Biasing assembly for a latching mechanism

Patent metadata

Field	Value
Publication number	US-9354407-B2
Application number	US-201313963900-A
Country	US
Kind code	B2
Filing date	Aug 9, 2013
Priority date	Aug 10, 2012
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

An example embodiment includes a communication module. The communication module includes a shell, a printed circuit board assembly (“PCBA”) at least partially positioned within the shell, an optical transmitter electrically coupled to the PCBA, an optical receiver electrically coupled to the PCBA, and a biasing assembly. The biasing assembly includes a latch cover configured to be attached to the shell, a slider, and a spring. The slider is configured to operate a latching mechanism that releasably connects the module to a host device through a mechanical connection. The slider includes a main body including a first end, an arm extending from the first end, and a stopper feature extending from the arm. The spring is positioned between the latch cover and the stopper feature to bias the latching mechanism.

First claim

What is claimed is:

1. A module comprising:
a shell;
a printed circuit board assembly (“PCBA”) at least partially positioned within the shell;
an optical transmitter electrically coupled to the PCBA;
an optical receiver electrically coupled to the PCBA; and
a biasing assembly including:
a latch cover configured to be attached to the shell;
a slider configured to operate a latching mechanism that releasably connects the module to a host device through a mechanical connection, the slider including a main body including a first end, an arm extending from the first end, and a stopper feature extending from the arm;
a spring positioned between the latch cover and the stopper feature to bias the latching mechanism;
the latch cover defining a spring opening configured to enable insertion of the spring through the latch cover and against the stopper feature when the latch cover is in a first position and to capture the spring between the latch cover and the stopper feature when the latch cover is in a second position; and
the spring opening including an insertion hole configured to align with the stopper feature when the latch cover is in the first position and an extraction slot extending from the insertion hole, the extraction slot configured such that with the latch cover is in the second position, a second spring end abuts the latch cover in a region surrounding the extraction slot.

2. The module of claim 1 , wherein the biasing assembly biases the latching mechanism to maintain the mechanical connection between the module and the host device.

3. The module of claim 1 , further comprising a spring guide configured to insert a spring received on the spring guide through the spring opening.

4. The module of claim 3 , wherein the spring guide is further configured to be extracted through an extraction slot and to leave the spring captured between the latch cover and the stopper feature.

5. The module of claim 1 , further comprising an inverse cover spring shoulder and an inverse module spring shoulder, the inverse cover spring shoulder and the inverse module spring shoulder configured to confine the spring.

6. The module of claim 1 , wherein the spring abuts a spring-end contact region on the latch cover.

7. The module of claim 1 , wherein the module is substantially compliant with the CXP form factor.

8. A module comprising:
a shell;
a printed circuit board assembly (“PCBA”) at least partially positioned within the shell;
an optical transmitter or an optical receiver electrically coupled to the PCBA; and
a biasing assembly comprising:
a slider configured to operate a latching mechanism configured to releasably connect a module to a host device, the slider including a stopper feature; and
a latch cover defining a spring opening, the spring opening defined to enable insertion of a spring through the latch cover when the latch cover is in a first position and to capture the spring between the latch cover and the stopper feature when the latch cover is in a second position, the spring opening including an insertion hole configured to align with the stopper feature when the latch cover is in the first position, and an extraction slot that extends from the insertion hole, the extraction slot configured to prevent retraction of the spring through the latch cover while the latch cover transitions to the second position.

9. The module of claim 8 , wherein the insertion hole is configured to receive a spring guide, the spring guide configured to receive a spring and to insert the received spring through the insertion hole, and to be extracted through an extraction slot.

10. The module of claim 8 , wherein the spring abuts a spring-end contact region on the latch cover.

11. The module of claim 8 , the biasing assembly further comprising a boot operably connected to the slider.

12. A module comprising:
a shell;
a printed circuit board assembly (“PCBA”) at least partially positioned within the shell;
an optical transmitter or an optical receiver electrically coupled to the PCBA; and
a biasing assembly comprising:
a slider configured to operate a latching mechanism configured to releasably connect a module to a host device, the slider including a stopper feature; and
a latch cover defining a spring opening, the spring opening defined to enable insertion of a spring through the latch cover when the latch cover is in a first position and to capture the spring between the latch cover and the stopper feature when the latch cover is in a second position, the spring opening comprising:
an insertion hole configured to align with the stopper feature when the latch cover is in the first position; and
an extraction slot that extends from the insertion hole, the extraction slot configured to prevent retraction of the spring through the latch cover while the latch cover transitions to the second position.

13. The module of claim 12 , wherein the biasing assembly biases the latching mechanism to maintain the mechanical connection between the module and the host device.

14. The module of claim 12 , wherein the module is substantially compliant with the CXP form factor.

15. The module of claim 12 , further comprising a spring guide configured to insert the spring received on the spring guide through the spring opening.

16. The module of claim 15 , wherein the spring guide is further configured to be extracted through an extraction slot and to leave the spring captured between the latch cover and the stopper feature.

17. The module of claim 12 , wherein the spring abuts a spring-end contact region on the latch cover.

18. The module of claim 12 , the biasing assembly further comprising a boot operably connected to the slider.

19. The module of claim 18 , wherein the boot includes a handle.

20. The module of claim 12 , further comprising an inverse cover spring shoulder and an inverse module spring shoulder, the inverse cover spring shoulder and the inverse module spring shoulder configured to confine the spring.

Assignees

• Finisar Corp

Inventors

• Teo Tat Ming
• Togami Chris K
• Flens Frank J

Classifications

• Y10T29/49863

  with prestressing of part · CPC title

• G02B6/4261 Primary

  Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails · CPC title

• G02B6/4204

  the coupling comprising intermediate optical elements, e.g. lenses, holograms (encapsulated active devices H01S5/02208) · CPC title

• G02B6/428

  containing printed circuit boards [PCB] · CPC title

• G02B6/4249

  comprising arrays of active devices and fibres · CPC title