Method and apparatus for processing images
US-2015348453-A1 · Dec 3, 2015 · US
US9355348B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9355348-B2 |
| Application number | US-201314387222-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 21, 2013 |
| Priority date | Mar 22, 2012 |
| Publication date | May 31, 2016 |
| Grant date | May 31, 2016 |
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The present invention relates to a smart card comprising a card body and an electronic module placed within a recess of the card body and further comprising at least one colored layer placed between the electronic module and the bottom of the recess of the card body.
Opening claim text (preview).
The invention claimed is: 1. A smart card comprising a card body and an electronic module placed in a cavity of the card body, said electronic module comprising a microchip connected through connections with at least one electrical contact zone on the top of the cavity of the card body, and a protective resin in which said microchip and connections are coated, wherein the electronic module further comprises at least a coloured layer applied on the protective resin before placing the electronic module in the card body, so that a coloured coat is formed between the protective resin and the bottom of the cavity of the card body, said coloured coat being sufficiently opaque to reduce the visibility of the electronic module through the bottom of the card body. 2. The smart card according to claim 1 , wherein the colour of the at least one coloured coat is identical to the colour of the card body. 3. The smart card according to claim 1 , wherein at least one coloured coat is applied on the bottom of the recess of the card body. 4. The smart card according to claim 1 , wherein the at least one coloured coat is applied by means of ink printing. 5. A method for manufacturing a smart card comprising: providing a card body and an electronic module placed in a cavity of the card body, said electronic module comprising a microchip connected through connections with at least one electrical contact zone on the top of the cavity of the card body, and a protective resin in which said microchip and connections are coated, applying at least a coloured layer on said protective resin before placing the electronic module in the card body, so that a coloured coat is formed between the protective resin and the bottom of the cavity of the card body, said coloured coat being sufficiently opaque to reduce the visibility of the electronic module through the bottom of the card body. 6. The manufacturing method according to claim 5 , wherein the colour of the at least one coloured coat is identical to the colour of the card body. 7. The manufacturing method according to claim 5 , wherein at least one coloured coat is applied on the bottom of the recess of the card body. 8. The manufacturing method according to claim 5 , wherein the step of applying the at least one coloured coat is carried out by means of ink printing. 9. The manufacturing method according to claim 8 , wherein the ink printing step is carried out by stamping.
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
the interface being visual · CPC title
Mounting details of integrated circuit chips · CPC title
Constructional details, e.g. mounting of circuits in the carrier · CPC title
Assembling printed circuits with electric components, e.g. with resistors · CPC title
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