Method of forming an implantable device

US9352071B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9352071-B2
Application numberUS-201313803119-A
CountryUS
Kind codeB2
Filing dateMar 14, 2013
Priority dateMar 14, 2013
Publication dateMay 31, 2016
Grant dateMay 31, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An implantable structure, method for making the structure and method for using the structure, where the structure includes a combination of non-absorbable and absorbable components, and the implantable structure has a randomly uniform array of materials. The resulting implantable structure provides improved tissue ingrowth and flexibility after implantation and after absorption of the absorbable materials.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of forming an implantable device, comprising the steps of: a. Forming a first yarn and a second yarn, wherein at least one of said first yarn and second yarns includes a first non-absorbable filament and at least one of said first yarn and second yarns includes a first absorbable filament, said first absorbable filament having a lower melting point than said first non-absorbable filament, and including the step of kinking at least one of said first absorbable filament and said first non-absorbable filament prior to forming said first or second yarn; b. Forming an initial woven structure comprising said first yarn and second yarn; c. Subjecting said initial woven structure to a first heat treatment at a first temperature sufficient to cause shrinkage of said first absorbable filament, and thus buckling at least the second yarn and forming an initial heated structure; d. Heating said initial heated structure to a second temperature, said second temperature being higher than said first temperature, wherein at least a portion of said first absorbable filament is melted; and e. Allowing said heated structure to cool to form a resulting implantable device. 2. The method of claim 1 , further comprising the step of compressing said initial woven structure during said step of heating said initial heated structure at a second temperature. 3. The method of claim 1 , wherein said first yarn comprises a first non-absorbable filament and a first absorbable filament, and said second yarn comprises a second non-absorbable filament and a second absorbable filament. 4. The method of claim 3 , wherein said first absorbable filament is polydioxanone and said first non-absorbable filament is polypropylene. 5. The method of claim 1 , wherein said first yarn comprises a first non-absorbable filament, a first absorbable filament and a second absorbable filament, and said second yarn comprises a second non-absorbable filament and a third absorbable filament. 6. The method of claim 5 , wherein said first absorbable filament is polyglactin, said second absorbable filament is polydioxanone, and said first non-absorbable filament is polypropylene. 7. The method of claim 1 , wherein said resulting implantable device has a thickness of about 0.1-2 mm after said step of cooling. 8. The method of claim 1 , wherein said step of subjecting said initial woven structure to a first heat treatment comprises placing said initial woven structure in a heating source having a gap that is at least as wide as said thickness of said initial woven structure. 9. The method of claim 1 , wherein said step of subjecting said initial woven structure to a first heat treatment comprises subjecting said initial woven structure to a first temperature that is about 0.1 to about 2° C. less than the melting point of the absorbable filament having the lowest melting point in said initial woven structure. 10. The method of claim 1 , wherein said second temperature is a temperature that is about 0.1° C. to about 20° C. greater than the melting point of the absorbable filament having the lowest melting point in said initial woven structure.

Assignees

Inventors

Classifications

  • Materials characterised by their function or physical properties {, e.g. injectable or lubricating compositions, shape-memory materials, surface modified materials} · CPC title

  • derived from hydroxy-carboxylic acids, e.g. lactones · CPC title

  • all components being made from artificial or synthetic material · CPC title

  • synthetic threads · CPC title

  • Porous materials, {e.g. foams or sponges} · CPC title

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What does patent US9352071B2 cover?
An implantable structure, method for making the structure and method for using the structure, where the structure includes a combination of non-absorbable and absorbable components, and the implantable structure has a randomly uniform array of materials. The resulting implantable structure provides improved tissue ingrowth and flexibility after implantation and after absorption of the absorbabl…
Who is the assignee on this patent?
Ethicon Inc
What technology area does this patent fall under?
Primary CPC classification A61L27/16. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue May 31 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).