Semiconductor device

Patent metadata

Field	Value
Publication number	US-9343384-B2
Application number	US-201514645283-A
Country	US
Kind code	B2
Filing date	Mar 11, 2015
Priority date	Sep 16, 2014
Publication date	May 17, 2016
Grant date	May 17, 2016

Abstract

A semiconductor device includes a semiconductor chip comprising a first and second terminal surfaces. An insulator surrounds an outer circumference of a side surface of the chip. A reinforcing-member is arranged between the side surface of the chip and an inner side surface of the insulator and surrounds the outer circumference of the side surface of the chip. A first and second holders hold the reinforcing-member therebetween at a top and bottom surfaces of the reinforcing-member. The first and second holders comprise protrusions facing an inner wall surface of the reinforcing-member, and the when φ1in represents an inner-diameter of parts of the reinforcing-member opposing to the protrusions, φ1out represents an outer-diameter of the reinforcing-member, φ2 represents an outer-diameter of the protrusion of either the first or the second holder, and φ3 represents an inner diameter of the insulator, the following Expression 1 is satisfied φ1in−φ2<φ1out.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a semiconductor chip including a first terminal surface and a second terminal surface that is opposite to the first terminal surface;
an insulator surrounding an outer circumference of a side surface of the semiconductor chip;
a reinforcing member arranged between the side surface of the semiconductor chip and an inner side surface of the insulator and surrounding the outer circumference of the side surface of the semiconductor chip; and
a first holder and a second holder holding the reinforcing member between the first holder and the second holder at a top surface and a bottom surface, respectively, of the reinforcing member, wherein
the first holder and the second holder comprise protrusions, respectively, facing an inner wall surface of the reinforcing member, and
when φ1in represents an inner diameter of a part of the reinforcing member opposing to the protrusions, φ1out represents an outer diameter of the reinforcing member, φ2 represents an outer diameter of the protrusion of either the first holder or the second holder, and φ3 represents an inner diameter of the insulator, Expression 1 is satisfied
φ1in−φ2<φ3−φ1out  Expression 1.

2. The device of claim 1 , wherein the inner wall surface of the reinforcing member contacts the protrusions instead of an outer wall surface of the reinforcing member contacting the insulator when the reinforcing member is moved toward either the insulator or the protrusions.

3. The device of claim 1 , wherein movements of the reinforcing member are limited by the protrusions when the reinforcing member is moved toward either the insulator or the protrusions.

4. The device of claim 2 , wherein movements of the reinforcing member are limited by the protrusions when the reinforcing member is moved toward either the insulator or the protrusions.

5. The device of claim 1 , wherein
the reinforcing member has a substantially cylindrical shape, and
the first holder and the second holder have ring shapes, respectively.

6. The device of claim 2 , wherein
the reinforcing member has a substantially cylindrical shape, and
the first holder and the second holder have ring shapes, respectively.

7. The device of claim 3 , wherein
the reinforcing member has a substantially cylindrical shape, and
the first holder and the second holder have ring shapes, respectively.

8. The device of claim 1 , wherein the reinforcing member is made of an electrically insulating material.

9. The device of claim 1 , wherein the reinforcing member is made of any one of glass fiber reinforced plastic, FRP, a glass filler, PTFE, ceramics, silicon nitride, Al2O3, and zirconia.

10. A semiconductor device comprising:
a semiconductor chip comprising a first terminal surface and a second terminal surface that is opposite to the first terminal surface;
an insulator surrounding an outer circumference of a side surface of the semiconductor chip;
an insulation protector arranged on the side surface of the semiconductor chip and providing electrical insulation between the first terminal surface and the second terminal surface; and
a reinforcing member arranged between the insulation protector and an inner side surface of the insulator and surrounding the outer circumference of the side surface of the semiconductor chip, wherein
when φ1in represents an inner diameter of a part of the reinforcing member opposing to the insulation protector, φ1out represents an outer diameter of the reinforcing member, φ12 represents an outer diameter of the insulation protector, and φ3 represents an inner diameter of the insulator, Expression 2 is satisfied
φ1in−φ12<φ3−φ1out  Expression 2.

11. The device of claim 10 , wherein an inner wall surface of the reinforcing member contacts the insulation protector instead of an outer wall surface of the reinforcing member contacting the insulator when the reinforcing member is moved toward either the insulator or the insulation protector.

12. The device of claim 10 , wherein movements of the reinforcing member are limited by the insulation protector when the reinforcing member is moved toward either the insulator or the insulation protector.

13. The device of claim 11 , wherein movements of the reinforcing member are limited by the insulation protector when the reinforcing member is moved toward either the insulator or the insulation protector.

14. The device of claim 10 , wherein the reinforcing member has a substantially cylindrical shape.

15. The device of claim 11 , wherein the reinforcing member has a substantially cylindrical shape.

16. The device of claim 12 , wherein the reinforcing member has a substantially cylindrical shape.

17. The device of claim 10 , wherein the reinforcing member is made of an electrically insulating material.

18. The device of claim 10 , wherein the reinforcing member is made of any one of glass fiber reinforced plastic, FRP, a glass filler, PTFE, and ceramics.

Assignees

• Toshiba Kk

Inventors

• Miyake Eitaro
• Kitazawa Hideaki

Classifications

• H10W42/00

  Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title

• H10W76/138 Primary

  having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type · CPC title

• H10W76/40

  Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W42/121

  protecting against mechanical damage (H10W76/00, H10W74/00 take precedence) · CPC title