Fluid ejection device with particle tolerant thin-film extension

Patent metadata

Field	Value
Publication number	US-9352568-B2
Application number	US-201214397151-A
Country	US
Kind code	B2
Filing date	Jul 24, 2012
Priority date	Jul 24, 2012
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

In an embodiment, a fluid ejection device includes a thin-film layer formed over a substrate, a chamber layer formed over the thin-film layer, the chamber layer defining a fluidic channel that leads to a firing chamber, a slot extending through the substrate and into the chamber layer through an ink feed hole in the thin-film layer, and a particle tolerant thin-film extension of the thin-film layer that protrudes into the slot from between the substrate and the chamber layer.

First claim

What is claimed is:

1. A fluid ejection device, comprising:
a thin-film layer formed over a substrate;
a chamber layer formed over the thin-film layer and defining a fluidic channel leading to a firing chamber;
a slot extending through the substrate and into the chamber layer through an ink feed hole in the thin-film layer;
a particle tolerant thin-film extension of the thin-film layer that protrudes into the slot from between the substrate and the chamber layer;
a nozzle layer over the chamber layer that forms a top over the firing chamber, the fludic channel, and the slot; and
hanging pillars defined in the chamber layer and adhered to the top such that they extend into the slot.

2. A fluid ejection device as in claim 1 , wherein the particle tolerant thin-film extension includes a plurality of thin-film protrusions partially interleaved between the hanging pillars.

3. A fluid ejection device, comprising:
a thin-film layer formed over a substrate;
a chamber layer formed over the thin-film layer, the chamber layer defining a fluidic channel leading to a firing chamber;
a slot extending through the substrate and into the chamber layer through an ink feed hole in the thin-film layer;
a particle tolerant thin-film extension of the thin-film layer that protrudes into the slot from between the substrate and the chamber layer;
a nozzle layer over the chamber layer that forms a top over the firing chamber, the fluidic channel, and the slot; and
shelf pillars defined in the chamber layer and located at an inlet to the fluidic channel.

4. A fluid ejection device as in claim 1 , wherein the particle tolerant thin-film extension spans across an entire width of the slot.

5. A fluid ejection device as in claim 4 , wherein the particle tolerant thin-film extension includes multiple ink feed holes.

6. A fluid ejection device as in claim 2 , wherein the thin-film protrusions include thin-film protrusions of varying lengths.

7. A fluid ejection device as in claim 1 , wherein the fluidic channel includes a recirculation channel that leads to the firing chamber from first and second channel inlets in fluid communication with the slot.

8. A fluid ejection device as in claim 1 , further including a thermal resistor formed on the thin-film layer within the firing chamber.

9. A fluid ejection device, comprising:
a fluid slot extending through a substrate and a chamber layer;
a thin-film layer between the substrate and the chamber layer including an ink feed hole that provides fluid communication between the substrate and the chamber layer via the slot;
a nozzle layer formed over the chamber layer, the nozzle layer enclosing the slot;
a particle tolerant thin-film extension that extends the thin-film layer into the slot from between the substrate and the chamber layer;
hanging pillars in the chamber layer that are adhered to the nozzle layer and that hang into the slot; and
protrusions in the particle tolerant thin-film extension interleaved between the hanging pillars.

10. A fluid ejection device as in claim 9 , wherein the particle tolerant thin-film extension extends across the slot, and the ink feed hole includes multiple ink feed holes in the particle tolerant thin-film extension.

11. A fluid ejection device as in claim 10 , wherein the multiple ink feed holes include at least one of rectangular shapes or circular shapes.

12. A fluid ejection device as in claim 9 , further including:
a fluidic chamber formed in the chamber layer and coupled to the slot through a fluidic channel;
a thermal resistor formed in the thin-film layer and located within the fluidic chamber; and
a nozzle formed in the nozzle layer over the fluidic chamber.

13. A fluid ejection device as in claim 3 , wherein the particle tolerant thin-film extension spans across an entire width of the slot.

14. A fluid ejection device as in claim 13 , wherein the particle tolerant thin-film extension includes multiple ink feed holes.

15. A fluid ejection device as in claim 3 , wherein the fluidic channel includes a recirculation channel that leads to the firing chamber from first and second channel inlets in fluid communication with the slot.

16. A fluid ejection device as in claim 3 , further including a thermal resistor formed on the thin-film layer and within the firing chamber.

Assignees

• Rivas Rio
• Friesen Ed
• Jensen Kellie Susanne
• Hewlett Packard Development Co

Inventors

• Rivas Rio
• Friesen Ed
• Jensen Kellie Susanne

Classifications

• B41J2002/14403

  including a filter · CPC title

• B41J2202/12

  with ink circulating through the whole print head · CPC title

• B41J2/1404 Primary

  Geometrical characteristics · CPC title

• B41J2/14427 Primary

  Structure of ink jet print heads with thermal bend detached actuators · CPC title

• B41J2/14201

  Structure of print heads with piezoelectric elements · CPC title