Vibrating device with workpiece receiving portion and compensating mass

Patent metadata

Field	Value
Publication number	US-9346139-B2
Application number	US-201214118440-A
Country	US
Kind code	B2
Filing date	May 18, 2012
Priority date	May 18, 2011
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

The invention relates to a device ( 1 ) and a method, comprising a workpiece-receiving portion ( 2 ) for receiving a workpiece ( 28 ) to be mechanically machined. At least one vibrating device ( 9 ) is connected to the workpiece-receiving portion ( 2 ), and the vibrating device ( 9 ) causes the workpiece-receiving portion ( 2 ) to vibrate, the vibration of the workpiece-receiving portion ( 2 ) having a frequency that is lower than the frequency of ultrasound. The vibrating device ( 9 ) has a vibrating body ( 8 ) to which a compensating mass ( 7 ) that vibrates in the opposite direction is associated.

First claim

The invention claimed is:

1. A device comprising:
a workpiece-receiving portion for receiving a workpiece to be mechanically machined during use; and
at least one vibrating device connected to the workpiece-receiving portion, the at least one vibrating device further defined as comprising a vibrating body associated with a compensating mass;

wherein, during use, the vibrating device causes the workpiece-receiving portion to vibrate at a frequency that is lower than that of ultrasound and the vibrating body rotates in an opposite direction from the compensating mass.

2. The device of claim 1 , wherein the frequency of the vibration of the workpiece-receiving portion is between 500 Hz and 50 Hz during use.

3. The device of claim 1 , wherein the compensating mass vibrates at the same frequency as and with a higher amplitude than the vibrating body during use.

4. The device of claim 1 , wherein the vibrating device comprises at least one piezo element.

5. The device of claim 4 , comprising at least two piezo elements having directions of movement that move the vibrating body in a plane during use.

6. The device of claim 5 , wherein the at least two piezo elements are arranged vertically.

7. The device of claim 4 , wherein substantially a same type and number of piezo elements engage the compensating mass and the vibrating body.

8. The device of claim 4 , further comprising a control and/or regulating device that controls and/or regulates opposite movements of the piezo elements associated to the vibrating body and the piezo elements associated to the compensating mass, during use.

9. The device of claim 8 , further comprising distance and/or acceleration sensors are associated with the vibrating body and the compensating mass, wherein during use values of distance and/or acceleration are supplied to the control and/or regulating device as actual values.

10. The device of claim 1 , further comprising at least one air bearing supporting the vibrating body and/or the compensating mass.

11. The device of claim 1 , further comprising a plate-shaped workpiece-receiving portion that comprises a cover plate supported by a base body.

12. The device of claim 11 , wherein the plate-shaped workpiece-receiving portion is supported on the cover plate of the base body by an air bearing.

13. The device of claim 11 , further comprising a counter plate firmly connected to the plate-shaped workpiece-receiving portion, wherein the compensating mass is arranged between the plate-shaped workpiece-receiving portion and the counter plate.

14. The device of claim 1 , wherein the device is comprised on a positioning device up to five axes of the positioning device are adjustable.

15. The device of claim 1 , wherein at least one vibrating direction (x′, y′, z′) of the vibrating device deviates from a direction of movement of a chip-removing tool during use.

16. The device of claim 15 , wherein the chip-removing tool is further defined as milling tool.

17. The device of claim 1 , further defined as a chip-removing machine that is cooled by a cooling liquid and/or a cooling grease during use.

18. The device of claim 17 , further defined as a milling tool.

19. A method for mechanically machining a workpiece comprising:
causing the workpiece to vibrate at a lower than ultrasound; and
actively decoupling momentum introduced into the workpiece by the vibration.

20. The method of claim 19 , wherein the frequency of the vibration of the workpiece is between 500 Hz and 50 Hz.

Assignees

• Bleicher Friedrich
• Bernreiter Johannes
• Univ Wien Tech

Inventors

• Bleicher Friedrich
• Bernreiter Johannes

Classifications

• B23Q1/64

  characterised by the purpose of the movement (indexing equipment B23Q16/02) · CPC title

• Y10T409/30896

  with angular adjustment · CPC title

• B23Q3/10

  Auxiliary devices, e.g. bolsters, extension members {(devices for holding usually unilaterally-held tools at a second side, devices supporting a workpiece against cutting forces B23Q1/76)} · CPC title

• Y10T409/30868

  Work support · CPC title

• B24B41/007 Primary

  Weight compensation; Temperature compensation; Vibration damping · CPC title