Device and method for arranging a component on a component carrier

Patent metadata

Field	Value
Publication number	US-9346141-B2
Application number	US-201013382657-A
Country	US
Kind code	B2
Filing date	Jul 7, 2010
Priority date	Jul 9, 2009
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

A joining device for arranging a component on a component carrier is disclosed. The joining device includes an application system for positioning the component in the joining device and a receptacle for clamping the component carrier in the joining device. The component is arranged on the component carrier by an adapter. A method for arranging the component on the component carrier is also disclosed.

First claim

The invention claimed is:

1. A method for arranging a component on a component carrier, comprising the steps of:
aligning and fixing the component carrier in a receptacle of a joining device;
positioning the component on an application system of the joining device, wherein the application system is configured on a side section of a base body of the joining device and wherein a base section of the base body of the joining device is supported on a work floor;
providing an adapter between the component and the component carrier, wherein the adapter has an L-shaped body with a contoured surface and a flat surface;
wherein the application system and at least a portion of the adapter are disposed on opposite sides of the component;
establishing an adhesive connection between the contoured surface of the adapter and the component while adjusting a target gap between the contoured surface of the adapter and the component;
establishing an adhesive connection between the flat surface of the adapter and the component carrier while maintaining the target gap between the contoured surface of the adapter and the component;
curing the adhesive connection between the contoured surface of the adapter and the component; and
curing the adhesive connection between the flat surface of the adapter and the component carrier.

2. The method according to claim 1 , wherein the curing steps include radiation.

3. The method according to claim 2 , wherein the radiation includes varying radiation.

Assignees

• Fessler-Knobel Martin
• Huttner Roland
• Mtu Aero Engines Gmbh

Inventors

• Fessler-Knobel Martin
• Huttner Roland

Classifications

• Y10T156/10

  Methods of surface bonding and/or assembly therefor · CPC title

• F01D5/28

  Selecting particular materials; {Particular measures relating thereto;} Measures against erosion or corrosion · CPC title

• F05D2230/50

  Building or constructing in particular ways · CPC title

• B23Q3/063

  for holding turbine blades · CPC title

• F16B11/006

  by gluing (gluing of plastics material B29C65/48) · CPC title