Optically pumped sensors or references with die-to-package cavities

Patent metadata

Field	Value
Publication number	US-9343447-B2
Application number	US-201514697834-A
Country	US
Kind code	B2
Filing date	Apr 28, 2015
Priority date	Sep 26, 2014
Publication date	May 17, 2016
Grant date	May 17, 2016

Abstract

An optoelectronic packaged device includes stacked components within a package including a package substrate providing side and a bottom wall. The stacked components includes a comb structure on the bottom wall formed from a material having a thermal resistance > a substrate material for the bottom die providing spaced apart teeth separated by gaps. The bottom die has a top surface including electrical trace(s) and a light source die for emitting light coupled to the electrical trace and a bottom surface on the comb structure. A first cavity die is on the top surface of the bottom die or on legs of the package which extend above the bottom wall. An optics die is on the first cavity die, a second cavity die is on a sealing die which is on the optics die, and a photodetector (PD) die is optically coupled to receive light from the light source die.

First claim

The invention claimed is:

1. A stacked optoelectronic packaged device (packaged device), comprising:
a plurality of stacked components within a package comprising a package substrate providing side walls and a bottom wall for said package, and a lid for sealing a top of said package, said plurality of stacked components including:
a comb structure on said bottom wall comprising a material having a thermal resistance above that of a substrate material for a bottom die comprising a plurality of spaced apart teeth separated by gaps;
said bottom die having a top surface including thereon at least one electrical trace and a light source die for emitting light coupled to said electrical trace and a bottom surface on said comb structure;
a first cavity die on said top surface of said bottom die or on legs of said package which extend above said bottom wall;
an optics die on said first cavity die;
a sealing die on said optics die;
a second cavity die on said sealing die, and
a photodetector (PD) die optically coupled to receive said light originating from said light source die.

2. The packaged device of claim 1 , wherein said package substrate further provides said legs, said first cavity die is on said legs, said first cavity die has patterned grooves on its top side and bottom side faces, and a size of said bottom die is <½ an area of said stacked optoelectronic packaged device.

3. The packaged device of claim 1 , wherein said second cavity die includes a secondary cavity region outside a primary cavity region.

4. The packaged device of claim 1 , wherein said first cavity die, said optics die and said second cavity die all comprise thermally insulating materials.

5. The packaged device of claim 4 , wherein said substrate material comprises a thermally insulating material.

6. The packaged device of claim 1 , further comprising at least one optical device on said second cavity die.

7. The packaged device of claim 1 , wherein said comb structure is an inner comb structure, further comprising a secondary cavity region outside said inner comb structure.

8. A method of forming a stacked optoelectronic packaged device (packaged device), comprising:
providing a package comprising a package substrate providing side walls and a bottom wall;
positioning a bottom die having a bottom surface with a comb structure thereon comprising a material having a thermal resistance above that of a substrate material for said bottom die comprising a plurality of spaced apart teeth separated by gaps onto said bottom wall of said package, wherein said bottom die has a top surface including at least one electrical trace and a light source die for emitting light thereon;
positioning a first cavity die onto said top surface of said bottom die or to legs of said package which extend above said bottom wall;
positioning an optics die on said first cavity die, a sealing die on said optics die, and a second cavity die on said sealing die;
positioning a photodetector (PD) die in a location to be coupled to receive said light originating from said light source die;
creating a vacuum within said package, and
sealing a lid on a top of said side walls for sealing said package under said vacuum.

9. The method of claim 8 , wherein said package substrate further provides said legs, wherein said first cavity die is positioned on said legs, and wherein a size of said bottom die is <½ an area of said stacked optoelectronic packaged device, further comprising:
forming patterned grooves on top side and bottom side faces said first cavity die before said positioning said first cavity die.

10. The method of claim 8 , further comprising positioning at least one optical device on said second cavity die.

11. The method of claim 8 , further comprising forming a secondary cavity region outside a primary cavity region for said second cavity die.

12. The method of claim 8 , wherein said first cavity die, said optics die and said second cavity die all comprise thermally insulating materials.

13. The method of claim 12 , wherein said substrate material comprises a thermally insulating material.

14. The method of claim 8 , wherein said PD die is mounted on a base portion of an inner package that is inside said package, said inner package having an open top opposite said base portion that faces said bottom wall of said package.

15. The method of claim 8 , wherein there is a second material structure outside said comb structure comprising a material different from said substrate material which provides mechanical support during said method, further comprising removing said second material structure using a dry etch or ash process before sealing said lid.

Assignees

• Texas Instruments Inc

Inventors

• Parsa Roozbeh
• French William

Classifications

• H10W72/07254

  changes in dispositions · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title

• H10W72/247

  Dispositions of multiple bumps · CPC title