Temporary adhesive material for wafer processing, wafer processing laminate, and method for manufacturing thin wafer using same

Patent metadata

Field	Value
Publication number	US-9346990-B2
Application number	US-201514720223-A
Country	US
Kind code	B2
Filing date	May 22, 2015
Priority date	Jun 10, 2014
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

The invention is adhesive material for a wafer processing used for temporarily bonding a supporting substrate to wafer having a front surface includes circuit formed thereon and a back surface to be processed, including first temporary adhesive layer composed of a layer of a silicone-modified styrene base thermoplastic elastomer, and second temporary adhesive layer composed of a thermosetting polymer layer on first temporary adhesive layer, wherein layer is capable of releasably adhering to front surface of wafer, and layer is capable of releasably adhering to the supporting substrate. Thereby, it provides a temporary adhesive material for wafer processing, wafer processing lamination, and method for manufacturing thin wafer using same, which facilitates temporary adhesion between supporting substrate and wafer having a circuit, is highly compatible with steps of forming TSV and forming wiring on back surface of wafer, allows easy delamination, and is capable of increasing productivity of thin wafers.

First claim

The invention claimed is:

1. A temporary adhesive material for a wafer processing, the temporary adhesive material being used for temporarily bonding a supporting substrate to a wafer having a front surface including a circuit formed thereon and a back surface to be processed, comprising: a first temporary adhesive layer composed of a layer (A) of a silicone-modified styrene base thermoplastic elastomer; and a second temporary adhesive layer composed of a thermosetting polymer layer (B) laminated on the first temporary adhesive layer, wherein the layer (A) is capable of releasably adhering to the front surface of the wafer, and the layer (B) is capable of releasably adhering to the supporting substrate.

2. The temporary adhesive material for a wafer processing according to claim 1 , wherein the silicone-modified styrene base thermoplastic elastomer is a silicone-modified block copolymer, and a content of a styrene unit in the copolymer is in the range of 10 to 40% by mass.

3. The temporary adhesive material for a wafer processing according to claim 2 , wherein the silicone-modified styrene base thermoplastic elastomer contains a silicone unit represented by the following general formula (1),

wherein R 1 , R 2 , and R 3 independently represent a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; S, T, and U each are a single bond or a divalent siloxane structure represented by the following general formula (2), provided that at least one of S, T, and U is the divalent siloxane structure represented by the general formula (2),

wherein R 4 and R 5 independently represent a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; Me is a methyl group; “a” and “b” each are 0 or a positive number; and a+b is an integer of 1 or more.

4. The temporary adhesive material for a wafer processing according to claim 3 , wherein a 180° peeling force of a test piece having a width of 25 mm of the layer (A) of the silicone-modified styrene base thermoplastic elastomer is from 2 to 50 gf.

5. The temporary adhesive material for a wafer processing according to claim 3 , wherein the thermosetting polymer layer (B) is a cured layer of a composition containing 100 parts by mass of a siloxane bond-containing polymer having a repeating unit represented by the following general formula (3) and a weight average molecular weight of 3,000 to 500,000, and 0.1 to 50 parts by mass of a crosslinker selected from the group consisting of an amino condensate, a melamine resin, a urea resin each modified with formalin or formalin-alcohol, a phenol compound having on average two or more methylol or alkoxymethylol groups per molecule, and an epoxy compound having on average two or more epoxy groups per molecule,

wherein R 6 to R 9 may be the same or different, and represent a monovalent hydrocarbon group having 1 to 8 carbon atoms; “m” is an integer of 1 to 100; B is a positive number; A is 0 or a positive number; and X is a divalent organic group represented by the following general formula (4),

wherein Z represents a divalent organic group selected from any of

“n” represents 0 or 1; R 10 and R 11 each represent an alkyl or alkoxy group having 1 to 4 carbon atoms, and may be the same or different from each other; and “k” represents any of 0, 1, and 2.

6. The temporary adhesive material for a wafer processing according to claim 3 , wherein the thermosetting polymer layer (B) is a cured layer of a composition containing 100 parts by mass of a siloxane bond-containing polymer having a repeating unit represented by the following general formula (5) and a weight average molecular weight of 3,000 to 500,000, and 0.1 to 50 parts by mass of a crosslinker selected from the group consisting of a phenol compound having on average two or more phenol groups per molecule and an epoxy compound having on average two or more epoxy groups per molecule,

wherein R 6 to R 9 may be the same or different, and represent a monovalent hydrocarbon group having 1 to 8 carbon atoms; “m” is an integer of 1 to IOC; B is a positive number; A is 0 or a positive number; and Y is a divalent organic group represented by the following general formula (6),

wherein V represents a divalent organic group selected from any of

“p” represents 0 or 1; R 12 and R 13 each represent an alkyl or alkoxy group having 1 to 4 carbon atoms, and may be the same or different from each other; and “h” represents any of 0, 1, and 2.

7. The temporary adhesive material for a wafer processing according to claim 2 , wherein a 180° peeling force of a test piece having a width of 25 mm of the layer (A) of the silicone-modified styrene base thermoplastic elastomer is from 2 to 50 gf.

8. The temporary adhesive material for a wafer processing according to claim 2 , wherein the thermosetting polymer layer (B) is a cured layer of a composition containing 100 parts by mass of a siloxane bond-containing polymer having a repeating unit represented by the following general formula (3) and a weight average molecular weight of 3,000 to 500,000, and 0.1 to 50 parts by mass of a crosslinker selected from the group consisting of an amino condensate, a melamine resin, a urea resin each modified with formalin or formalin-alcohol, a phenol compound having on average two or more methylol or alkoxymethylol groups per molecule, and an epoxy compound having on average two or more epoxy groups per molecule,

wherein R 6 to R 9 may be the same or different, and represent a monovalent hydrocarbon group having 1 to 8 carbon atoms; “m” is an integer of 1 to 100; B is a positive number; A is 0 or a positive number; and X is a divalent organic group represented by the following general formula (4),

wherein Z represents a divalent organic group selected from any of

“n” represents 0 or 1; R 10 and R 11 each represent an alkyl or alkoxy group having 1 to 4 carbon atoms, and may be the same or different from each other; and “k” represents any of 0, 1, and 2.

9. The temporary adhesive material for a wafer processing according to claim 2 , wherein the thermosetting polymer layer (B) is a cured layer of a composition containing 100 parts by mass of a siloxane bond-containing polymer having a repeating unit represented by the following general formula (5) and a weight average molecular weight of 3,000 to 500,000, and 0.1 to 50 parts by mass of a crosslinker selected from the group consisting of a phenol compound having on average two or more phenol groups per molecule and an epoxy compound having o

Assignees

• Shinetsu Chemical Co

Inventors

• Yasuda Hiroyuki
• Sugo Michihiro

Classifications

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7412

  the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title