Magnetic field sensor

Patent metadata

Field	Value
Publication number	US-9354281-B2
Application number	US-201013378090-A
Country	US
Kind code	B2
Filing date	Aug 3, 2010
Priority date	Aug 28, 2009
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

A magnetic field sensor for measuring a magnetic field at a sensor location has a printed circuit board, including electrically insulating material; a magnetic field sensor element situated on the printed circuit board and connected via electrical contacts to first printed conductors provided on the printed circuit board; and at least one second printed conductor for generating a test magnetic field, the second printed conductor being provided on the printed circuit board and generating a predetermined test magnetic field when a calibration current is applied at the sensor location.

First claim

What is claimed is:

1. A magnetic field sensor for measuring a magnetic field at a sensor location, comprising:
a printed circuit board made of an electrically insulating material, having a top surface and a bottom surface;
a magnetic field sensor element situated directly on the top surface of the printed circuit board and directly connected to at least two first printed conductors situated on the bottom surface of the printed circuit board via electrical contacts, the at least two first printed conductors being situated parallel to one another; and
two second printed conductors to generate a test magnetic field, the two second printed conductors being situated on the top surface of the printed circuit board and configured to generate a predetermined test magnetic field when a calibration current is applied at the sensor location via the second printed conductor, the magnetic field sensor element being situated between the two second printed conductors and the two second printed conductors being situated parallel to one another, wherein an extension of the two parallel printed conductors in the direction along a side edge of the magnetic field sensor element on whose side they are situated is at least five times greater than their extension in the direction of a side edge of the magnetic field sensor element situated perpendicularly thereto,
wherein each of the at least two first printed conductors is situated perpendicular to each of the two second printed conductors, and each of the at least two first printed conductors is electrically insulated from each of the two second printed conductors.

2. The magnetic field sensor as recited in claim 1 , wherein the extension of the two parallel second printed conductors in the direction along a side edge of the magnetic sensor is at least ten times greater.

3. The magnetic field sensor as recited in claim 1 , wherein the first and second printed conductors are situated on different metal planes of the printed circuit board.

4. The magnetic field sensor as recited in claim 1 , wherein the magnetic field sensor element is a microsystem.

5. A system comprising:
a magnetic field sensor for measuring a magnetic field at a sensor location, the magnetic field sensor including a printed circuit board having a top surface and a bottom surface, the printed circuit board being made of an electrically insulating material, a magnetic field sensor element situated directly on the top surface of the printed circuit board and directly connected to at least two first printed conductors situated on the bottom surface of the printed circuit board via electrical contacts, the at least two first printed conductors being situated parallel to one another, and two second printed conductors to generate a test magnetic field, the two second printed conductors being situated on the top surface of the printed circuit board and configured to generate a predetermined test magnetic field when a calibration current is applied at the sensor location via the second printed conductor, the magnetic field sensor element being situated between the two second printed conductors, wherein an extension of the two parallel printed conductors in the direction along a side edge of the magnetic field sensor element on whose side they are situated is at least five times greater than their extension in the direction of a side edge of the magnetic field sensor element being situated perpendicularly thereto,
wherein each of the at least two first printed conductors is situated perpendicular to each of the two second printed conductors, and each of the at least two first printed conductors is electrically insulated from each of the two second printed conductors, and
a test instrument operatively connectable to the magnetic field sensor, the test instrument configured to apply a pre-determined calibration current to the at least one second printed conductor.

Assignees

• Lammel Gerhard
• Weiss Stefan
• Bosch Gmbh Robert

Inventors

• Lammel Gerhard
• Weiss Stefan

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• G01R33/0035 Primary

  Calibration of single magnetic sensors, e.g. integrated calibration · CPC title

• G01R33/0286

  comprising microelectromechanical systems [MEMS] (MEMS devices in general B81B) · CPC title

• G01R33/0017

  Means for compensating offset magnetic fields or the magnetic flux to be measured; Means for generating calibration magnetic fields · CPC title