Electromagnetically compatible housing device
US-2024023301-A1 · Jan 18, 2024 · US
US9357661B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9357661-B2 |
| Application number | US-201013516756-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 17, 2010 |
| Priority date | Dec 17, 2009 |
| Publication date | May 31, 2016 |
| Grant date | May 31, 2016 |
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A module unit includes a receiving element formed from an extrusion profile and configured to receive at least one circuit board. The receiving element includes at least two recesses. Two lateral elements are each configured to be received in a respective one of the at least two recesses so as to fasten the lateral elements to the receiving element by latching.
Opening claim text (preview).
The invention claimed is: 1. A module unit, comprising: a receiving element formed from an extrusion profile that extends in a longitudinal direction, the receiving element including a base plate, the receiving element including a first and a second holding element that extend in the longitudinal direction and are respectively disposed on opposite sides of the base plate, the first holding element including a first insertion groove that extends in the longitudinal direction and is configured to receive a first edge region of at least one circuit board and the second holding element including a second insertion groove that extends in the longitudinal direction and is configured to receive a second, opposite edge region of the at least one circuit board so as to dispose the at least one circuit board between the first and second holding elements, the base plate including a web element and at least two recesses formed into the web element; and first and second lateral elements each including a guide element and a latching mechanism disposed in a region of the guide element, the latching mechanisms each being configured to be received in a respective one of the at least two recesses so as to latch the lateral elements to the receiving element, wherein at least one of the two lateral elements includes an opening. 2. The module unit according to claim 1 , wherein the lateral elements are pushable onto the web element by means of the guide elements. 3. The module unit according to claim 1 , further comprising at least one fastening element configured to fasten the at least one circuit board on the receiving element. 4. The module unit according to claim 1 , further comprising at least one potential earth contact element. 5. The module unit according to claim 1 , further comprising a foot element configured to fasten at least one of the receiving element and one of the two lateral elements on a support rail. 6. A method for producing the receiving element for the module unit of claim 1 , comprising: providing the extrusion profile; and cutting the extrusion profile to a length of the receiving element and, simultaneously with the cutting, providing the receiving element with the recesses. 7. The method according to claim 6 , wherein the cutting is performed using a main saw blade of a saw device and the providing the receiving element with the recesses is performed at one end of the receiving element being cut and at a starting end of a next receiving element to be cut using two additional saw blades of the saw device. 8. A module unit, comprising: a receiving element formed from an extrusion profile that extends in a longitudinal direction, the receiving element including a base plate, the receiving element including a first and a second holding element that extend in the longitudinal direction and are respectively disposed on opposite sides of the base plate, the first holding element including a first insertion groove that extends in the longitudinal direction and is configured to receive a first edge region of at least one circuit board and the second holding element including a second insertion groove that extends in the longitudinal direction and is configured to receive a second, opposite edge region of the at least one circuit board so as to dispose the at least one circuit board between the first and second holding elements, the base plate including a web element and at least two recesses formed into the web element; and first and second lateral elements each including a guide element and a latching mechanism disposed in a region of the guide element, the latching mechanisms each being configured to be received in a respective one of the at least two recesses so as to latch the lateral elements to the receiving element, wherein the at least one circuit board includes at least a first circuit board and a second circuit board, wherein the holding elements are each configured to surround, in a U-shape, one of two opposing lateral regions of the first circuit board and to support one of two mutually opposing lateral regions of the second circuit board. 9. The module unit according to claim 8 , wherein each of the two holding elements include at least one hollow chamber profile configured to receive a respective rib element disposed on one of the lateral elements. 10. A module unit, comprising: a receiving element formed from an extrusion profile that extends in a longitudinal direction, the receiving element including a base plate, the receiving element including a first and a second holding element that extend in the longitudinal direction and are respectively disposed on opposite sides of the base plate, the first holding element including a first insertion groove that extends in the longitudinal direction and configured to receive a first edge region of at least one circuit hoard and the second holding element including a second insertion groove that extends in the longitudinal direction and is configured to receive a second, opposite edge region of the at least one circuit board so as to dispose the at least one circuit board between the first and second holding elements, the base plate including a web element and at least two recesses formed into the web element; and first and second lateral elements each including a guide element and a latching mechanism disposed in a region of the guide element, the latching mechanisms each being configured to be received in a respective one of the at least two recesses so as to latch the lateral elements to the receiving element, further comprising at least one fastening element configured to fasten the at least one circuit board on the receiving element, wherein the at least one circuit board includes a through-opening and the at least one fastening element includes a holding element, the at least one fastening element being guidable through the through-opening and fastenable to the at least one circuit board, by means of the holding element, by a rotational movement of the at least one fastening element on a surface of the at least one circuit board.
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