Conductive liquid crystalline polymer composition

Patent metadata

Field	Value
Publication number	US-9355753-B2
Application number	US-201314052792-A
Country	US
Kind code	B2
Filing date	Oct 14, 2013
Priority date	Dec 5, 2012
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

A liquid crystalline polymer composition that is thermally and/or electrically conductive and has a reduced tendency to create a static electric charge during a molding operation is provided. More particularly, the composition contains carbon fibers distributed within a liquid crystalline polymer matrix. Through the use of carbon fibers having relatively high purity, high temperature sizing agent, and/or various process parameters, molded parts can be produced having excellent characteristics while minimizing the amount of carbon fibers contained within the polymer matrix.

First claim

What is claimed is:

1. A molded part that comprises a polymer composition, the polymer composition comprising carbon fibers distributed within a liquid crystalline polymer matrix that constitutes from about 25 wt. % to about 95 wt. % of the composition, wherein carbon fibers constitute from about 0.5 wt. % to about 20 wt. % of the composition, and wherein the molded part exhibits a surface resistivity of about 1×10 14 ohms or less as determined in accordance with IEC 60093, dielectric constant of about 5 or more as determined at a frequency of 10 MHz, and dissipation factor of about 1 or less as determined at a frequency of 10 MHz.

2. The molded part of claim 1 , wherein the liquid crystalline polymer matrix is formed from a polymer that contains aromatic ester repeating units that include aromatic dicarboxylic acid repeating units, aromatic hydroxycarboxylic acid repeating units, or a combination thereof.

3. The molded part of claim 2 , wherein the polymer further contains aromatic diol repeating units.

4. The molded part of claim 1 , wherein the carbon fibers have a carbon content of about 85 wt. % or more.

5. The molded part of claim 1 , wherein the carbon fibers have a density of from about 0.5 to about 3.0 g/cm 3 .

6. The molded part of claim 1 , wherein the carbon fibers have an average diameter of from about 0.5 to about 30 micrometers.

7. The molded part of claim 1 , further comprising glass fibers, particulate filler, or a combination thereof.

8. The molded part of claim 1 , further comprising a functional compound that includes an aromatic diol, aromatic carboxylic acid, hydrate, or a combination thereof.

9. The molded part of claim 1 , wherein the carbon fibers comprise a sizing agent, the sizing agent comprising an aromatic polymer.

10. The molded part of claim 8 , wherein the aromatic polymer has a thermal decomposition temperature of at least 350° C.

11. A compact camera module comprising the molded part of claim 1 .

12. The molded part of claim 1 , wherein the carbon fibers and liquid crystalline polymer matrix are melt processed within an extruder, and wherein the carbon fibers are supplied to the extruder at a location downstream from the feed section where the liquid crystalline polymer matrix is supplied.

13. The molded part of claim 1 , wherein the molded part exhibits a surface resistivity of from about 1×10 2 to about 1×10 8 ohms as determined in accordance with IEC 60093, dielectric constant of about 10 or more as determined at a frequency of 10 MHz, and dissipation factor of about 0.5 or less as determined at a frequency of 10 MHz.

Assignees

• Ticona Llc

Inventors

• Kim Young Shin

Classifications

• H01B1/24 Primary

  the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title

• H05K1/024

  Dielectric details, e.g. changing the dielectric material around a transmission line · CPC title

• C08K3/346

  Clay · CPC title

• C08L67/03

  the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings · CPC title

• C08K7/06

  Elements · CPC title