Backlight assembly and liquid crystal display device using the same

Patent metadata

Field	Value
Publication number	US-9351392-B2
Application number	US-201213627681-A
Country	US
Kind code	B2
Filing date	Sep 26, 2012
Priority date	Mar 29, 2012
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

A backlight assembly is disclosed that is capable of enabling easy narrow bezel design and easily radiating heat generated from a light source, and a liquid crystal display device using the same. The backlight assembly includes a bottom cover, a light guide plate placed on the bottom cover, a printed circuit board having an L-shaped form and attached to a bottom surface and inner lateral surface of the bottom cover, and a plurality of Light Emitting Diode (LED) packages being mounted to the printed circuit board, wherein the printed circuit board includes a single metal layer having the L-shaped form and attached to the bottom surface and the inner lateral surface of the bottom cover; and a Resin Coated Copper (RCC) film attached to an inner lateral surface of the single metal layer.

First claim

What is claimed is:

1. A backlight assembly comprising:
a bottom cover;
a light guide plate on the bottom cover and supported by the bottom cover;
a printed circuit board including a single metal layer and a Resin Coated Copper (RCC) film, the single metal layer attached to the bottom cover and including an inner lateral surface and a bottom surface, and the Resin Coated Copper (RCC) film attached to only the inner lateral surface of the single metal layer; and
a plurality of Light Emitting Diode (LED) packages placed between the printed circuit board and a lateral surface of the light guide plate, and mounted to the RCC film,
wherein the RCC film includes an insulating layer attached to the single metal layer, and a copper pattern layer disposed on the insulating layer and connected to the plurality of LED packages.

2. The backlight assembly according to claim 1 , wherein the single metal layer is formed of a material selected from the group consisting of aluminum, copper, or copper alloys.

3. The backlight assembly according to claim 1 ,
wherein the insulating layer is formed of an epoxy-based material.

4. The backlight assembly according to claim 1 ,
wherein the insulating layer is formed of a polyimide-based material,
wherein the RCC film further includes an adhesive layer formed at least one of above and below the insulating layer.

5. A backlight assembly comprising:
a bottom cover;
a light guide plate on the bottom cover;
a printed circuit board attached to the bottom cover, wherein the printed circuit board includes: a single metal layer including an inner lateral surface and a bottom surface and the single metal layer attached to the bottom cover; and a Resin Coated Copper (RCC) film attached to only the inner lateral surface of the single metal layer; and
a plurality of Light Emitting Diode (LED) packages facing with a lateral surface of the light guide plate and the plurality of LED packages placed on the RCC film,
a dummy housing configured to cover the bottom surface of the single metal layer and the bottom cover; and
a screw fastened through the dummy housing, the bottom surface of the single metal layer, and the bottom cover.

6. The backlight assembly according to claim 5 , wherein the dummy housing is formed of a material selected from the group consisting of aluminum, Electrolytic Galvanized Iron (EGI), or reinforced plastics.

7. The backlight assembly according to claim 5 , wherein the dummy housing has at least one protrusion to support the light guide plate.

8. A backlight assembly comprising:
a bottom cover;
a light guide plate on the bottom cover and supported by the bottom cover;
a Light Emitting Diode (LED) housing attached to the bottom cover and including first and second surfaces, the first surface facing with a bottom surface of the bottom cover, and the second surface facing with an inner lateral surface of the bottom cover;
a RCC film is attached to only the second surface of the LED housing; and
a plurality of LED packages placed between the LED housing and a lateral surface of the light guide plate, and mounted to the Resin Coated Copper (RCC) film,
wherein the RCC film includes an insulating layer attached to only the second surface of the LED housing, and a copper pattern layer disposed on the insulating layer and connected to the plurality of LED packages.

9. The backlight assembly according to claim 8 , wherein the LED housing further includes:
a third surface extending inward from the second face,
wherein the second surface bent from the first surface.

10. The backlight assembly according to claim 8 ,
wherein the insulating layer is formed of an epoxy-based material.

11. The backlight assembly according to claim 8 ,
wherein the insulating layer is formed of a polyimide-based material,
wherein the RCC film further includes an adhesive layer formed at least one of above and below the insulating layer.

12. A backlight assembly comprising:
a bottom cover;
a light guide plate on the bottom cover and supported by the bottom cover;
a RCC film directly attached to only an inner lateral surface of the bottom cover; and
a plurality of LED packages placed between the bottom cover and a lateral surface of the light guide plate, and mounted to the Resin Coated Copper (RCC) film,
wherein the RCC film includes an insulating layer attached to the inner lateral surface of the bottom cover, and a copper pattern layer on the insulating layer and connected to the plurality of LED packages.

13. A backlight assembly comprising:
a bottom cover;
a light guide plate above the bottom cover and supported by the bottom cover;
a RCC film directly attached to only a bottom surface of the bottom cover;
a plurality of LED packages placed between the bottom surface of the bottom cover and a bottom surface of the light guide plate, and mounted to the Resin Coated Copper (RCC) film;
a diffusive plate above the light guide plate and diffusing incident light from the plurality of LED packages; and
a plurality of optical sheets stacked on the diffusive plate to vertically direct the light emitted from the diffusive plate,
wherein the RCC film includes an insulating layer attached to the bottom surface of the bottom cover, and a copper pattern layer disposed on the insulating layer and connected to the plurality of LED packages.

14. The backlight assembly according to claim 13 , wherein the insulating layer is formed of an epoxy-based material.

15. The backlight assembly according to claim 13 ,
wherein the insulating layer is formed of a polyimide-based material,
wherein the RCC film further includes an adhesive layer formed at least one of above and below the insulating layer.

16. A liquid crystal display device comprising:
a backlight assembly comprising a bottom cover;
a panel guide seated on a lateral rim portion of the bottom cover;
a liquid crystal panel supported by the panel guide; and
a top cover coupled to the bottom cover such that the top cover and the bottom cover surround the backlight assembly, the panel guide and the liquid crystal panel,
wherein the backlight assembly further comprises:
a light guide plate on the bottom cover and supported by the bottom cover;
a single metal layer attached to the bottom cover and including an inner lateral surface and a bottom surface;
a Resin Coated Copper (RCC) film attached to only the inner surface of the single metal layer; and
a plurality of Light Emitting Diode (LED) packages mounted to the RCC film such that the plurality of LED packages and the RCC film are placed between the single metal layer and a lateral surface of the light guide plate,
wherein the RCC film includes an insulating layer attached to only the single metal layer and a copper pattern layer disposed on the insulating layer and connected to the plurality of LED packages.

17. A liquid crystal display device comprising:
a backlight assembly comprising a bottom cover;
a panel guide seated on a lateral rim portion of the bottom cover;
a liquid crystal panel supported by the panel guide; and
a top cover coupled to the bottom cover such that the top cover and the bottom cover surround the backlight assembly, the panel guide and the liquid crystal panel,
wherein the backlight assembly further comprises:
a light guide plate on the bottom cover and supported by the bottom cover;
a single metal layer attached to the bottom cover and including an inner lateral surface and a bottom surface;
a Resin Coated Copper (RCC) film attached to only the inner surface of the single metal la

Assignees

• Lg Display Co Ltd

Inventors

• Lee Sang Dae
• Jang Kyeong Kun
• Cho Min Su
• Kim Young Mee

Classifications

• G02F1/1336

  Illuminating devices · CPC title

• H05K1/0209 Primary

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title

• H05K2201/0358

  Resin coated copper [RCC] · CPC title

• G02F2001/133612

  Physics · mapped topic

• G02B6/0088

  of the light guide or other optical sheets in the package · CPC title