Electronic apparatus

Patent metadata

Field	Value
Publication number	US-9354665-B2
Application number	US-201514615181-A
Country	US
Kind code	B2
Filing date	Feb 5, 2015
Priority date	Feb 26, 2014
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

An electronic apparatus includes a cover panel and a case, and at least a board disposed therebetween. A plurality of components are disposed on a board and have heights different from one another. A gap reduction member is disposed so as to face the plurality of components. Steps are formed on the gap reduction member in accordance with the heights of the plurality of components which faces the plurality of components to reduce breakage of a cover panel of the electronic apparatus.

First claim

What is claimed is:

1. An electronic apparatus, comprising:
a case;
a sapphire panel that includes an outer surface facing outwards from the case, and an inner surface, the case and the sapphire panel forming a housing;
a board that is disposed in the case;
a plurality of components that are disposed on the board facing a rear surface of the case, the plurality of components having a plurality of heights; and
a gap reduction member comprising a plurality of steps that are disposed so as to face the plurality of components, the plurality of steps having heights corresponding to the heights of the plurality of components,
wherein the gap reduction member is disposed in a space between the rear surface and the board, the space formed in part due to a difference between the heights of the plurality of components in a direction perpendicular to the board.

2. The electronic apparatus according to claim 1 , wherein the gap reduction member has a heat transfer coefficient greater than the heat transfer coefficient of the air.

3. The electronic apparatus according to claim 1 , wherein the gap reduction member has electric conductivity and is electrically connected to a ground level.

4. The electronic apparatus according to claim 1 , further comprising:
a battery that is disposed to be adjacent to the board.

5. The electronic apparatus according to claim 1 , wherein the plurality of components are disposed on a top surface of the board and on a rear surface of the board, wherein the gap reduction member comprises a first gap reduction member disposed between the sapphire panel and the board, and a second gap reduction member disposed between the board and the rear surface of the case.

6. The electronic apparatus according to claim 1 , wherein a top surface of the gap reduction member comprises members to provide a heat sink for the board.

7. The electronic apparatus according to claim 1 , wherein the gap reduction member extends beyond the board to provide support to the sapphire panel in areas of the housing that have gaps between components.

8. The electronic apparatus according to claim 1 , wherein the gap reduction member is co-fastened to a grounded member.

9. An electronic device comprising:
a housing;
a sapphire panel on a top surface of the housing;
a circuit board within the housing comprising a plurality of components with varying heights, the plurality of components facing a rear surface of the housing;
a gap reduction member disposed between the rear surface of the housing and the circuit board and having a first surface to match the varying heights of the plurality of components,
wherein the gap reduction member is disposed in a space between the rear surface of the housing and the circuit board, the space formed in part due to a difference between the heights of the plurality of components in a direction perpendicular to the circuit board.

10. The electronic device of claim 9 , wherein the gap reduction member has a heat transfer coefficient greater than the heat transfer coefficient of the air.

11. The electronic device of claim 9 , wherein the gap reduction member has electric conductivity and is electrically connected to a ground level.

12. The electronic device of claim 9 , further comprising:
a battery that is adjacent to the circuit board.

13. The electronic device of claim 9 , wherein the plurality of components are disposed on a top surface of the circuit board and on a rear surface of the circuit board, wherein the gap reduction member comprises a first gap reduction member disposed between the sapphire panel and the circuit board, and a second gap reduction member disposed between the circuit board and the rear surface of the housing.

14. The electronic device of claim 9 , wherein a top surface of the gap reduction member comprises members to provide a heat sink for the circuit board.

15. The electronic device of claim 9 , wherein the gap reduction member extends beyond the circuit board to provide support to the sapphire panel in areas of the housing that have gaps between components.

16. The electronic device of claim 9 , wherein the gap reduction member is co-fastened to a grounded member.

Assignees

• Kyocera Corp

Inventors

• ARAO Katsumi
• Iwaya Ryosuke

Classifications

• G06F1/1656 Primary

  Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

• H04R7/045

  using the distributed mode principle, i.e. whereby the acoustic radiation is emanated from uniformly distributed free bending wave vibration induced in a stiff panel and not from pistonic motion · CPC title

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• H05K5/0017

  with operator interface units · CPC title

• H04M1/0202

  Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets (constructional features of telephone transmitters or receivers, e.g. of speakers or microphones H04M1/03) · CPC title