Apparatus including temperature-dependent exchange spring mechanism

Patent metadata

Field	Value
Publication number	US-9349402-B2
Application number	US-201514618992-A
Country	US
Kind code	B2
Filing date	Feb 10, 2015
Priority date	Jul 9, 2013
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

Provided herein is an apparatus comprising a substrate; a continuous layer over the substrate comprising a first heat sink layer; and a plurality of features over the continuous layer comprising a second heat sink layer, a first magnetic layer over the second heat sink layer, and a second magnetic layer, wherein the first and second magnetic layers are configured to provide a temperature-dependent, exchange spring mechanism.

First claim

What is claimed is:

1. An apparatus comprising
a substrate;
a continuous layer over the substrate comprising
a continuous first heat sink layer; and

a plurality of patterned features over the continuous layer, wherein each of the patterned features includes
a patterned second heat sink layer,
a patterned first magnetic layer overlying the patterned second heat sink layer, and
a patterned second magnetic layer,
wherein the patterned first and second magnetic layers are configured to provide a temperature-dependent, exchange spring mechanism.

2. The apparatus of claim 1 ,
wherein the exchange spring mechanism is effected by the patterned first and second magnetic layers being more strongly coupled at a first temperature than at a second, higher temperature.

3. The apparatus of claim 2 ,
wherein the second, higher temperature facilitates a magnetization change in one or more of the plurality of patterned features by a read/write head.

4. The apparatus of claim 1 ,
wherein the continuous first heat sink layer has a higher thermal conductivity than the patterned second heat sink layer.

5. The apparatus of claim 1 ,
wherein the patterned first magnetic layer has a higher anisotropy field H k than the patterned second magnetic layer.

6. The apparatus of claim 1 ,
wherein the patterned first magnetic layer has a lower saturation magnetization M s than the patterned second magnetic layer.

7. The apparatus of claim 1 ,
wherein the patterned first magnetic layer has a lower Curie temperature T c than the patterned second magnetic layer.

8. An apparatus comprising
a patterned layer over a continuous first heat sink layer, wherein the patterned layer includes a patterned island comprising
a patterned second heat sink layer,
a patterned first magnetic layer overlying the patterned second heat sink layer, and
a patterned second magnetic layer,
wherein the patterned first and second magnetic layers are configured to provide a temperature-dependent, exchange spring mechanism.

9. The apparatus of claim 8 ,
wherein the exchange spring mechanism is effected by the patterned first and second magnetic layers being more weakly coupled at a first temperature than at a second, lower temperature.

10. The apparatus of claim 8 ,
wherein the continuous first heat sink layer has a higher thermal conductivity than the patterned second heat sink layer.

11. The apparatus of claim 10 ,
wherein the patterned first magnetic layer has a higher anisotropy field H k than the patterned second magnetic layer.

12. The apparatus of claim 10 ,
wherein the patterned first magnetic layer has a lower saturation magnetization M s than the patterned second magnetic layer.

13. The apparatus of claim 10 ,
wherein the patterned first magnetic layer has a lower Curie temperature T c than the patterned second magnetic layer.

14. The apparatus of claim 8 , further comprising
a thermal resistor layer in-between the patterned second heat sink layer and the patterned first magnetic layer.

15. An apparatus comprising
a plurality of patterned features comprising
a patterned first magnetic layer,
a patterned second magnetic layer overlying the patterned first magnetic layer, and
a patterned third magnetic layer over the patterned second magnetic layer,
wherein the patterned first, second, and third magnetic layers are configured to provide a temperature-dependent, exchange spring mechanism,

a continuous first heat sink layer, and
a patterned second heat sink layer in-between the continuous first heat sink layer and the patterned first magnetic layer, wherein the patterned second heat sink layer is a thermally conductive material directly underlying each of the plurality of patterned features.

16. The apparatus of claim 15 ,
wherein the patterned first magnetic layer has a higher anisotropy field H k than the patterned third magnetic layer, and wherein the patterned third magnetic layer has a higher H k than the patterned second magnetic layer.

17. The apparatus of claim 15 ,
wherein each of the patterned first and third magnetic layers has a lower saturation magnetization M s than the patterned second magnetic layer.

18. The apparatus of claim 15 ,
wherein each of the patterned first and third magnetic layers has a lower Curie temperature T c than the patterned second magnetic layer.

19. The apparatus of claim 15 ,
wherein the continuous first heat sink layer has a higher thermal conductivity than the patterned second heat sink layer.

Assignees

• Seagate Technology Llc

Inventors

• Chen Xi
• Ju Ganping
• Peng Yingguo
• Klemmer Timothy J
• Kubota Yukiko
• Thiele Jan-Ulrich
• Kuo David S
• Chang Kai-Chieh
• Wang Kangkang
• Gao Li
• Ding Yinfeng

Classifications

• G11B5/746 Primary

  Bit Patterned record carriers, wherein each magnetic isolated data island corresponds to a bit · CPC title

• G11B5/8404

  manufacturing base layers · CPC title

• G11B5/855

  Coating only part of a support with a magnetic layer · CPC title

• G11B5/66 Primary

  the record carriers consisting of several layers · CPC title

• G11B2005/0021

  Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title