Adhesive transfer

Patent metadata

Field	Value
Publication number	US-9355834-B2
Application number	US-201114117773-A
Country	US
Kind code	B2
Filing date	Jul 28, 2011
Priority date	Jul 28, 2011
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

An adhesive transfer method includes depositing an adhesive on a first substrate, transferring a layer of the adhesive from the first substrate to an intermediate substrate, and transferring adhesive from the layer of the adhesive to at least one area of a second substrate.

First claim

What is claimed is:

1. An adhesive transfer method, comprising:
depositing an adhesive on a first substrate;
transferring a layer of the adhesive from the first substrate to an intermediate substrate; and
transferring adhesive from the layer of the adhesive to at least one area of a second substrate, wherein transferring adhesive from the layer of the adhesive to the at least one area of the second substrate comprises contacting at least one raised portion of the second substrate with the adhesive, transferring the adhesive to the at least one raised portion of the second substrate, and separating the intermediate substrate and the second substrate.

2. The method of claim 1 , wherein depositing the adhesive on the first substrate comprises spin coating the adhesive on the first substrate.

3. The method of claim 2 , further comprising:
before spin coating the adhesive on the first substrate, reducing a viscosity of the adhesive.

4. The method of claim 1 , further comprising:
after transferring the layer of the adhesive from the first substrate to the intermediate substrate, heating the intermediate substrate and the layer of the adhesive.

5. The method of claim 1 , further comprising:
at least one of before transferring adhesive from the layer of the adhesive to the at least one area of the second substrate and after transferring adhesive from the layer of the adhesive to the at least one area of the second substrate, reducing a tack of the adhesive.

6. The method of claim 1 , wherein transferring the layer of the adhesive from the first substrate to the intermediate substrate comprises contacting the adhesive with a surface of the intermediate substrate, transferring the layer of the adhesive to the surface of the intermediate substrate, and separating the intermediate substrate and the first substrate.

7. The method of claim 1 , wherein the second substrate comprises electronics.

8. The method of claim 1 , wherein the second substrate comprises a fluid passage.

9. The method of claim 1 further comprising partially cross-linking the layer of the adhesive on the intermediate substrate.

10. The method of claim 1 further comprising evaporating solvent from the layer of adhesive on the intermediate substrate.

11. A method of adhesive bonding, comprising:
coating a surface of a donor substrate with an adhesive;
transferring a layer of the adhesive from the donor substrate to a carrier substrate;
transferring adhesive of the layer of the adhesive from the carrier substrate to a patterned substrate; and
bonding the patterned substrate to another substrate with the adhesive transferred to the patterned substrate.

12. The method of claim 11 , wherein coating the surface of the donor substrate with the adhesive comprises spin coating the surface of the donor substrate with the adhesive.

13. The method of claim 12 , further comprising:
before spin coating the adhesive, diluting the adhesive with a solvent.

14. The method of claim 13 , further comprising:
after transferring the layer of the adhesive from the donor substrate to the carrier substrate, evaporating the solvent from the adhesive.

15. The method of claim 11 , further comprising:
at least one of before transferring adhesive of the layer of the adhesive from the carrier substrate to the patterned substrate and after transferring adhesive of the layer of the adhesive from the carrier substrate to the patterned substrate, partially cross-linking the adhesive.

16. The method of claim 11 , wherein transferring the layer of the adhesive from the donor substrate to the carrier substrate comprises pressing a surface of the carrier substrate against the adhesive of the donor substrate, transferring the layer of the adhesive to the surface of the carrier substrate, and removing the carrier substrate from the donor substrate.

17. The method of claim 11 , wherein transferring adhesive of the layer of the adhesive from the carrier substrate to the patterned substrate comprises contacting raised areas of the patterned substrate with the adhesive, transferring the adhesive to the raised areas of the patterned substrate, and removing the carrier substrate from the patterned substrate.

18. The method of claim 11 , wherein the patterned substrate comprises electronics.

19. The method of claim 11 , wherein the patterned substrate comprises a fluid passage.

Assignees

• Chen Chien-Hua
• Groh Michael G
• Hewlett Packard Development Co

Inventors

• Chen Chien-Hua
• Groh Michael G

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W72/07337

  using a polymer adhesive, e.g. an adhesive based on silicone or epoxy · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/01304

  using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title