Computer provided with cooling system

Patent metadata

Field	Value
Publication number	US-9348378-B2
Application number	US-201214394906-A
Country	US
Kind code	B2
Filing date	Apr 19, 2012
Priority date	Apr 19, 2012
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

The computer having a module board with semiconductor elements mounted on both sides thereof, a motherboard on which a plurality of units of the module board are mounted, and a rack cabinet on which a plurality of units of the motherboard are mounted includes a thermo-siphon that is thermally connected to the semiconductor elements mounted on one side of the module board, a metal plate that is thermally connected to the semiconductor elements mounted on one side of the module board, a thermally-conductive member that transfers the heat of the metal plate to the thermo-siphon in a situation where the heat of the semiconductor elements mounted on one side of the module board is transferred to the metal plate, and a pressing member that presses the thermo-siphon and the metal plate against the semiconductor elements mounted on the module board.

First claim

The invention claimed is:

1. A computer provided with a cooling system and equipped with a module board with semiconductor elements mounted on both sides thereof, a motherboard on which a plurality of units of the module board are mounted, and a rack cabinet on which a plurality of units of the motherboard are mounted, the computer comprising:
a thermo-siphon that is thermally connected to the semiconductor elements mounted on a first side of the module board;
a metal plate that is thermally connected to the semiconductor elements mounted on a second side of the module board;
a thermally-conductive member that transfers heat from the metal plate to the thermo-siphon in a situation where heat from the semiconductor elements mounted on the second side of the module board is transferred to the metal plate; and
a pressing member that presses the thermo-siphon and the metal plate against the semiconductor elements mounted on the module board.

2. The computer provided with the cooling system according to claim 1 , wherein the pressing member is formed of a screw that penetrates through the thermo-siphon and brings a protrusion of the metal plate into contact with the surface of the thermo-siphon.

3. The computer provided with the cooling system according to claim 1 , wherein the pressing member is formed of a clip that holds the thermo-siphon and the metal plate together.

4. The computer provided with the cooling system according to claim 3 , wherein the clip is formed of an elastic metal member and shaped like a U-shaped hair pin.

5. The computer provided with the cooling system according to claim 1 , wherein the pressing member is formed of a leaf spring disposed between the metal plate and the motherboard.

6. The computer provided with the cooling system according to claim 5 , wherein the leaf spring is formed of an elastic metal member and provided with a flat surface that comes into contact with the metal plate.

Assignees

• Kondo Yoshihiro
• Fujimoto Takayuki
• Takeda Fumio
• Kato Takeshi
• Hitachi Ltd

Inventors

• Kondo Yoshihiro
• Fujimoto Takayuki
• Takeda Fumio
• Kato Takeshi

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H01L23/427

  Electricity · mapped topic

• H05K2201/2072

  Anchoring, i.e. one structure gripping into another · CPC title

• H01L2924/00

  Electricity · mapped topic