Device having a plurality of driver circuits to provide a current to a plurality of loads and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9351382-B2
Application number	US-201514835491-A
Country	US
Kind code	B2
Filing date	Aug 25, 2015
Priority date	Dec 23, 2013
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

In various embodiments, a device is provided. The device includes a substrate having a first side and a second side opposite the first side. The substrate includes a plurality of driver circuits at the first side of the substrate. Each of the plurality of driver circuits is configured to drive a current from the first side of the substrate to the second side of the substrate. The device further includes at least one load interface at the second side of the substrate. The at least one load interface is configured to couple the current from the plurality of the driver circuits to a plurality of loads at the second side of the substrate.

First claim

What is claimed is:

1. A device, comprising: a substrate having a first side and a second side opposite the first side, the substrate comprising:
at least one driver circuit at the first side of the substrate, wherein each of the at least one driver circuit is
embedded within the substrate at the first side of the substrate and
configured to drive a current from the first side of the substrate to the second side of the substrate; and

at least one load interface at the second side of the substrate, wherein the at least one load interface is:
embedded within the substrate at the second side of the substrate and

configured to couple the current from the at least one driver circuit to at least one load at the second side of the substrate.

2. The device of claim 1 , wherein the at least one load is configured to be coupled to by a test module, wherein the test module is configured to test at least one of a plurality of loads via the at least one load interface based on the current coupled from a plurality of drive circuits to the plurality of loads at the second side of the substrate.

3. The device of claim 2 , wherein the plurality of loads comprise a plurality of LED elements, and wherein the test module is configured to test the plurality of LED elements via the at least one load interface.

4. The device of claim 2 , wherein the test module is configured to test the plurality of LED elements to determine the function of the LED elements.

5. The device of claim 2 , wherein the plurality of loads are embedded within the second side of the substrate via the at least one load interface.

6. The device of claim 5 , wherein the at least one load interface comprises a plurality of recesses at the second side of the substrate; wherein each of the plurality of recesses is configured to receive at least one of a plurality of loads.

7. The device of claim 2 , wherein at least one load of the plurality of loads comprises a light emitting diode.

8. The device arrangement of claim 2 , wherein the plurality of driver circuits are electrically isolated from each other in a lateral direction across the first surface of the substrate.

9. The device arrangement of claim 8 , wherein the plurality of driver circuits are electrically isolated from each other in the substrate by at least one trench.

10. The device of claim 2 , wherein at least one of the plurality of driver circuits comprises a vertical transistor.

11. The device of claim 2 , further comprising: at least one controller integrated in the substrate to control the plurality of driver circuits.

12. A method of manufacturing a device, the method comprising:
forming at least one driver circuit at a first side of a substrate, wherein each of the at least one driver circuit is
embedded within the substrate at the first side of the substrate and
configured to drive a current from a first side of the substrate to a second side of the substrate opposite the first side of the substrate; and

forming at least one load interface that is embedded in the substrate at the second side of the substrate, wherein the at least one load interface is configured to couple the current from the at least one driver circuit to at least one load at the second side of the substrate.

13. The method of claim 12 , wherein manufacturing the device further comprises testing the at least one load using a test module configured to test at least one of a plurality of loads via the at least one load interface based on the current coupled from a plurality of drive circuits to the plurality of loads at the second side of the substrate.

14. The method of claim 13 wherein testing the plurality of loads comprises testing a plurality of LED elements via the at least one load interface.

15. The method of claim 14 wherein the test module is configured to test the plurality of LED elements to determine the function of the LED elements.

Assignees

• Infineon Technologies Ag

Inventors

• Logiudice Andrea
• Meiser Andreas

Classifications

• Y10T29/49117

  Conductor or circuit manufacturing · CPC title

• G09G3/006

  Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays (testing individual LED's G01R31/2635; testing lamps G01R31/44; testing of optical features of LCD displays G02F1/1309) · CPC title

• H05B45/48

  having LEDs organised in strings and incorporating parallel shunting devices · CPC title

• H10H20/01

  Manufacture or treatment · CPC title

• H05B33/0824

  Electricity · mapped topic