Laser processing head, laser processing apparatus, optical system of laser processing apparatus, laser processing method, and laser focusing method

US9346126B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9346126-B2
Application numberUS-201113982790-A
CountryUS
Kind codeB2
Filing dateMay 30, 2011
Priority dateMay 30, 2011
Publication dateMay 24, 2016
Grant dateMay 24, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A laser cutting apparatus ( 10 ) includes a laser processing head ( 15 ) that receives a laser beam emitted by a laser oscillator ( 12 ) and that uses a spherical lens for converging the laser beam so as to cause the intensity distribution of the laser beam to have a caldera-like shape, in which the intensity of the laser beam is higher in a peripheral area than in a central area, at the position of a workpiece ( 20 ). Moreover, the laser processing head ( 15 ) radiates the laser beam whose focal position is displaced from the position of the workpiece ( 20 ) to the workpiece ( 20 ). Therefore, the laser cutting apparatus ( 10 ) performs an inversion on the laser beam by using the spherical aberration of the spherical lens. Consequently, with a simple configuration, a laser beam whose inner area and outer area are inverted at the position of the workpiece ( 2 ) can be generated, and the processing direction for processing the workpiece ( 20 ) is not limited.

First claim

Opening claim text (preview).

The invention claimed is: 1. An optical system for a laser processing apparatus that processes a workpiece by using a laser beam emitted by a laser oscillator, the optical system comprising: a focusing unit that includes a converging lens located in a traveling direction of the laser beam and a concave lens located downstream of the converging lens in the traveling direction of the laser beam, and that is configured to focus the laser beam into a circular shape, wherein the focal position of the laser beam is displaced from the position of the workpiece, wherein a central area of the laser beam is inverted to a peripheral area thereof at a position of the workpiece and the peripheral area of the laser beam is inverted to the central area at the position of the workpiece by utilizing spherical aberration of the concave lens, and wherein intensity distribution of the laser beam has a shape, in which the intensity of the laser beam is higher in a peripheral area than in a central area, at a position of the workpiece. 2. A laser processing head for a laser processing apparatus that processes a workpiece by irradiating the workpiece with a laser beam, the laser processing head comprising the optical system according to claim 1 . 3. The laser processing head according to claim 2 , wherein the intensity distribution of the laser beam at the position of the workpiece is ring-shaped. 4. The laser processing head according to claim 2 , wherein the intensity distribution of the laser beam at the position of the workpiece is non-ring-shaped. 5. The laser processing head according to claim 4 , wherein the intensity distribution of the laser beam at the position of the workpiece has a peak in the central area. 6. The laser processing head according to claim 2 , wherein the laser beam has a focal depth of 1 mm or more at the position of the workpiece. 7. The laser processing head according to claims 2 , wherein the steepness of a side surface of the intensity distribution of the laser beam is 10% or more higher in the laser beam when having the shape than in the laser beam prior to having the shape. 8. The laser processing head according to claims 2 , wherein a positional relationship between the focal position of the laser beam and a position where the intensity distribution of the laser beam becomes the shape is adjustable by changing at least one of the curvature of the converging lens and the curvature of the concave lens. 9. A laser processing apparatus comprising: a laser oscillator that emits a laser beam; the laser processing head according to claim 2 , which receives the laser beam emitted by the laser oscillator; and a stage on which a workpiece is placed and that moves relative to the laser processing head. 10. A laser focusing method for a laser processing apparatus that processes a workpiece by using a laser beam emitted by a laser oscillator, the laser focusing method comprising: providing a converging lens in a traveling direction of the laser beam and a concave lens downstream of the converging lens in the traveling direction of the laser beam so that the focal position of the laser beam is displaced from the position of the workpeice and so that the laser beam is focused into a circular shape; and inverting a central area of the laser beam to a peripheral area thereof at a position of the workpiece and inverting the peripheral area of the laser beam to the central area at the position of the workpiece by utilizing spherical aberration of the concave lens. 11. A laser processing method of processing a workpiece by irradiating the workpiece with a laser beam focused by using the laser focusing method according to claim 10 .

Assignees

Inventors

Classifications

  • by boring or cutting · CPC title

  • Optical focusing aids · CPC title

  • into an annular shape · CPC title

  • by beam condensation on the workpiece, e.g. for focusing · CPC title

  • comprising lenses · CPC title

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What does patent US9346126B2 cover?
A laser cutting apparatus ( 10 ) includes a laser processing head ( 15 ) that receives a laser beam emitted by a laser oscillator ( 12 ) and that uses a spherical lens for converging the laser beam so as to cause the intensity distribution of the laser beam to have a caldera-like shape, in which the intensity of the laser beam is higher in a peripheral area than in a central area, at the positi…
Who is the assignee on this patent?
Watanabe Masao, Tsubota Shuho, Mitsubishi Heavy Ind Ltd
What technology area does this patent fall under?
Primary CPC classification B23K26/0648. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 24 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).