Automated interface apparatus and method for use in semiconductor wafer handling systems

Patent metadata

Field	Value
Publication number	US-9356822-B2
Application number	US-201213664349-A
Country	US
Kind code	B2
Filing date	Oct 30, 2012
Priority date	Oct 30, 2012
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

Aspects of the present disclosure describe a smart docking station. The smart docking station may contain a data transfer and an electrical connection which allow a sensor wafer to be charged and to upload and download data. The smart docking station may be located at an off-track storage position above a tool. This location enables an automated materials handling system (AMHS) to retrieve the sensor wafer and deliver it to a tool requiring analysis. The sensor wafer may be stored in a smart front opening unified pod (FOUP). It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

First claim

What is claimed is:

1. In a docking station configured to operate on a network, a method for characterizing a process in a tool, comprising:
a) receiving a sensor wafer from a robotic wafer delivery system at a docking station located at an off-track storage location that is above floor level and separate from the tool and adjacent to a pathway used by an automated material handling system (AMHS) and accessible by the AMHS, wherein a memory in the sensor wafer has one or more sets of data from a tool process characterization mission;
b) establishing a data connection between the docking station and the sensor wafer;
c) downloading the one or more sets of data from the memory in the sensor wafer; and
d) delivering the downloaded data over the network to a server, wherein the docking station is a separate unit from a wafer carrier that houses the sensor wafer during transportation, via the AMHS, of the sensor wafer from the docking station to a tool or from a tool to the docking station.

2. The method of claim 1 , wherein the docking station is located within a tool.

3. The method of claim 2 , wherein the robotic wafer delivery system is comprised of the AMHS and a wafer transporting robot.

4. The method of claim 1 , wherein the off-track storage location is above the tool.

5. The method of claim 4 , wherein the AMHS includes an overhead track (OHT) system.

6. The method of claim 1 , wherein the wafer carrier is a front opening unified pod (FOUP), wherein the sensor wafer is housed inside of the FOUP during said transportation of the sensor wafer from the docking station to a tool or from a tool to the docking station, and wherein the FOUP can transfer data to and/or from the memory in the sensor wafer over a data contact.

7. The method of claim 6 , wherein the FOUP is configured to transfer data wirelessly to or from the server without having to use a docking station to provide a conduit for the data.

8. The method of claim 1 , further comprising establishing an electrical connection between the docking station and the sensor wafer, wherein the electrical connection is configured to provide a charge to a battery in the sensor wafer.

9. The method of claim 8 , wherein the electrical connection and the data connection are the same connection.

10. The method of claim 8 , wherein the electrical connection and the data connection are made with a single USB connection.

11. The method of claim 1 , further comprising, receiving a mission over the network from a factory automation server and delivering the mission to the sensor wafer, wherein the mission instructs the sensor wafer to collect one or more sets of data during a process characterization operation in a tool.

12. The method of claim 10 , further comprising delivering the sensor wafer to the robotic wafer delivery system.

13. The method of claim 1 , wherein the server is a sensor wafer server.

14. The method of claim 1 , wherein the server is a factory automation server.

15. A non-transitory computer readable medium containing program instructions for characterizing a process in a tool, and wherein execution of the program instructions by one or more processors of a computer system causes the one or more processors to carry out the steps of:
a) receiving a sensor wafer from a robotic wafer delivery system at a docking station located at an off-track storage location that is above floor level and separate from the tool and adjacent to a pathway used by an automated material handling system (AMHS) and accessible by the AMHS, wherein a memory in the sensor wafer has one or more sets of data from a tool process characterization mission;
b) establishing a data connection between the docking station and the sensor wafer;
c) downloading the one or more sets of data from the memory in the sensor wafer; and
d) delivering the downloaded data over the network to a server, wherein the docking station is a separate unit from a wafer carrier that houses the sensor wafer during transportation, via the AMHS, of the sensor wafer from the docking station to a tool or from a tool to the docking station.

16. A docking station for a sensor wafer, configured to operate on a network, comprising:
a processor;
a memory coupled to the processor; and
one or more instructions embodied in memory for execution by the processor, the instructions being configured to characterize a process in a tool, the method comprising:
a) receiving a sensor wafer from a robotic wafer delivery system at a docking station located at an off-track storage location that is above floor level and separate from the tool and adjacent to a pathway used by an automated material handling system (AMHS) and accessible by the AMHS, wherein a memory in the sensor wafer has one or more sets of data from a tool process characterization mission;
b) establishing a data connection between the docking station and the sensor wafer;
c) downloading the one or more sets of data from the memory in the sensor wafer; and
d) delivering the downloaded data over the network to a server, wherein the docking station is a separate unit from the wafer carrier that houses the sensor wafer during transportation, via the AMHS, of the sensor wafer from the docking station to a tool or from a tool to the docking station.

17. A docking station configured to operate over a network comprising:
a support structure configured to support a sensor wafer, wherein the support structure is further configured to receive the sensor wafer from a robotic wafer delivery system; and
a docking interface configured to interface with the sensor wafer, wherein the docking interface comprises a data connection configured to download one or more sets of data from a tool process characterization mission stored in a memory in the sensor wafer to the docking station, and wherein the docking station is further configured to deliver the one or more sets of data downloaded from the sensor wafer to a server over the network, wherein the docking station is located at an off-track storage location that is above floor level and separate from the tool and adjacent to a pathway used by an automated material handling system (AMHS) and accessible by the AMHS, wherein the docking station is a separate unit from a wafer carrier that houses the sensor wafer during transportation, via the AMHS, of the sensor wafer from the docking station to a tool or from a tool to the docking station.

18. The docking station of claim 17 , wherein the off-track storage location is above the tool.

19. The docking station of claim 17 , wherein the docking interface further comprises an electrical connection configured to charge a battery in the sensor wafer.

20. The docking station of claim 19 , wherein the electrical connection and the data connection are the same connection.

21. The docking station of claim 19 , wherein the electrical connection and the data connection are made with a single USB connection.

22. The docking station of claim 17 , wherein the wafer carrier is a front opening unified pod (FOUP) and the sensor wafer is housed inside of the FOUP during said transportation of the sensor wafer from the docking station to a tool or from a tool to the docking station.

23. The docking station of claim 17 , wherein the AMHS includes an overhead track (OHT) system.

24. The docking station of claim 17 , wherein the docking interface further comprises an electrical connection configured to charge a battery in the s

Assignees

• Jensen Earl
• Kla Tencor Corp

Inventors

• Jensen Earl

Classifications

• Y10S901/50

  Miscellaneous · CPC title

• H04L67/34 Primary

  involving the movement of software or configuration parameters  (network booting or remote initial program loading [RIPL] G06F9/4416) · CPC title

• G05B19/41865

  characterised by job scheduling, process planning, material flow · CPC title

• G05B2219/45031

  Manufacturing semiconductor wafers · CPC title

• H04L67/12

  specially adapted for proprietary or special-purpose networking environments, e.g. medical networks, sensor networks, networks in vehicles or remote metering networks · CPC title