Capacitive micromachined ultrasonic transducer (CMUT) with through-substrate via (TSV) substrate plug

Patent metadata

Field	Value
Publication number	US-9351081-B2
Application number	US-201313779210-A
Country	US
Kind code	B2
Filing date	Feb 27, 2013
Priority date	Feb 27, 2013
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

A Capacitive Micromachined Ultrasonic Transducer (CMUT) device includes at least one CMUT cell including a first substrate of a single crystal material having a top side including a patterned dielectric layer thereon including a thick and a thin dielectric region, and a through-substrate via (TSV) extending a full thickness of the first substrate. The TSV is formed of the single crystal material, is electrically isolated by isolation regions in the single crystal material, and is positioned under a top side contact area of the first substrate. A membrane layer is bonded to the thick dielectric region and over the thin dielectric region to provide a movable membrane over a micro-electro-mechanical system (MEMS) cavity. A metal layer is over the top side substrate contact area and over the movable membrane including coupling of the top side substrate contact area to the movable membrane.

First claim

What is claimed is:

1. A Capacitive Micromachined Ultrasonic Transducer (CMUT) device, comprising:
at least one CMUT element with at least one CMUT cell, said CMUT cell including:
a first substrate of a single crystal material having a resistivity less than (<) 0.1 ohm-cm having a top side including a patterned dielectric layer thereon including a thick dielectric region and a thin dielectric region, and a through-substrate via (TSV) extending a full thickness of said first substrate, from said top side to a bottom side, wherein said TSV is formed of said single crystal material, wherein said TSV is electrically isolated by isolation regions from surrounding regions of said single crystal material, and said TSV is positioned under a top side substrate contact area of said first substrate;
a membrane layer bonded to said thick dielectric region and over said thin dielectric region to provide a movable membrane over a micro-electro-mechanical system (MEMS) cavity; and
a top side metal layer over said top side substrate contact area and over said movable membrane including a portion coupling said top side substrate contact area to said movable membrane.

2. The CMUT device of claim 1 , further comprising a solid dielectric filler in said isolation regions.

3. The CMUT device of claim 1 , further comprising a patterned metal layer on said bottom side surface of said first substrate including a first patterned layer portion contacting a bottom side of said TSV and a second patterned layer portion contacting said bottom side of said first substrate lateral to said TSV, wherein said first substrate provides a third electrode for said CMUT cell to enable 3 dimensional (3D) capacitive sensing for said CMUT device.

4. The CMUT device of claim 1 , wherein said single crystal material comprises single crystal silicon.

5. The CMUT device of claim 1 , wherein said CMUT device includes a plurality of said CMUT elements, wherein each of said plurality of CMUT elements include a plurality of said CMUT cells, wherein all of said movable membranes within each of said plurality of CMUT elements are connected together so that said movable membranes in each of said plurality of CMUT elements are all addressable by contacting said TSV.

6. The CMUT device of claim 1 , further comprising at least one dielectric passivation layer on a top of said CMUT device including over said top side metal layer.

7. The CMUT device of claim 1 , wherein said membrane layer is vacuum fusion bonded to said thick dielectric region.

8. The CMUT device of claim 1 , wherein said membrane layer a semiconductor on insulator (SOI) membrane layer.

Assignees

• Texas Instruments Inc

Inventors

• Johnson Peter B
• Wygant Ira Oaktree

Classifications

• H04R19/005 Primary

  using semiconductor materials · CPC title

• B06B2201/76

  Medical, dental · CPC title

• B06B1/0292 Primary

  Electrostatic transducers, e.g. electret-type · CPC title

• H02N1/006

  of the gap-closing type (H02N1/004 takes precedence) · CPC title

• H05K2201/09863

  Concave hole or via · CPC title