Adhesive film and method for encapsulating organic electronic device using same

Patent metadata

Field	Value
Publication number	US-9343702-B2
Application number	US-201514609172-A
Country	US
Kind code	B2
Filing date	Jan 29, 2015
Priority date	Aug 2, 2012
Publication date	May 17, 2016
Grant date	May 17, 2016

Abstract

The present invention relates to an adhesive film, to an encapsulated product of an organic electronic device using same and to a method for encapsulating an organic electronic device using same. More particularly, an adhesive film for encapsulating an organic electronic device comprises: a protective film layer, a first adhesive layer, a second adhesive layer and a release film layer sequentially arranged. The peel strength (A) between the first adhesive layer and the protective film layer is lower than the peel strength (B) between the second adhesive layer and the release film layer, and the peel strength (B) between the second adhesive layer and the release film layer is lower than the peel strength (C) between the first adhesive layer and an encapsulation substrate, thus improving faults during a peeling process.

First claim

The invention claimed is:

1. An adhesive film for encapsulating an organic electronic element, comprising:
a protection film;
a first adhesive layer formed on the protection film;
a second adhesive layer formed on the first adhesive layer; and
a release film formed on the second adhesive layer,
wherein the first and second adhesive layers satisfy the following General Equation 1 and General Equation 2,
C>B>A,   [General Equation 1]

wherein A represents a peeling strength between the first adhesive layer and the protection film, B represents a peeling strength between the second adhesive layer and the release film, and C represents a peeling strength between the first adhesive layer and an encapsulation substrate after the protection film is removed, and
B−A≧ 5gf/25 mm.  [General Equation 2]

2. The adhesive film for encapsulating an organic electronic element of claim 1 , wherein the first and second adhesive layers satisfy the following General Equation 3:
C−B≧ 16gf/25 mm.  [General Equation 3]

3. The adhesive film for encapsulating an organic electronic element of claim 1 , wherein at least one of the first and second adhesive layers comprises a moisture adsorbent and/or a filler component.

4. The adhesive film for encapsulating an organic electronic element of claim 1 , wherein the first adhesive layer or the second adhesive layer comprises an acrylic resin, a polyester resin, an isocyanate resin, or an epoxy resin.

5. The adhesive film for encapsulating an organic electronic element of claim 4 , wherein the first adhesive layer or the second adhesive layer further comprises a surface additive.

6. The adhesive film for encapsulating an organic electronic element of claim 5 , wherein the surface additive is a vinyl based, an amino based, an epoxy based, or methacryloxy based silane coupling agents; polyester-modified acryl; polyurethane; or an acrylic resin.

7. The adhesive film for encapsulating an organic electronic element of claim 4 , wherein the first adhesive layer further comprises a high molecular weight resin having a softening point of 40° C. or more.

8. The adhesive film for encapsulating an organic electronic element of claim 7 , wherein the high molecular weight resin has a weight average molecular weight of 20,000 or more.

9. The adhesive film for encapsulating an organic electronic element of claim 8 , wherein the high molecular weight resin is one or more selected from the group consisting of a phenoxy resin, an acrylate resin, an epoxy resin, a rubber having a polar functional group, and a reactive rubber having a polar functional group.

10. A method of encapsulating an organic electronic element, comprising:
peeling the protection film from the adhesive film of claim 1 ;
attaching the first adhesive layer to the encapsulating substrate;
peeling the release film; and
laminating the second adhesive film to be in contact with an organic electronic element.

11. The method of claim 10 , wherein the attaching of the first adhesive layer to the encapsulating substrate is performed such that the peeling strength C between the first adhesive layer and the encapsulation substrate, and the peeling strength B between the second adhesive layer and the release film satisfy the following General Equation 3:
C−B≧ 16gf/25 mm.  [General Equation 3]

12. The method of claim 10 , wherein the attaching of the first adhesive layer to the encapsulating substrate comprises laminating the first adhesive layer to the encapsulating substrate at a temperature of 40° C. to 100° C.

13. The method of claim 12 , wherein the laminating is performed such that the second adhesive layer covers the entire surface of the organic electronic element.

14. An organic electronic device, comprising:
a substrate;
an organic electronic element formed on the substrate; and
an adhesive film encapsulating the organic electronic element,
wherein the adhesive film comprises the first adhesive layer and the second adhesive layer of claim 1 .

15. The organic electronic device of claim 14 , wherein the second adhesive layer of the adhesive film covers the entire surface of the organic electronic element.

Assignees

• Lg Chemical Ltd

Inventors

• Bae Kyung Yul
• Yoo Hyun Jee
• Lee Seung Min
• Cho Yoon Gyung
• Chang Suk Ky
• Shim Jung Sup

Classifications

• H10K50/844

  Encapsulations · CPC title

• B32B37/025 Primary

  Transfer laminating · CPC title

• B32B37/12

  characterised by using adhesives · CPC title

• C09J7/00

  Adhesives in the form of films or foils · CPC title

• C09J2201/622

  Chemistry & Metallurgy · mapped topic