Joined structural body of members, joining method of members, and package for containing an electronic component

Patent metadata

Field	Value
Publication number	US-9357644-B2
Application number	US-201414524282-A
Country	US
Kind code	B2
Filing date	Oct 27, 2014
Priority date	Oct 26, 2011
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

According to one embodiment, a joined structural body for mounting an electronic component on the body which is provided with a first member, a second member and a joining portion. The joining portion is provided between the first member and the second member so as to connect the first member and the second member with each other mechanically. The joining portion contains at least one metal of a tin, an indium or a zinc, and a copper. The content of the metal in the joining portion decreases toward a side of at least one of the first member and the second member, and the content of the copper in the joining portion increases in the same direction as the decreasing direction of the content of the metal.

First claim

What is claimed is:

1. A package containing an electronic component, comprising:
a substrate on which an electronic component is mounted;
a frame body which surrounds a portion on which the electronic component is mounted, the frame body being joined mechanically with the substrate via a joining portion containing (1) at least one metal of a tin, an indium, or a zinc, and (2) a copper: and
feed through terminals for inputting a signal into the electronic component and for outputting a signal from the electronic component respectively,
wherein content of the at least one metal in the joining portion decreases toward a side of at least one of the substrate or the frame body, and content of the copper in the joining portion increases in a same direction as the decreasing direction of the content of the at least one metal, and
wherein the joining portion includes a first joining portion and a second joining portion, and the substrate and the feed through terminals are joined together via the first joining portion, and the frame body and the feed through terminals are joined together via the second joining portion.

2. The package according to claim 1 , wherein
the content of the metal decreases toward both sides of the substrate and the frame body, and
the content of the copper increases toward both sides of the substrate the frame body.

3. The package according to claim 1 , wherein the joining portion includes a first layer containing a copper which is provided on aside of the substrate, and a second layer containing a copper which is provided on a side of the frame body.

4. The package according to claim 1 , wherein the joining portion contains at least one of a gold or a platinum.

5. The package according to claim 1 , wherein at least one metal of tin, indium, or zinc and copper contained in the joining portion form a solid solution containing an a solid solution.

6. The package according to claim 1 , wherein the at least one metal is tin and the weight percentage of tin is less than or equal to 15.

7. The package according to claim 1 , wherein the weight percentage of tin is 10.

8. The package according to claim 1 , wherein the frame body contains iron.

9. The package according to claim 1 , wherein the frame body is an alloy containing iron, nickel, and cobalt.

10. The package according to claim 1 , wherein the substrate contains copper and the first joining portion is formed on the substrate.

Assignees

• Toshiba Kk

Inventors

• Takagi Kazutaka

Classifications

• H10W90/755

  between a chip and a laterally-adjacent insulating package substrate, interpose or RDL · CPC title

• H10W72/07554

  changes in dispositions · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W44/20

  at high-frequency [HF] or radio frequency [RF] · CPC title

• H10W76/134 Primary

  having other interconnections parallel to the conductive base · CPC title