherein the composite filler is a composite filler resulting from a chemical reaction of a mixture of an isotropic negative thermal expansion material and a zero thermal expansion material at high temperature; and
wherein the mixture further comprises at least one of cordierite and eucryptite.

6. The glass frit according to claim 5 , wherein the composite filler comprises at least one of a zirconium tungstate and silicon dioxide composite phase, a zirconium tungstate and cordierite composite phase, or a zirconium tungstate and eucryptite composite phase.

7. The glass frit according to claim 1 wherein a mass fraction of the composite filler is in a range from 10% to 40%, and a mass fraction of the glass powder is in a range from 60% to 90%.

8. The glass frit according to claim 2 , wherein a mass fraction of the composite filler is in a range from 10% to 40%, and a mass fraction of the glass powder is in a range from 60% to 90%.

9. The glass frit according to claim 3 , wherein a mass fraction of the composite filler is in a range from 10% to 40%, and a mass fraction of the glass powder is in a range from 60% to 90%.

10. The glass frit according to claim 4 , wherein a mass fraction of the composite filler is in a range from 10% to 40%, and a mass fraction of the glass powder is in a range from 60% to 90%.

11. The glass frit according to claim 5 , wherein a mass fraction of the composite filler is in a range from 10% to 40%, and a mass fraction of the glass powder is in a range from 60% to 90%.

12. The glass frit according to claim 6 , wherein a mass fraction of the composite filler is in a range from 10% to 40%, and a mass fraction of the glass powder is in a range from 60% to 90%.

13. The glass frit according to claim 1 , further comprising oxide components comprising one or more of V 2 O 5 , TeO 2 , Fe 2 O 3 , Co 2 O 3 , TiO 2 , ZrO 2 , ZnO and K 2 O.

14. The glass frit according to claim 2 , further comprising oxide components comprising one or more of V 2 O 5 , TeO 2 , Fe 2 O 3 , Co 2 O 3 , TiO 2 , ZrO 2 , ZnO and K 2 O.

15. The glass frit according to claim 3 , further comprising oxide components comprising one or more of V 2 O 5 , TeO 2 , Fe 2 O 3 , Co 2 O 3 , TiO 2 , ZrO 2 , ZnO and K 2 O.

16. The glass frit according to claim 4 , further comprising oxide components comprising one or more of V 2 O 5 , TeO 2 , Fe 2 O 3 , Co 2 O 3 , TiO 2 , ZrO 2 , ZnO and K 2 O.

17. The glass frit according to claim 5 , further comprising oxide components comprising one or more of V 2 O 5 , TeO 2 , Fe 2 O 3 , Co 2 O 3 , TiO 2 , ZrO 2 , ZnO and K 2 O.

18. The glass frit according to claim 6 , further comprising oxide components comprising one or more of V 2 O 5 , TeO 2 , Fe 2 O 3 , Co 2 O 3 , TiO 2 , ZrO 2 , ZnO and K 2 O.

19. The glass frit according to claim 1 , wherein a thermal expansion coefficient of the glass frit is adjustable in a range of 3×10 −6 /° C. to 10×10 −6 /° C.

20. A method for preparing a composite filler used in a low-temperature sealing glass frit comprising a glass powder, wherein the composite filler is a negative thermal expansion composite filler with an adjustable thermal expansion coefficient, the method comprising:
preparing a mixed wet raw material from a zirconium tungstate and a silicon dioxide at preset volume fractions resolved in an organic solvent through physical deposition; or
preparing a mixed wet raw material from a zirconium tungstate and a silicon dioxide at preset volume fractions, and at least one of cordierite and eucryptite resolved in the organic solvent through physical deposition; and
pre-sintering the mixed wet raw material at a first preset temperature for 4 to 6 hours; and then sintering the mixed wet raw material at a second preset temperature for 1 to 3 hours into the composite filler, wherein the first preset temperature is in a range from 400° C. to 700° C., and the second preset temperature is in a range from 1000° C. to 1200° C.

Assignees

• Shanghai Tianma Am Oled Co Ltd
• Tianma Micro Electronics Co Ltd

Inventors

• Li Dandan

Classifications

• C03C8/24 Primary

  Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders · CPC title

• C03C8/20

  containing titanium compounds; containing zirconium compounds · CPC title

• C08K2003/2244

  of zirconium · CPC title

• C08K2003/2265

  of iron · CPC title

• C08K2003/222

  Magnesia, i.e. magnesium oxide · CPC title