Package of light emitting diode with heat sink

Patent metadata

Field	Value
Publication number	US-9356005-B2
Application number	US-201514722763-A
Country	US
Kind code	B2
Filing date	May 27, 2015
Priority date	May 29, 2014
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

Disclosed herein is a light emitting diode (LED) package. The present invention is directed to a light emitting diode (LED) package capable of efficiently dissipating heat generated from LEDs. The present invention is also directed to a LED package in which a plurality of LEDs are disposed and heat generated from the plurality of LEDs is efficiently dissipated.

First claim

What is claimed is:

1. A light emitting diode (LED) package comprising:
a light emitting device including:
a conductive substrate including an upper surface having a first plane and a second plane stepped from the first plane and having a length in a first direction and a width in a second direction perpendicular to the first direction;
a first insulating layer formed on the first plane;
a first electrode layer spaced apart from the second plane and disposed on the first insulating layer; and
an LED disposed on the second plane and including a first electrode and a second electrode electrically connected to the first electrode layer and the conductive substrate, respectively;

a heat sink formed by a first surface facing the first electrode layer, a second surface facing a lower surface of the conductive substrate, which faces the upper surface, and parallel with the first surface, and a bottom surface connecting the first surface to the second surface and having a length in the first direction and a width in a third direction perpendicular to the first direction, and including a receiving groove into which at least a portion of the light emitting device is inserted;
a second electrode layer disposed on the bottom surface and being in contact with a side surface which connects the upper surface of the conductive substrate to the lower surface thereof to be electrically connected to the conductive substrate; and
a third electrode layer disposed on the first surface and being in contact with the first electrode layer.

2. The LED diode package of claim 1 , further comprising:
a fourth electrode layer disposed on a lower surface of the heat sink which faces the bottom surface, and electrically connected to the second electrode layer; and
a fifth electrode layer disposed on the lower surface of the heat sink while being spaced apart from the fourth electrode layer, and electrically connected to the third electrode layer.

3. The LED diode package of claim 2 , wherein the second electrode layer is disposed along the first direction, and an edge of the second electrode layer parallel with the third direction is connected to an edge of the fourth electrode layer parallel with the third direction.

4. The LED diode package of claim 2 , wherein the third electrode layer is disposed along the first direction, and an edge of the third electrode layer parallel with the first direction is connected to an edge of the fifth electrode layer parallel with the first direction.

5. The LED diode package of claim 2 , wherein the third electrode layer is disposed on a specific area of the first surface along the first direction, and an edge of the third electrode layer parallel with the first direction is connected to an edge of the fifth electrode layer parallel with the first direction.

6. The LED diode package of claim 1 , wherein the first plane extends from a first edge of the upper surface of the conductive substrate along the second direction, and the second plane extends from a second edge of the upper surface which faces the first edge along a direction opposite the second direction, and a width of the first plane along the first direction is smaller than that of the second plane along the first direction.

7. The LED diode package of claim 1 , wherein the first plane extends from a third edge of the upper surface of the conductive substrate along the first direction, and the second plane extends from a fourth edge of the upper surface which faces the third edge in a direction opposite the first direction, and a width of the first plane along the first direction is smaller than that of the second plane along the first direction.

8. The LED diode package of claim 1 , wherein one or more protrusions formed on a second surface of the receiving groove are received in one or more grooves formed in a lower surface of the conductive substrate, and the lower surface of the conductive substrate faces the second surface of the receiving groove.

9. The LED diode package of claim 1 , further comprising an adhesive layer interposed between a second surface of the receiving groove and a lower surface of the conductive substrate, which couples the conductive substrate to the heat sink.

10. The LED diode package of claim 1 , wherein the second plane protrudes from the first plane.

11. The LED diode package of claim 1 , wherein the conductive substrate includes one or more materials selected from the group consisting of copper, aluminum, a copper alloy, and an aluminum alloy.

12. The LED diode package of claim 1 , wherein the first insulating layer includes an organic insulating material or an inorganic insulating material.

13. The LED diode package of claim 1 , wherein an area of the first insulating layer is greater than that of the first electrode layer.

14. An LED package comprising:
a light emitting device including:
a conductive substrate including an upper surface having a first plane and a second plane stepped from the first plane and having a length in a first direction and a width in a second direction perpendicular to the first direction;
a first insulating layer formed on the first plane;
a first electrode layer spaced apart from the second plane and disposed on the first insulating layer; and
a plurality of LEDs spaced apart from each other on the second plane along the first direction, and each including a first electrode and a second electrode electrically connected to the first electrode layer and the conductive substrate, respectively;

a heat sink formed by a first surface facing the first electrode layer, a second surface facing a lower surface of the conductive substrate, which faces the upper surface, and parallel with the first surface, and a bottom surface connecting the first surface to the second surface and having a length in the first direction and a width in a third direction perpendicular to the first direction, and including a receiving groove into which at least a portion of the light emitting device is inserted;
a second electrode layer disposed on the bottom surface and being in contact with a side surface which connects the upper surface of the conductive substrate to the lower surface thereof to be electrically connected to the conductive substrate; and
a third electrode layer disposed on the first surface and being in contact with the first electrode layer.

15. The LED diode package of claim 14 , further comprising:
a fourth electrode layer disposed on a lower surface of the heat sink which faces the bottom surface, and electrically connected to the second electrode layer; and
a fifth electrode layer disposed on the lower surface of the heat sink while being spaced apart from the fourth electrode layer, and electrically connected to the third electrode layer.

16. The LED diode package of claim 15 , wherein the second electrode layer is disposed along the first direction, and an edge of the second electrode layer parallel with the third direction is connected to an edge of the fourth electrode layer parallel with the third direction.

17. The LED diode package of claim 15 , wherein the third electrode layer is disposed along the first direction, and an edge of the third electrode layer parallel with the first direction is connected to an edge of the fifth electrode layer parallel with the first direction.

18. The LED diode package of claim 14 , wherein the first plane extends from a first edge of the upper surface of the conductive substrate along the second direction, and the second plane extends from a second edge of the upper surface which

Assignees

• Univ Sungkyunkwan Res & Bus

Inventors

• Suh Su-Jeong
• Park Hwa-Sun
• Park Jung-Kab
• Kim Tae-Yoo
• Cho Young-Lae
• Lee Mi-Ri
• Shin Jin-Ha
• Son Hwa-Jin
• Lee Jung-Woo

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/8585

  being an interconnection · CPC title

• H10H20/8582

  characterised by their shape · CPC title

• H10H20/8581

  characterised by their material · CPC title

• H10H20/8506

  Containers · CPC title