Printed wiring board

Patent metadata

Field	Value
Publication number	US-9345134-B2
Application number	US-201414335700-A
Country	US
Kind code	B2
Filing date	Jul 18, 2014
Priority date	Mar 14, 2014
Publication date	May 17, 2016
Grant date	May 17, 2016

Abstract

According to one embodiment, a printed wiring board includes a circuit board, a ground pattern provided on the circuit board, a wiring pattern provided on the circuit board, a conductive reinforcing plate covering the ground pattern and the wiring pattern and electrically connected with the ground pattern, and an insulating portion provided between the conductive reinforcing plate and the wiring pattern.

First claim

What is claimed is:

1. A printed wiring board, comprising:
a circuit board having a first surface;
a ground pattern provided on the first surface of the circuit board;
a wiring pattern provided on the first surface of the circuit board, through which a signal or power is to be supplied, the wiring pattern including a first pattern disposed between the ground pattern and a first edge of the circuit board, and a second pattern disposed separately from the first pattern and between the ground pattern and a second edge of the circuit board that is different from the first edge;
a conductive reinforcing plate covering the ground pattern and the wiring pattern, and electrically connected with the ground pattern; and
an insulating adhesive member provided between the conductive reinforcing plate and the wiring pattern, and adhesively bonding the circuit board and the conductive reinforcing plate.

2. The printed wiring board of claim 1 , wherein the ground pattern is disposed at a center region of the insulating adhesive member on the first surface.

3. The printed wiring board of claim 2 , further comprising:
a conductive adhesive member provided between the conductive reinforcing plate and the ground pattern at the center region of the insulating adhesive member, and the circuit board and the conductive reinforcing plate are further adhesively bonded together by the conductive adhesive member.

4. The printed wiring board of claim 3 , wherein the insulating adhesive member has an opening, and
the conductive adhesive member is disposed inside the opening of the insulating adhesive member.

5. The printed wiring board of claim 4 , wherein
a part of the conductive adhesive member extends between the insulating adhesive member and the conductive reinforcing plate.

6. The printed wiring board of claim 1 , wherein
the conductive reinforcing plate has a convex portion which projects toward the ground pattern.

7. The printed wiring board of claim 6 , wherein
the insulating adhesive member has an opening, and
the convex portion is received in the opening of the insulating adhesive member.

8. The printed wiring board of claim 6 , wherein
the convex portion is in contact with the ground pattern.

9. The printed wiring board of claim 8 , wherein
the insulating adhesive member provides an internal pulling force between the conductive reinforcing plate and the circuit board, so that contact between the convex portion and the ground pattern is maintained.

10. A printed wiring board, comprising;
a circuit board;
a ground pattern provided on the circuit board;
a wiring pattern provided on the circuit board;
a conductive reinforcing plate covering the ground pattern and the wiring pattern, and electrically connected with the ground pattern; and
an insulating member provided between the conductive reinforcing plate and the wiring pattern, wherein the ground pattern is disposed at a center region of the insulating member.

11. The printed wiring board of claim 10 , wherein the insulating member surrounds the ground pattern.

12. The printed wiring board of claim 11 , further comprising:
a conductive adhesive member provided between the conductive reinforcing plate and the ground pattern at the center region of the insulating adhesive member.

13. The printed wiring board of claim 11 , wherein the conductive reinforcing plate includes a portion extending towards the ground pattern.

14. The printed wiring board of claim 10 , wherein the insulating member provided between the conductive reinforcing plate and the wiring pattern provides a force to bias at least a portion of the conductive reinforcing plate to contact the wiring pattern.

15. A method of preparing a wiring board, comprising:
providing a printed circuit board having at least a ground layer and a wiring layer on the same surface of the printed circuit board, wherein the wiring layer includes a first layer located between the ground layer and a first edge of the printed circuit board, and a second layer located separately from the first layer and between the ground layer and a second edge of the printed circuit board that is different from the first edge;
providing an electrically insulating, adhesive layer so as to cover the ground layer;
positioning a conductive plate in an overlying juxtaposition to the electrically insulating, adhesive layer, such that the electrically insulating, adhesive layer is positioned between the printed circuit board and the conductive plate; and
pressing the conductive plate and the printed circuit board, in a direction toward each other.

16. The method of claim 15 , further comprising:
positioning a conductive adhesive between the ground layer and the conductive plate before the pressing of the conductive plate and the printed circuit board toward each other.

17. The method of claim 16 , wherein the conductive adhesive is positioned, such that the electrically insulating, adhesive layer surrounds the conductive adhesive.

18. The method of claim 16 , wherein the electrically insulating, adhesive layer includes an opening through which the ground layer is exposed, and a portion of the conductive plate extends through the opening and contacts the ground layer, when the conductive plate and the printed circuit board are pressed.

19. The method of claim 15 , wherein the printed circuit board is flexible and the conductive plate is rigid.

Assignees

• Toshiba Kk

Inventors

• Happoya Akihiko
• Suzuki Daigo

Classifications

• H05K2201/09036

  Recesses or grooves in insulating substrate · CPC title

• H05K1/0298 Primary

  Multilayer circuits · CPC title

• Y10T29/49155

  Manufacturing circuit on or in base · CPC title

• H05K3/10

  in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title