Encapsulation housing and LED module with the same

Patent metadata

Field	Value
Publication number	US-9343632-B2
Application number	US-201214124255-A
Country	US
Kind code	B2
Filing date	May 11, 2012
Priority date	Jun 7, 2011
Publication date	May 17, 2016
Grant date	May 17, 2016

Abstract

An encapsulation housing for a LED module, may include an upper housing and a lower housing joined together and defining together a cavity, wherein at least one of the upper housing and the lower housing has an inner partition wall partitioning the cavity into an assembly cavity and an anti-leakage cavity encircling the assembly cavity.

First claim

The invention claimed is:

1. An encapsulation housing for a LED module, having an upper housing and a lower housing joined together and defining together a cavity, wherein at least one of the upper housing and the lower housing has an inner partition wall partitioning the cavity into an assembly cavity and an anti-leakage cavity encircling the assembly cavity,
wherein the upper housing has a first bottom wall and the lower housing has a second bottom wall, the inner partition wall consists of a first inner partition wall portion extending from the first bottom wall and a second inner partition wall portion extending from the second bottom wall, and contact surfaces of the first inner partition wall portion and the second inner partition wall portion form a first anti-leakage surface extending from the assembly cavity to the anti-leakage cavity,
wherein at least one of the upper housing and the lower housing further has a lateral wall extending from the first bottom wall and/or the second bottom wall, such that the upper housing and the lower housing join together to form the cavity,
wherein the lateral wall consists of a first lateral wall portion formed on the upper housing and a second lateral wall portion formed on the lower housing, and contact surfaces of the first lateral wall portion and the second lateral wall portion form a second anti-leakage surface extending from the anti-leakage cavity to ambient environment,
wherein the second anti-leakage surface is higher than the first anti-leakage surface.

2. The encapsulation housing according to claim 1 , wherein a potting hole and an exhaust hole respectively penetrating into the assembly cavity are formed on the second bottom wall of the lower housing.

3. The encapsulation housing according to claim 2 , wherein the second anti-leakage surface is higher than a surface of bottom wall of the lower housing provided with the potting hole and the exhaust hole and defining the assembly cavity.

4. The encapsulation housing according to claim 2 , wherein the first lateral wall portion or the second lateral wall portion is provided with a recess part, and the second lateral wall portion or the first lateral wall portion is provided with a protrusion part shaped to adaptively engage the recess part.

5. The encapsulation housing according to claim 1 , wherein a lateral wall guide wire hole and an inner partition wall guide wire hole are formed on the lateral wall and the inner partition wall, respectively, and the lateral wall guide wire hole and the inner partition wall guide wire hole have a cross section corresponding to the cross section of the guide wire, respectively.

6. The encapsulation housing according to claim 5 , wherein the lateral wall guide wire hole is formed by joining the recesses which are respectively formed on the contact surfaces of the first lateral wall portion and the second lateral wall portion, and the inner partition wall guide wire hole is formed by joining the recesses which are respectively formed on the contact surfaces of the first inner partition wall portion and the second inner portion wall portion.

7. The encapsulation housing according to claim 1 , wherein the first lateral wall portion or the second lateral wall portion has a fixing channel, and the second lateral wall portion or the first lateral wall portion has a fixing hook fixable into the fixing channel.

8. An LED module, wherein the LED module has an encapsulation housing, having an upper housing and a lower housing joined together and defining together a cavity, wherein at least one of the upper housing and the lower housing has an inner partition wall partitioning the cavity into an assembly cavity and an anti-leakage cavity encircling the assembly cavity,
wherein the upper housing has a first bottom wall and the lower housing has a second bottom wall, the inner partition wall consists of a first inner partition wall portion extending from the first bottom wall and a second inner partition wall portion extending from the second bottom wall, and contact surfaces of the first inner partition wall portion and the second inner partition wall portion form a first anti-leakage surface extending from the assembly cavity to the anti-leakage cavity,
wherein at least one of the upper housing and the lower housing further has a lateral wall extending from the first bottom wall and/or the second bottom wall, such that the upper housing and the lower housing join together to form the cavity,
wherein the lateral wall consists of a first lateral wall portion formed on the upper housing and a second lateral wall portion formed on the lower housing, and contact surfaces of the first lateral wall portion and the second lateral wall portion form a second anti-leakage surface extending from the anti-leakage cavity to ambient environment,
wherein the second anti-leakage surface is higher than the first anti-leakage surface.

9. The LED module according to claim 8 , wherein a potting hole and an exhaust hole respectively penetrating into the assembly cavity are formed on the second bottom wall of the lower housing.

10. The LED module according to claim 9 , wherein the second anti-leakage surface is higher than a surface of bottom wall of the lower housing provided with the potting hole and the exhaust hole and defining the assembly cavity.

11. The LED module according to claim 9 , wherein the first lateral wall portion or the second lateral wall portion is provided with a recess part, and the second lateral wall portion or the first lateral wall portion is provided with a protrusion part shaped to adaptively engage the recess part.

12. The LED module according to claim 8 , wherein a lateral wall guide wire hole and an inner partition wall guide wire hole are formed on the lateral wall and the inner partition wall, respectively, and the lateral wall guide wire hole and the inner partition wall guide wire hole have a cross section corresponding to the cross section of the guide wire, respectively.

13. The LED module according to claim 12 , wherein the lateral wall guide wire hole is formed by joining the recesses which are respectively formed on the contact surfaces of the first lateral wall portion and the second lateral wall portion, and the inner partition wall guide wire hole is formed by joining the recesses which are respectively formed on the contact surfaces of the first inner partition wall portion and the second inner portion wall portion.

14. The LED module according to claim 8 , wherein the first lateral wall portion or the second lateral wall portion has a fixing channel, and the second lateral wall portion or the first lateral wall portion has a fixing hook fixable into the fixing channel.

Assignees

• Feng Yaojun
• He Yuanyuan
• He Yubao
• Yang Canbang
• Osram Gmbh

Inventors

• Feng Yaojun
• He Yuanyuan
• He Yubao
• Yang Canbang

Classifications

• H10H20/036

  of packages · CPC title

• H10H20/8506 Primary

  Containers · CPC title

• H01L2924/0002

  Electricity · mapped topic

• B29C65/54

  between pre-assembled parts · CPC title

• F21V15/01

  Housings, e.g. material or assembling of housing parts (F21V15/02 takes precedence {housings forming signs or letters G09F13/04}) · CPC title