Method for solderless electrical press-fit contacting of electrically conductive press-fit pins in circuit boards

Patent metadata

Field	Value
Publication number	US-9357656-B2
Application number	US-201414283989-A
Country	US
Kind code	B2
Filing date	May 21, 2014
Priority date	May 22, 2013
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

A method for solderless electrical press-fit contacting of electrically conductive press-fit pins in circuit boards include: providing a circuit board having a thickness, at least one electrical conductor path, and a contacting opening guided perpendicularly through the circuit board and having a metallized inner wall; providing an electrically conductive press-fit pin having a longitudinal axis and having a press-fit region suitable for press-fitting into the contacting opening and having a substantially round cross section; and press-fitting the press-fit pin into the contacting opening by applying onto the press-fit pin a force acting along the longitudinal axis of the press-fit pin, press-fitting being assisted by the application of ultrasound acting on the press-fit pin.

First claim

What is claimed is:

1. A method for solderless electrical press-fit contacting of at least one electrically conductive press-fit pin in a circuit board, comprising:
providing a circuit board having a specified thickness, at least one electrical conductor path, and at least one contacting opening guided perpendicularly through the circuit board, the contacting opening being provided for electrical press-fit contacting of the press-fit pin, and wherein the contacting opening has a metallized inner wall;
providing at least one electrically conductive press-fit pin having a longitudinal axis and a press-fit region suitable for press-fitting into the contacting opening, the press-fit region having a substantially round cross section;
press-fitting the press-fit pin into the contacting opening by applying onto the press-fit pin a force acting along the longitudinal axis of the press-fit pin;
wherein the contacting opening has a shape which deviates from a round shape and has a first inside diameter and a second inside diameter, the second inside diameter being smaller than the first inside diameter, the ratio of the first inside diameter to the second inside diameter being greater than 1.2, and wherein the press-fit region of the press-fit pin has, along a longitudinal axis of the press-fit pin over an axial length of at least 50% of the thickness of the circuit board, an outside diameter which (i) exceeds the second inside diameter of the contacting opening before press-fitting of the press-fit pin, and (ii) is smaller than the first inside diameter.

2. The method for solderless electrical press-fit contacting as recited in claim 1 , wherein the press-fit pin is one of elastically or permanently deformable in a radial direction.

3. The method for solderless electrical press-fit contacting as recited in claim 1 , wherein the electrical contact between the press-fit pin and the inner wall of the contacting opening has, after press-fitting, an electrical contact resistance of less than 50 μohm.

4. The method for solderless electrical press-fit contacting as recited in claim 1 , wherein a component having a plurality of press-fit pins is provided, the plurality of press-fit pins being disposed in at least one row, and wherein the circuit board has multiple contacting openings which correspond at least to the number of press-fit pins of the component, the first inside diameter of the contacting openings being disposed respectively in the extension direction of the at least one row of press-fit pins.

5. The method for solderless electrical press-fit contacting as recited in claim 1 , wherein the at least one press-fit pin is press-fitted obliquely into the contacting opening at an angle of between 10° and 80° with respect to a direction extending perpendicular to the circuit board.

6. The method for solderless electrical press-fit contacting as recited in claim 1 , wherein the metallization of the inner wall of the at least one contacting opening has at least 25 μm of copper at every point.

7. The method for solderless electrical press-fit contacting as recited in claim 1 , wherein the top-most layer of the metallization of the at least one contacting opening is made of tin.

8. The method for solderless electrical press-fit contacting as recited in claim 1 , wherein the at least one contacting opening is expanded by press-fitting, the second inside diameter of the at least one contacting opening being at least locally enlarged by at most 100 μm.

9. The method for solderless electrical press-fit contacting as recited in claim 1 , wherein press-fitting is assisted by application of ultrasound acting on the press-fit pin.

10. The method for solderless electrical press-fit contacting as recited in claim 9 , wherein as a result of the application of ultrasound upon press-fitting, a friction weld is produced at least locally between an outer wall of the at least one press-fit pin and the inner wall of the at least one contacting opening.

Assignees

• Patzner Patrik
• Kaschube Carsten
• Gmelin Christoph
• Otto Andreas
• Reinhard Markus
• Wolf Ronny
• Bosch Gmbh Robert

Inventors

• Patzner Patrik
• Kaschube Carsten
• Gmelin Christoph
• Otto Andreas
• Reinhard Markus
• Wolf Ronny

Classifications

• H05K2201/10856

  Divided leads, e.g. by slot in length direction of lead, or by branching of the lead · CPC title

• H05K2201/10878

  Means for retention of a lead in a hole · CPC title

• H05K2203/0285

  Using ultrasound, e.g. for cleaning, soldering or wet treatment · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K3/308

  Adaptations of leads (connectors to printed circuits H01R12/00) · CPC title