Lead with textured insulative layer

US9345873B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9345873-B2
Application numberUS-201313957970-A
CountryUS
Kind codeB2
Filing dateAug 2, 2013
Priority dateAug 14, 2012
Publication dateMay 24, 2016
Grant dateMay 24, 2016

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Described is a medical device lead including a lead body having a conductor lumen including an inner surface. The lead also includes a conductor assembly extending through the conductor lumen; the conductor assembly comprising a conductor member and an outer insulative layer; and an electrode coupled to the conductor cable. The outer insulative layer includes a textured external surface that reduces the coefficient of friction between the outer insulative layer and the inner surface of the conductor lumen through which the conductor assembly extends. Methods of forming the conductor assembly are also described.

First claim

Opening claim text (preview).

We claim: 1. An implantable medical lead comprising: a lead body having a conductor lumen having a substantially smooth inner surface; a conductor assembly extending through the conductor lumen, the conductor assembly including a conductor member and an outer insulative layer disposed about the conductor member, the outer insulative layer including a textured external surface; and an electrode on the lead body coupled to the conductor member, wherein the textured external surface has a surface roughness average greater than 16 microinches and the inner surface of the conductor lumen has a surface roughness average less than 10 microinches. 2. The implantable medical lead of claim 1 , wherein the textured external surface includes a plurality of raised surface features. 3. The implantable medical lead of claim 2 , wherein the plurality of raised surface features extend longitudinally along the conductor assembly. 4. The implantable medical lead of claim 2 , wherein the raised surface features extend in a helical pattern longitudinally along the conductor assembly. 5. The implantable medical lead of claim 1 , wherein the outer insulative layer comprises a polymeric element extruded about the conductor member. 6. The implantable medical lead of claim 1 , wherein the outer insulative layer comprises a polymeric element molded about the conductor member. 7. The implantable medical lead of claim 1 , wherein the outer insulative layer has a cross-sectional shape defined by a plurality of generally flat surface segments arranged about a longitudinal axis of the conductor assembly, with a ridge disposed between adjacent generally flat surface segments. 8. The implantable medical lead of claim 1 , wherein the conductor member comprises a multi-strand cable or wire coil about which the outer insulative layer is extruded. 9. A method of forming an implantable medical lead, the method comprising: forming a conductor assembly by extruding a tubular polymeric outer insulative layer over a conductor member through an extrusion die configured to form a textured external surface on the outer insulation layer; disposing the conductor assembly within a conductor lumen of an insulative lead body, wherein the conductor lumen has a substantially smooth inner surface; and coupling an electrode to the conductor member and the lead body, wherein the textured external surface of the outer insulative layer is configured to minimize frictional forces between the textured external surface and the inner surface of the conductor lumen, wherein the textured external surface has a surface roughness average greater than 16 microinches and the inner surface of the conductor lumen has a surface roughness average less than 10 microinches. 10. The method of claim 9 , wherein forming the conductor assembly includes extruding the tubular polymeric outer insulative layer having a cross-sectional shape defined by a plurality of generally flat surface segments arranged about a longitudinal axis of the conductor assembly, with a ridge disposed between adjacent generally flat surface segments. 11. The method of claim 9 , wherein the textured external surface is characterized in part by a plurality raised surface features that extend longitudinally along the conductor assembly. 12. The method of claim 9 , wherein the textured external surface is characterized in part by a plurality of raised surface features that extend in a helical pattern longitudinally along the conductor assembly. 13. A method of forming an implantable medical lead, the method comprising the steps of: disposing a tubular-shaped polymeric outer insulative layer onto a conductor member; adding a surface texture to at least a portion of an outer surface of the outer insulative layer; disposing the conductor member with the outer insulative layer disposed thereon within a conductor lumen of an insulative lead body, wherein the conductor lumen has a substantially smooth inner surface; and coupling an electrode to the conductor member and the lead body, wherein the surface texture is configured to minimize friction between the outer insulative layer and the inner surface of the conductor lumen, wherein the textured external surface has a surface roughness average greater than 16 microinches and the inner surface of the conductor lumen has a surface roughness average less than 10 microinches. 14. The method of claim 13 , wherein the step of adding the surface texture to the outer surface of the outer insulative layer comprises passing the conductor member and insulative layer together through a die that is configured to add the surface texture to the outer surface of the outer insulative layer. 15. The method of claim 13 , wherein the texture includes a plurality of raised surface features. 16. The method of claim 13 , wherein the step of adding the surface texture to at least a portion of the outer surface of the outer insulative layer includes forming the outer insulative layer having a cross-sectional shape defined by a plurality of generally flat surface segments arranged about a longitudinal axis of the conductor assembly, with a ridge disposed between adjacent generally flat surface segments. 17. The method of claim 13 , wherein the step of disposing the outer insulative layer onto the conductor member includes extruding the outer insulative layer onto the conductor member. 18. The method of claim 13 , wherein the step of disposing the outer insulative layer onto the conductor member includes molding the outer insulative layer onto the conductor member. 19. The method of claim 13 , wherein the conductor member comprises a multi-strand cable.

Assignees

Inventors

Classifications

  • Assembling terminal to elongated conductor · CPC title

  • specially adapted for defibrillation or cardioversion · CPC title

  • for manufacturing contact members, e.g. by punching and by bending · CPC title

  • A61N1/05Primary

    for implantation or insertion into the body, e.g. heart electrode (A61N1/06 takes precedence) · CPC title

  • Coating solid articles, i.e. non-hollow articles · CPC title

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What does patent US9345873B2 cover?
Described is a medical device lead including a lead body having a conductor lumen including an inner surface. The lead also includes a conductor assembly extending through the conductor lumen; the conductor assembly comprising a conductor member and an outer insulative layer; and an electrode coupled to the conductor cable. The outer insulative layer includes a textured external surface that re…
Who is the assignee on this patent?
Cardiac Pacemakers Inc
What technology area does this patent fall under?
Primary CPC classification A61N1/05. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue May 24 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).