Serial feature tracking for endpoint detection

Patent metadata

Field	Value
Publication number	US-9352440-B2
Application number	US-201414265707-A
Country	US
Kind code	B2
Filing date	Apr 30, 2014
Priority date	Apr 30, 2014
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

A method of controlling polishing includes polishing a substrate having a second layer overlying a first layer, detecting exposure of the first layer with an in-situ monitoring system, receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a sequence of spectra of light from the substrate while the substrate is being polished, determining a first value for the characteristic of the feature at the time that the first in-situ monitoring technique detects exposure of the first layer, adding an offset to the first value to generate a second value, and monitoring the characteristic of the feature and halting polishing when the characteristic of the feature is determined to reach the second value.

First claim

What is claimed is:

1. A method of controlling polishing, comprising:
polishing a substrate;
measuring with an in-situ spectrographic optical monitoring system a first sequence of spectra of light reflected from the substrate while the substrate is being polished;
selecting a first spectral feature in the first sequence of spectra, the first spectral feature having an evolving first location through the first sequence of spectra;
for each measured spectrum from the first sequence of spectra, determining a first position value for the first spectral feature to generate a sequence of first position values;
determining that the first location of the first spectral feature has crossed a first boundary based on the sequence of first position values;
measuring a second sequence of spectra of light reflected from the substrate while the substrate is being polished after the first spectral feature has crossed the first boundary;
upon determining that the first location of the first spectral feature has crossed the first boundary, selecting a second spectral feature, the second spectral feature having an evolving second location through the second sequence of spectra;
for each measured spectrum from the second sequence of spectra, determining a second position value for the second spectral feature to generate a sequence of second position values; and
at least one of triggering a polishing endpoint or adjusting a polishing parameter based on the second sequence of position values.

2. The method of claim 1 , comprising triggering the polishing endpoint upon determining that the second location of the second spectral feature has crossed a second boundary.

3. The method of claim 2 , comprising fitting a function to the sequence of second position values, and wherein determining that the second location of the second spectral feature has crossed the second boundary comprises determining that the function has crossed a threshold.

4. The method of claim 1 , comprising determining an initial position value of the first spectral feature and determining a current position value of the first spectral feature, and wherein the first position value comprises a difference between the initial position value and the current position value.

5. The method of claim 1 , wherein selecting the second spectral feature comprises searching a predetermined second wavelength range for the second spectral feature.

6. The method of claim 5 , wherein searching the predetermined second wavelength range comprises finding a local maxima or a local minima in the predetermined second wavelength range.

7. The method of claim 1 , wherein a wavelength of the first spectral feature changes monotonically in a first direction over time, and the predetermined second wavelength range is positioned on a side of the first boundary opposite the first direction.

8. The method of claim 1 , wherein the first boundary is near an edge of an operating range of the spectrographic optical monitoring system.

9. The method of claim 1 , wherein the second boundary is near an edge of an operating range of the spectrographic optical monitoring system.

10. A computer program product encoded on a non-transitory computer storage medium, operable to cause a processor to perform operations to control a polishing operation, the operations comprising:
receiving from an in-situ spectrographic optical monitoring system measurements of a first sequence of spectra of light reflected from the substrate while the substrate is being polished;
selecting a first spectral feature in the first sequence of spectra, the first spectral feature having an evolving first location through the first sequence of spectra;
for each measured spectrum from the first sequence of spectra, determining a first position value for the first spectral feature to generate a sequence of first position values;
determining that the first location of the first spectral feature has crossed a first boundary based on the sequence of first position values;
receiving from the in-situ spectrographic optical monitoring system measurements of a second sequence of spectra of light reflected from the substrate while the substrate is being polished after the first spectral feature has crossed the first boundary;
upon determining that the second location of the first spectral feature has crossed the first boundary, selecting a second spectral feature, the second spectral feature having an evolving second location through the second sequence of spectra;
for each measured spectrum from the second sequence of spectra, determining a second position value for the second spectral feature to generate a sequence of second position values; and
at least one of triggering a polishing endpoint or adjusting a polishing parameter based on the second sequence of position values.

11. A polishing system, comprising:
a platen to support a polishing pad;
a carrier head to hold a substrate in contact with the polishing pad;
an in-situ spectrographic optical monitoring system configured to measure spectra of light reflected from the substrate while the substrate is being polished; and
a controller configured to
receive from the in-situ spectrographic optical monitoring system measurements of a first sequence of spectra of light reflected from the substrate while the substrate is being polished;
select a first spectral feature in the first sequence of spectra, the first spectral feature having an evolving first location through the first sequence of spectra;
for each measured spectrum from the first sequence of spectra, determine a first position value for the first spectral feature to generate a sequence of first position values;
determine that the first location of the first spectral feature has crossed a first boundary based on the sequence of first position values;
receive from the in-situ spectrographic optical monitoring system measurements of a second sequence of spectra of light reflected from the substrate while the substrate is being polished after the first spectral feature has crossed the first boundary;
upon determining that the first location of the first spectral feature has crossed the first boundary, select a second spectral feature, the second spectral feature having an evolving second location through the second sequence of spectra;
for each measured spectrum from the second sequence of spectra, determine a second position value for the second spectral feature to generate a sequence of second position values; and
at least one of trigger a polishing endpoint or adjust a polishing parameter based on the second sequence of position values.

12. The method of claim 1 , comprising determining an initial position value of the second spectral feature at a time that the first spectral feature crosses the first boundary, and comprising determining a current position value of the second spectral feature, and wherein the second position value comprises a difference between the initial position value and the current position value.

13. The computer program product of claim 10 , wherein the operations comprise triggering the polishing endpoint upon determining that the second location of the second spectral feature has crossed a second boundary.

14. The computer program product of claim 13 , wherein the operations comprise fitting a function to the sequence of second position values, and wherein determining that the second location of the second spectral feature has crossed the second boundary comprises determining that the function has crossed a threshold.

15. The computer program product of claim 10 , wherein the first spect

Assignees

• Applied Materials Inc

Inventors

• David Jeffrey Drue

Classifications

• B24B49/12

  involving optical means · CPC title

• B24B37/013 Primary

  Devices or means for detecting lapping completion · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title