Circuit board, electronic device, and production method for circuit board
US-12156346-B2 · Nov 26, 2024 · US
US9345139B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9345139-B2 |
| Application number | US-201213490245-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 6, 2012 |
| Priority date | Jun 28, 2007 |
| Publication date | May 17, 2016 |
| Grant date | May 17, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
The use of a control module having at least one housing part and a multi-layer printed circuit board as the electrical connection between the inner space of the housing and components that are situated outside of the housing part is described. The multi-layer printed circuit board is the carrier for the electrical components of an electronic circuit, and is at the same time the thermal contacting to a housing part and/or a cooling element, particularly a hydraulic plate of the transmission, for a transmission control installed in an automatic transmission.
Opening claim text (preview).
What is claimed is: 1. A control module of a transmission control, comprising: a multi-layer printed circuit board having a first side and a second side; a first housing part covering the first side and a second housing part covering the second side; electrical components forming an electrical circuit and situated on the multi-layer printed circuit board; and one of a casting compound, a molding compound, a foam, and a gel for covering the electrical components of the electrical circuit, wherein: the multi-layer printed circuit board connects the electrical components situated in an inner space of at least one of the first and second housing parts and contact points for contacting at least one further electrical component, the contact points being situated on the multi-layer printed circuit board outside an area covered by the first and second housing parts, the multi-layer printed circuit board thermally contacts a cooling element, and the cooling element is a hydraulic plate of a transmission for a transmission control installed in an automatic transmission. 2. The control module according to claim 1 , wherein the multi-layer printed circuit board includes through-contacts configured for the thermal contacting to the cooling element. 3. The control module according to claim 1 , wherein the multi-layer printed circuit board includes through-contacts configured for the electrical connection to the at least one further component situated outside of at least one of the first and second housing parts. 4. The control module according to claim 1 , wherein the multilayer printed circuit board is designed as one piece. 5. The control module according to claim 1 , wherein the electrical connecting of the at least one further electrical component situated outside of at least one of the first and second housing parts includes one of press-in contacts, soldered contacts, and spring contacts. 6. The control module according to claim 1 , wherein the electrical components that form the electronic circuit are mounted on the multi-layer printed circuit board.
Mounted on an edge · CPC title
Shields or metal cases · CPC title
Non-printed connector · CPC title
Electronic control units for transmission control, e.g. connectors, casings or circuit boards · CPC title
with encapsulating, e.g., potting, etc. · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.