Thermal module and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9352380-B2
Application number	US-201314037947-A
Country	US
Kind code	B2
Filing date	Sep 26, 2013
Priority date	Apr 20, 2011
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

A thermal module and a manufacturing method thereof. The thermal module includes a retainer member and at least one heat conduction member. The retainer has a first clamping arm and a second clamping arm opposite to the first clamping arm. The heat conduction member is disposed and fixedly clamped between the first and second clamping arms. The retainer member is formed by means of punching and integrally connected with the heat conduction member also by means of punching so that the manufacturing cost of the thermal module is lowered and the heat dissipation efficiency of the thermal module is enhanced.

First claim

What is claimed is:

1. A manufacturing method of a thermal module, comprising steps of: providing a metal board and at least one heat conduction member;
primarily punching the metal board to form a first clamping arm and a second clamping arm;
secondarily punching the metal board to form a retainer member with a predetermined profile; and
placing the heat conduction member on one face of the formed retainer member and applying a force to the first and second clamping arms to bend the first and second clamping arms toward the heat conduction member to tightly hold two lateral sides of the heat conduction member between the first and second clamping arms and connect the heat conduction member with the retainer member, such that a top side of the heat conduction member is flush with or above top ends of the first and second damping arms, and the top side of the conduction member contacts a heat source directly.

2. The manufacturing method of the thermal module as claimed in claim 1 , wherein in the step of primarily punching the metal board, the metal board is primarily punched by means of slot punch process.

3. The manufacturing method of the thermal module as claimed in claim 1 , wherein in the step of secondarily punching the metal board, the metal board is secondarily punched by means of laying-off process.

4. The manufacturing method of the thermal module as claimed in claim 1 , wherein in the step of placing the heat conduction member on one face of the formed retainer member and applying a force to the first and second clamping arms, the heat conduction member is attached to the formed retainer member and then the first and second clamping arms are forcedly bent toward the heat conduction member by means of punching to securely hold the heat conduction member.

5. The manufacturing method of the thermal module as claimed in claim 1 , wherein the heat conduction member is selected from a group consisting of heat pipe, heat spreader, flat-plate heat pipe and heat conduction metal.

Assignees

• Asia Vital Components Co Ltd

Inventors

• Wu Chun-Ming

Classifications

• H10W40/611

  Bolts or screws · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/10

  Arrangements for heating · CPC title

• B21D39/00 Primary

  Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating ({joining mitred profiles B21D53/745; } riveting B21J; uniting components by forging or pressing to form integral members B21K25/00; welding B23K; press-fitting, force-fitting, or shrinking in general B23P11/00, B21D19/00; by adhesives F16B11/00 {; Connections as such F16L, F16B}); Tube expanders · CPC title

• F28F9/0131

  formed by plates (F28F9/0138 takes precedence) · CPC title