Light emitter packages, systems, and methods

Patent metadata

Field	Value
Publication number	US-9349929-B2
Application number	US-201213713410-A
Country	US
Kind code	B2
Filing date	Dec 13, 2012
Priority date	May 31, 2012
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.

First claim

What is claimed is:

1. A light emitter package comprising:
a submount comprising a planar surface and at least one layer of exposed metal disposed on the planar surface of the submount;
a plurality of light emitter chips disposed over the submount; and
a lens disposed over the submount, the lens comprising a lens base;
wherein the layer of exposed metal is disposed at least substantially over a portion of the planar surface that is outside of the lens base, wherein the planar surface comprises a surface area, and wherein the layer of exposed metal does not extend beyond the surface area of the submount.

2. The light emitter package of claim 1 , wherein the package delivers up to approximately 145 or more lumens per watt (LPW) at 1 W and approximately 25° C.

3. The light emitter package of claim 1 , wherein the package delivers up to approximately 180 or more lumens per watt (LPW) at 1 W and approximately 25° C.

4. The light emitter package of claim 1 , wherein the package delivers up to approximately 200 or more lumens per watt (LPW) at 1 W and approximately 25° C.

5. The light emitter package of claim 2 , wherein the plurality of light emitter chips emit light, and wherein a combined light emission from the plurality of light emitter chips is a warm white (WW) color temperature.

6. The light emitter package of claim 3 , wherein the plurality of light emitter chips emit light, and wherein a combined light emission from the plurality of light emitter chips is a cool white (CW) color temperature.

7. The light emitter package of claim 4 , wherein the plurality of light emitter chips emit light, and wherein a combined light emission from the plurality of light emitter chips is a cool white (CW) color temperature.

8. The light emitter package of claim 1 , wherein the package delivers approximately 2050 lumens (lm) at 15 W and 25° C. in CW temperatures.

9. The light emitter package of claim 1 , wherein each chip of the plurality of chips is spaced apart from at least one other adjacent chip by at least approximately 0.06 mm or more.

10. The light emitter package of claim 1 , wherein the layer of exposed metal comprises an anode and a cathode.

11. The light emitter package of claim 10 , wherein a portion of reflective material is at least partially disposed between the anode and the cathode.

12. The light emitter package of claim 10 , wherein a first light emitter chip is entirely disposed over the cathode.

13. The light emitter package of claim 12 , wherein a second light emitter chip is wirebonded to the anode.

14. The light emitter package of claim 1 , wherein an optical conversion material is disposed directly over portions of each light emitter chip.

15. The light emitter package of claim 1 , wherein the exposed metal comprises copper (Cu).

16. The light emitter package of claim 1 , wherein the exposed metal comprises copper (Cu), silver (Ag), and Titanium (Ti).

17. The light emitter package of claim 1 , wherein the lens base comprises a circle.

18. The light emitter package of claim 17 , wherein the lens base comprises a radius equal to or greater than approximately 1 mm.

19. The light emitter package of claim 17 , wherein the lens base comprises a radius equal to or greater than approximately 3.25 mm.

20. The light emitter package of claim 1 , wherein the submount comprises a length and a width of approximately 4 mm or more.

21. The light emitter package of claim 20 , wherein the submount comprises a length and a width of approximately 7 mm.

22. The light emitter package of claim 1 , wherein the light emitter chip comprises an area of at least 1.8 mm 2 .

23. The light emitter package of claim 22 , wherein the surface area comprises an area of approximately 49 mm 2 or more.

24. The light emitter package of claim 22 , wherein the lens base comprises an area of approximately 30 mm 2 or more.

25. The light emitter package of claim 1 , wherein the submount comprises a thermal conductivity equal to or greater than approximately 30 watts per meter kelvin (W/m·K).

26. The light emitter package of claim 1 , wherein the package is ENERGY STAR® compliant.

27. The light emitter package of claim 1 , wherein the package is UL® recognized.

Assignees

• Cree Inc

Inventors

• Clark Joseph G
• Abare Amber C
• Emerson David T
• Nevins Jeremy S
• Rosado Raymond
• Bergmann Michael

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/853

  characterised by their shape · CPC title

• H10H20/851

  Wavelength conversion means · CPC title

• H10H20/855 Primary

  Optical field-shaping means, e.g. lenses · CPC title

• F21V7/00

  Reflectors for light sources (characterised by cooling arrangements F21V29/505) · CPC title