Power electronic devices

Patent metadata

Field	Value
Publication number	US-9349790-B2
Application number	US-201113882621-A
Country	US
Kind code	B2
Filing date	Oct 26, 2011
Priority date	Nov 2, 2010
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

A semiconductor device or power electronic device is described. The device includes a pair of pole pieces, each having a profiled surface. A semiconductor body or wafer, preferably of wide bandgap electronic material, is located between the pole pieces and includes contact metallization regions. The semiconductor body produces an electric field that emerges from an edge region. Passivation means includes a first or radially inner part in contact with the edge region of the semiconductor body and which diffuses the electric field as it emerges from the edge region and a second or radially outer part. The second part of the passivation is in contact with the first part and provides a substantially void-free interface with the profiled surface of each pole piece. The device may be immersed in a dielectric liquid.

First claim

The invention claimed is:

1. A high voltage device immersed in a liquid dielectric, the device comprising:
a pair of pole pieces, each pole piece including a profiled surface at a peripheral edge region, the profiled surface of the pole pieces facing each other;
a device body located between the pole pieces, the device body being subjected to an electric field and comprising:
(i) a central current carrying region, and
(ii) an edge termination region comprising a plurality of planar edge termination components configured to diffuse the electric field within the device body, the electric field emerging from the edge termination region of the device body, wherein the profiled surfaces of the pole pieces and the planar edge termination components together form a multi-electrode array; and

passivation material comprising:
(i) a first material part surrounding and in contact with the edge termination region of the device body and configured to envelope the planar edge termination components, and diffuse the electric field as it emerges from the edge termination region, and
(ii) a second material part disposed outside the first material part, and configured to fill the space between the profiled surface of each pole piece and the external surface of the first material part, to provide an interface with the profiled surface of each pole piece and which further diffuses the electric field as it emerges from the first material part of the passivation means, a radially outer surface of the second part of the passivation material being in contact with the dielectric liquid;
wherein the profiled surfaces and the planar edge termination components of the multi-electrode array control the diffusion of the electric field within the passivation material.

2. The device of claim 1 , wherein the device body incorporates a wide bandgap electronic material.

3. The device of claim 1 , further comprising a space between a space between the outer surface of the first material part of the passivation material and the profiled surface of each pole piece, which space is at least partially filled by the second material part of the passivation material.

4. The device of claim 1 , wherein the second material part of the passivation material is formed from a compliant elastomeric material.

5. The device of claim 1 , wherein the second material part of the passivation material is formed from a silicone rubber.

6. The device of claim 1 , wherein the first material part of the passivation material is substantially void-free.

7. The device of claim 1 , wherein the second material part of the passivation material is substantially void-free.

8. The device of claim 1 , wherein the interface between the second material part of the passivation material and the profiled surface of each pole piece is substantially void-free.

9. The device of claim 1 , wherein the part of each pole piece that is profiled lies radially outside a central region that faces the current carrying region of the device body.

10. The device of claim 9 , wherein the transition between the central region and the peripheral edge region of each pole piece is at a region which faces substantially the radially inner side of the planar edge termination components of the device body.

11. The device of claim 1 , wherein each pole piece includes a central region that is in contact with a respective contact metallisation region of the device body or with an intermediate disc.

12. The device of claim 1 , wherein the profiled surfaces of the pole pieces are symmetrical.

13. The device of claim 1 , wherein the profiled surfaces of the pole pieces are asymmetrical.

14. The device of claim 1 , further comprising a pair of discs, each disc being in contact with a respective contact metallisation of the device body.

15. The device of claim 14 , wherein each disc is located in a corresponding recess formed in a substantially flat part of the associated pole piece.

16. The device of claim 14 , wherein each disc has a profiled surface and the second material part of the passivation material provides an interface with both the profiled surface of each pole piece and its associated disc.

17. The device of claim 1 , wherein the surrounding dielectric liquid is substantially void-free.

18. The device of claim 1 , wherein the pole pieces are adapted to have a surrounding finned head exchange.

19. The device of claim 1 , further comprising a gate connection that is routed through a passage within a pole piece.

20. The device of claim 1 , further comprising a press pack construction where the device body, pole pieces and passivation material are located within a hermetically sealed housing that is backfilled with dielectric liquid that is in contact with the radially outer surface of the second material part of the passivation material.

21. A stack assembly comprising at least one high voltage device immersed in a liquid dielectric, the device comprising:
a pair of pole pieces, each pole piece including a profiled surface at a peripheral edge region, the profiled surface of the pole pieces facing each other;
a device body located between the pole pieces, the device body being subjected to an electric field and comprising:
(i) a central current carrying region, and
(ii) an edge termination region comprising a plurality of planar edge termination components configured to diffuse the electric field within the device body, the electric field emerging from the edge termination region of the device body; wherein the profiled surfaces of the pole pieces and the planar edge termination components together form a multi-electrode array; and
passivation material comprising:
(i) a first material part surrounding and in contact with the edge termination region of the device body and configured to envelope the planar edge termination components, and diffuse the electric field as it emerges from the edge termination region, and
(ii) a second material part disposed outside the first material part, and configured to the space between the profiled surface of each pole piece and the external surface of the first material part, to provide an interface with the profiled surface of each pole piece and which further diffuses the electric field as it emerges from the first material part of the passivation material, a radially outer surface of the second material part of the passivation material being in contact with the dielectric liquid;
wherein the profiled surfaces and the planar edge termination components of the multi-electrode array control the diffusion of the electric field within the passivation material.

22. A method of operating a high voltage device immersed in a liquid dielectric, the device comprising:
subjecting a device body located between pole pieces, each pole piece including a profiled surface at a peripheral edge region, the profiled surface of the pole pieces facing each other, to an electric field;
diffusing, via an edge termination region of the device body comprising a plurality of planar edge termination components and the profiled surfaces, the electric field and emerging the electric field from the edge termination region of the device body; and
diffusing the electric field by a passivation material having a first material part surrounding and in contact with the edge termination region of the device body and enveloping the planar edge termination components, as it emerges from the edge termination region and a second material part disposed outside the firs

Assignees

• Crane Allan David
• Loddick Sean Joseph
• Hinchley David
• Ge Energy Power Conversion Technology Ltd

Inventors

• Crane Allan David
• Loddick Sean Joseph
• Hinchley David

Classifications

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/944

  Dispositions of multiple bond pads · CPC title

• H10W72/59

  Bond pads specially adapted therefor · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W76/138 Primary

  having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type · CPC title