Thermally conductive dielectric for thermoformable circuits

Patent metadata

Field	Value
Publication number	US-9346992-B2
Application number	US-201414330075-A
Country	US
Kind code	B2
Filing date	Jul 14, 2014
Priority date	Jul 31, 2013
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

This invention is directed to a polymer thick film thermally conductive thermoformable dielectric composition comprising urethane resin, thermoplastic phenoxy resin, diacetone alcohol and thermally conductive powder. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver and the polycarbonate substrate in capacitive switch applications. The thermoformed electrical circuit may be subsequently subjected to an injection molding process.

First claim

What is claimed is:

1. A polymer thick film thermally conductive thermoformable dielectric composition comprising:
(a) 10-35 wt % first organic medium comprising 10-50 wt % urethane resin dissolved in 50-90 wt % first organic solvent, wherein the weight percent of the urethane resin and the first organic solvent are based on the total weight of the first organic medium;
(b) 10-35 wt % second organic medium comprising 10-50 wt % thermoplastic phenoxy resin dissolved in 50-90 wt %…

Assignees

• Du Pont

Inventors

• Arancio Vincenzo
• Dorfman Jay Robert

Classifications

• H01B3/40

  Electricity · mapped topic

• C09D175/04

  Chemistry & Metallurgy · mapped topic

• H01B3/025

  Electricity · mapped topic

• C09K5/14 Primary

  Chemistry & Metallurgy · mapped topic

• H01B17/60

  Electricity · mapped topic