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Compositions for polishing aluminum/copper and titanium in damascene structures
US9343330B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9343330-B2 |
| Application number | US-63457606-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 6, 2006 |
| Priority date | Dec 6, 2006 |
| Publication date | May 17, 2016 |
| Grant date | May 17, 2016 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
The invention provides a chemical-mechanical polishing composition for polishing a substrate. The polishing composition comprises an oxidizing agent, calcium ion, an organic carboxylic acid, and water, wherein the polishing composition has a pH of about 1.5 to about 7. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition.
First claim
Opening claim text (preview).
The invention claimed is: 1. A chemical-mechanical polishing composition comprising: (a) an abrasive, wherein the abrasive is polymer-treated alumina comprising alumina treated with a negatively-charged polymer, wherein the negatively-charged polymer is poly(2-acrylamido-2-methylpropane sulfonic acid), (b) an oxidizing agent selected from the group consisting of peroxides, persulfates, ferric salts, and combinations thereof, (c) 50 to 200 ppm of calcium ion, (d) about 1 wt. % to about 4 wt. % of an organic carboxylic acid, wherein the organic carboxylic acid is selected from the group consisting of citric acid, malonic acid, succinic acid and tartaric acid, and (e) water, wherein the polishing composition has a pH of 2 to 6. 2. The polishing composition of claim 1 , wherein the polishing composition comprises 0.001 wt. % to 2 wt. % of abrasive. 3. The polishing composition of claim 1 , wherein the oxidizing agent is selected from the group consisting of hydrogen peroxide, ammonium persulfate, ferric nitrate, and combinations thereof. 4. The polishing composition of claim 3 , wherein the polishing composition comprises 0.1 wt. % to 5 wt. % of oxidizing agent.
Assignees
Inventors
Classifications
- H10P52/403Primary
of conductive or resistive materials · CPC title
Etching of wafers, substrates or parts of devices · CPC title
Abrasive particles per se (preparation of diamond C01B32/25) · CPC title
Aqueous liquid suspensions · CPC title
Composite particles, e.g. coated particles · CPC title
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Frequently asked questions
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- What does patent US9343330B2 cover?
- The invention provides a chemical-mechanical polishing composition for polishing a substrate. The polishing composition comprises an oxidizing agent, calcium ion, an organic carboxylic acid, and water, wherein the polishing composition has a pH of about 1.5 to about 7. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing comp…
- Who is the assignee on this patent?
- Brusic Vlasta, Zhou Renjie, Feeney Paul, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10P52/403. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 17 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).