Smart card and method of production

US9355348B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9355348-B2
Application numberUS-201314387222-A
CountryUS
Kind codeB2
Filing dateMar 21, 2013
Priority dateMar 22, 2012
Publication dateMay 31, 2016
Grant dateMay 31, 2016

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a smart card comprising a card body and an electronic module placed within a recess of the card body and further comprising at least one colored layer placed between the electronic module and the bottom of the recess of the card body.

First claim

Opening claim text (preview).

The invention claimed is: 1. A smart card comprising a card body and an electronic module placed in a cavity of the card body, said electronic module comprising a microchip connected through connections with at least one electrical contact zone on the top of the cavity of the card body, and a protective resin in which said microchip and connections are coated, wherein the electronic module further comprises at least a coloured layer applied on the protective resin before placing the electronic module in the card body, so that a coloured coat is formed between the protective resin and the bottom of the cavity of the card body, said coloured coat being sufficiently opaque to reduce the visibility of the electronic module through the bottom of the card body. 2. The smart card according to claim 1 , wherein the colour of the at least one coloured coat is identical to the colour of the card body. 3. The smart card according to claim 1 , wherein at least one coloured coat is applied on the bottom of the recess of the card body. 4. The smart card according to claim 1 , wherein the at least one coloured coat is applied by means of ink printing. 5. A method for manufacturing a smart card comprising: providing a card body and an electronic module placed in a cavity of the card body, said electronic module comprising a microchip connected through connections with at least one electrical contact zone on the top of the cavity of the card body, and a protective resin in which said microchip and connections are coated, applying at least a coloured layer on said protective resin before placing the electronic module in the card body, so that a coloured coat is formed between the protective resin and the bottom of the cavity of the card body, said coloured coat being sufficiently opaque to reduce the visibility of the electronic module through the bottom of the card body. 6. The manufacturing method according to claim 5 , wherein the colour of the at least one coloured coat is identical to the colour of the card body. 7. The manufacturing method according to claim 5 , wherein at least one coloured coat is applied on the bottom of the recess of the card body. 8. The manufacturing method according to claim 5 , wherein the step of applying the at least one coloured coat is carried out by means of ink printing. 9. The manufacturing method according to claim 8 , wherein the ink printing step is carried out by stamping.

Assignees

Inventors

Classifications

  • between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

  • the interface being visual · CPC title

  • Mounting details of integrated circuit chips · CPC title

  • G06K19/077Primary

    Constructional details, e.g. mounting of circuits in the carrier · CPC title

  • Assembling printed circuits with electric components, e.g. with resistors · CPC title

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9355348B2 cover?
The present invention relates to a smart card comprising a card body and an electronic module placed within a recess of the card body and further comprising at least one colored layer placed between the electronic module and the bottom of the recess of the card body.
Who is the assignee on this patent?
Guijarro Sebastien, Laviron Thierry, Dossetto Lucile, and 1 more
What technology area does this patent fall under?
Primary CPC classification G06K19/07703. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue May 31 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).