Hybrid image-sensing apparatus having filters permitting incident light in infrared region to be passed to time-of-flight pixel

Patent metadata

Field	Value
Publication number	US-9348019-B2
Application number	US-201213682389-A
Country	US
Kind code	B2
Filing date	Nov 20, 2012
Priority date	Nov 20, 2012
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

An image-sensing apparatus is provided. The image-sensing apparatus includes: an optical filter array including a two-band passing filter and an infrared filter; an RGB pixel array placed below the two-band passing filter; and a TOF pixel array adjacent to the RGB pixel array and placed below the two-band passing filter and the infrared filter, wherein a combination of the two-band passing filter and the infrared passing filter permits only the incident light in the infrared region to pass to the ToF pixel array.

First claim

What is claimed is:

1. An image-sensing apparatus, comprising:
an optical filter array including a two-band passing filter and an infrared filter;
an RGB pixel array placed below the two-band passing filter; and
a ToF pixel array adjacent to the RGB pixel array and placed below the two-band passing filter and the infrared filter, wherein a combination of the two-band passing filter and the infrared passing filter permits only the incident light in the infrared region to pass to the ToF pixel array, and wherein a transparent filling layer is placed between the ToF pixel array and the infrared filter.

2. The image-sensing apparatus as claimed in claim 1 , wherein the RGB pixel array and the ToF pixel array are disposed on a substrate.

3. The image-sensing apparatus as claimed in claim 2 , wherein the RGB pixel array comprises a first photodiode array and an RGB color filter array over the photodiode array, and the ToF array comprises a second photodiode array, wherein the first photodiode array has a thickness thinner than that of the second photodiode array.

4. The image-sensing apparatus as claimed in claim 3 , wherein the RGB pixel array further comprises a first interconnection structure between the first photodiode array and the substrate, and the ToF pixel array further comprises a second interconnection structure between the second interconnection structure and the substrate.

5. The image-sensing apparatus as claimed in claim 3 , wherein the transparent filling layer is located on the second photodiode array.

6. The image-sensing apparatus as claimed in claim 2 , wherein the RGB pixel array comprises a first photodiode array and an RGB color filter array over the first photodiode array, and the ToF array comprises a second photodiode array, wherein the first photodiode array has a thickness substantially equal to that of the second photodiode array.

7. The image-sensing apparatus as claimed in claim 2 , wherein the substrate, the optical filter array, the RGB pixel array and the TOF pixel array are packaged within a housing.

8. The image-sensing apparatus as claimed in claim 7 , further comprising a module lens on the housing, wherein the module lens is configured to gather incident light from the environment and image the incident light on both the RGB pixel array and ToF pixel array.

9. The image-sensing apparatus as claimed in claim 1 , wherein the RGB pixel array is disposed on a first substrate, and the ToF pixel array is disposed on a second substrate.

10. The image-sensing apparatus as claimed in claim 9 , wherein the RGB pixel array comprises a first photodiode array and an RGB color filter array over the first photodiode array, and the ToF array comprises a second photodiode array.

11. The image-sensing apparatus as claimed in claim 10 , wherein the RGB pixel array further comprises a first interconnection structure between the first photodiode array and the first substrate, and the ToF pixel array further comprises a second interconnection structure between the second photodiode array and the second substrate.

12. The image-sensing apparatus as claimed in claim 11 , wherein the second photodiode array has a thickness greater than that of the first photodiode array.

13. The image-sensing apparatus as claimed in claim 10 , wherein the RGB pixel array further comprises a first interconnection structure between the RGB color filter array and the first photodiode array, and the ToF pixel array further comprises a second interconnection structure on the second photodiode array.

14. The image-sensing apparatus as claimed in claim 10 , wherein the RGB pixel array further comprises a first interconnection structure between the RGB color filter array and the first photodiode array, and the ToF pixel array further comprises a second interconnection structure between the second photodiode array and the second substrate.

15. The image-sensing apparatus as claimed in claim 9 , wherein the first substrate, the second substrate, the optical filter array, the RGB pixel array and the TOF pixel array are packaged within a housing.

16. The image-sensing apparatus as claimed in claim 15 , further comprising a first module lens and a second module lens on the housing and configured to gather incident light from the environment, wherein the first module lens and the second module lens image onto the RGB pixel array and the ToF pixel array, respectively.

17. The image-sensing apparatus as claimed in claim 1 , wherein the infrared passing filter permit the incident light in a wavelength region of between about 650 nm and about 850 nm to pass.

18. An image-sensing apparatus, comprising:
a substrate;
an RGB pixel array and a ToF pixel array on the substrate;
a two-band passing filter placed in front of both the RGB pixel array and the ToF pixel array for passing visible light and infrared light; and
an infrared passing filter placed in front of the ToF pixel array for passing infrared light, wherein a combination of the two-band passing filter and the infrared passing filter permits only the incident light in the infrared region to pass to the ToF pixel array, and wherein a transparent filling layer is placed between the ToF pixel array and the infrared passing filter.

19. An image-sensing apparatus, comprising:
an RGB pixel array on a first substrate;
a ToF pixel array on a second substrate adjacent to the first substrate;
a two-band passing filter placed in front of both the RGB pixel array and the ToF pixel array for passing visible light and infrared light; and
an infrared passing filter placed in front of the ToF pixel array for passing infrared light, wherein a combination of the two-band passing filter and the infrared passing filter permits only the incident light in the infrared region to pass to the ToF pixel array.

Assignees

• Wang Wei-Ko
• Chang Chin-Ching
• Wu Chia-Hui
• Huang Chien-Hsiung
• Lin Cheng-Xuan
• Chen Chang-Wei
• Visera Technologies Co Ltd

Inventors

• Wang Wei-Ko
• Chang Chin-Ching
• Wu Chia-Hui
• Huang Chien-Hsiung
• Lin Cheng-Xuan
• Chen Chang-Wei

Classifications

• G01S17/894

  Three-dimensional [3D] imaging with simultaneous measurement of time-of-flight at a two-dimensional [2D] array of receiver pixels, e.g. time-of-flight cameras or flash lidar · CPC title

• G01S17/86

  Combinations of lidar systems with systems other than lidar, radar or sonar, e.g. with direction finders · CPC title

• G01S7/4816 Primary

  of receivers alone · CPC title

• H10F39/8067

  Reflectors · CPC title

• H10F39/8053

  Colour filters · CPC title