Microfluidic delivery member with filter and method of forming same

Patent metadata

Field	Value
Publication number	US-9357635-B2
Application number	US-201514981056-A
Country	US
Kind code	B2
Filing date	Dec 28, 2015
Priority date	Jun 20, 2014
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instances, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.

First claim

The invention claimed is:

1. A method comprising:
applying adhesive material to a first surface of a printed circuit board strip;
securing a plurality of filters to the first surface of the printed circuit board strip using the adhesive material, the plurality of filters covering a plurality of through holes, respectively, in the printed circuit board;
applying adhesive material to a second surface of the printed circuit board strip; and
securing a plurality of semiconductor dice to the second surface of the printed circuit board strip, the plurality of semiconductor dice covering the plurality of through holes, respectively, the plurality of semiconductor dice including an inlet path in fluid communication with the plurality of through holes, respectively, and having nozzles for expelling a fluid.

2. The method of claim 1 , further comprising forming the plurality of through holes in the printed circuit board strip.

3. The method of claim 1 , wherein securing the plurality of filters comprises attaching the filters and exposing the adhesive material to heat or ultraviolet radiation to set the adhesive material.

4. The method of claim 1 , wherein the applying the adhesive material comprises using a screen printing technique to apply the adhesive material.

5. The method of claim 1 , further comprising placing mechanical spacers between the filters and the first surface of the printed circuit board strip.

6. The method of claim 5 , wherein placing the mechanical spacers comprises forming a solder mask layer on the printed circuit board strip, the solder mask layer including a raised portion around each through hole for forming the mechanical spacers.

7. The method of claim 1 , further comprising separating the printed circuit board strip into a plurality of microfluidic delivery members.

8. The method of claim 1 , wherein each filter is a stainless steel mesh.

9. A method comprising:
forming a through hole in a printed circuit board, the through hole extending from a first surface of the printed circuit board to a second surface of the printed circuit board;
coupling a filter to the first surface of the printed circuit board over the through hole; and
coupling a semiconductor die to the filter, the semiconductor die including an inlet path, wherein upon coupling the filter and coupling the semiconductor die, the inlet path of the semiconductor die is located over the through hole in the printed circuit board.

10. The method of claim 9 , wherein the step of coupling the semiconductor die to the filter occurs before the step of coupling the filter to the first surface of the printed circuit board.

11. The method of claim 9 , wherein coupling the filter comprises using an adhesive material to couple the filter to the first surface of the printed circuit board.

12. The method of claim 11 , further comprising applying adhesive to at least one of the filter and the first surface of the printed circuit board for coupling the filter to the first surface of the printed circuit board.

13. The method of claim 9 , forming a liner on inner surfaces of the through hole of the printed circuit board.

14. The method of claim 13 , wherein the liner is a polymer.

15. A method comprising:
coupling a liner to surfaces of a through hole in the printed circuit board;
coupling a filter to a first surface of the printed circuit board over the through hole; and
coupling a semiconductor die to a second surface of the printed circuit board, the semiconductor die including an inlet path that covers the through hole of the printed circuit board, the semiconductor die further including a plurality of nozzles in fluid communication with the inlet path.

16. The method of claim 15 , wherein coupling the liner to surfaces of the through hole in the printed circuit board further comprising coupling the liner on a portion of the first and second surfaces of the printed circuit board.

17. The method of claim 16 , wherein the liner on the first surface of the printed circuit board is used to couple the semiconductor die to the second surface of the printed circuit board.

18. The method of claim 15 , wherein the filter is coupled so that a surface of the filter is spaced apart from the first surface of the printed circuit board.

19. The method of claim 15 , wherein adhesive material is used to couple the filter to the first surface of the printed circuit board and to couple the semiconductor die to the second surface of the printed circuit board.

20. The method of claim 15 , further comprising forming the through hole in the printed circuit board.

Assignees

• St Microelectronics Inc
• St Microelectronics Srl
• St Microelectronics Asia

Inventors

• Dodd Simon
• Scheffelin Joe
• Gruenbacher Dana
• Brioschi Roberto
• Neo Teck Khim
• Hunt Dave
• Sherman Faiz

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title