Vent structures for encapsulated components on an SOI-based photonics platform

Patent metadata

Field	Value
Publication number	US-9341792-B2
Application number	US-201113154699-A
Country	US
Kind code	B2
Filing date	Jun 7, 2011
Priority date	Jun 29, 2010
Publication date	May 17, 2016
Grant date	May 17, 2016

Abstract

An silicon-on-insulator (SOI)-based photonics platform is formed to including a venting structure for encapsulating the active and passive optical components formed on the SOI-based photonics platform. The venting structure is used to allow for the encapsulated components to “breathe” such that water vapor and gasses will pass through the package and not condensate on any of the encapsulated optical surfaces. The venting structure is configured to also to prevent dust, liquids and other particulate material from entering the package.

First claim

What is claimed is:

1. A system within an environment, the system comprising:
a silicon-on-insulator (SOI)-based photonics platform including a plurality of optical components configured to communicate optical signals therebetween;
a cap member which, when attached with a planar surface of the photonics platform, forms an enclosed volume within which the plurality of optical components are disposed, the cap member configured to prevent dust, liquids, and particulate matter from entering the volume from the environment; and
a passive venting arrangement providing selective fluid communication between the enclosed volume and the environment, the selective fluid communication including a bidirectional exchange of water vapor and other gases while excluding dust, liquids, and particulate matter,
the planar surface defining a plurality of openings, a first opening in fluid communication with the environment and a second opening in fluid communication with the enclosed volume, and
at least a first slot formed within the photonics platform to a predetermined depth from the planar surface, the first slot extending from the first opening to the second opening, wherein the passive venting arrangement comprises the first slot.

2. The system of claim 1 , wherein the cap member is a vented cap structure having at least a portion of the passive venting arrangement formed therein.

3. The system of claim 1 , wherein the photonics platform further comprises a second slot formed within the photonics platform and extending between third and fourth openings of the plurality of openings, the third opening in fluid communication with the environment and the fourth opening in fluid communication with the volume, wherein the passive venting arrangement further comprises the second slot.

4. The system of claim 3 , wherein the first and second slots are disposed in parallel with each other.

5. The system of claim 1 , wherein the first slot extends through an interlayer dielectric (ILD) layer of the photonics platform.

6. The system of claim 5 , wherein the first slot further extends through one or more of an SOI layer, a buried oxide (BOX) layer, and a silicon substrate of the photonics platform.

7. The system of claim 1 , wherein the cap member is a non-vented cap structure.

8. A system within an environment, the system comprising:
a silicon-on-insulator (SOI)-based photonics platform including a plurality of optical components configured to communicate optical signals therebetween; and
a vented cap member which, when attached with the photonics platform, forms an enclosed volume within which the plurality of optical components are disposed, the cap member providing selective fluid communication between the enclosed volume and the environment, the selective fluid communication including bidirectional exchange of water vapor and other gases while excluding dust, liquids, and particulate matter,
wherein the photonics platform comprises a planar surface defining a plurality of openings, a first opening in fluid communication with the environment and a second opening in fluid communication with the enclosed volume, and
wherein at least a first slot is formed within the photonics platform to a predetermined depth from the planar surface, the first slot extending from the first opening to the second opening.

9. The system of claim 8 , wherein at least a portion of the vented cap member comprises a breathable membrane.

10. The system of claim 8 , wherein at least a portion of the vented cap member is formed of one of a silicon and a glass material, and wherein a plurality of through-holes are formed through the portion of the vented cap member.

11. The system of claim 10 , wherein the plurality of through-holes have a diameter on the order of one micron or less.

12. The system of claim 1 , wherein the plurality of optical components include at least one active optical component and at least one passive optical component.

13. The system of claim 12 , wherein the at least one passive optical component includes an optical waveguide formed within an Sal layer of the photonics platform.

14. The system of claim 2 , wherein the passive venting arrangement further comprises a breathable membrane formed as at least a portion of the cap member.

15. The system of claim 2 , wherein at least a portion of the cap member is formed of one of a silicon and a glass material, and wherein the passive venting arrangement further comprises a plurality of through-holes formed through the portion of the cap member.

16. The system of claim 8 , wherein the photonics platform further comprises a second slot formed within the photonics platform and extending between third and fourth openings of the plurality of openings, the third opening in fluid communication with the environment and the fourth opening in fluid communication with the enclosed volume.

17. The system of claim 16 , wherein the first and second slots are disposed in parallel with each other.

18. The system of claim 8 , wherein the first slot extends through an interlayer dielectric (ILD) layer of the photonics platform.

19. The system of claim 18 , wherein the first slot further extends through one or more of an SOI layer, a buried oxide (BOX) layer, and a silicon substrate of the photonics platform.

20. A system within an environment, the system comprising:
a silicon-on-insulator (SOI)-based photonics platform including a plurality of optical components configured to communicate optical signals therebetween;
a cap member which, when attached with the photonics platform, forms an enclosed volume within which the plurality of optical components are disposed; and
a venting arrangement providing selective fluid communication between the enclosed volume and the environment, the selective fluid communication including a bidirectional exchange of water vapor and other gases while excluding dust, liquids, and particulate matter, a first portion of the venting arrangement formed within the cap member and a second portion of the venting arrangement formed within the photonics platform,
the second portion of the venting arrangement comprising a first opening in fluid communication with the environment, a second opening in fluid communication with the enclosed volume, and a first slot extending from the first opening to the second opening and formed to a predetermined depth from a planar surface of the photonics platform.

Assignees

• Nadeau Mary
• Fangman John
• Stackhouse Duane
• Young Craig
• Piede David
• Patel Vipulkumar
• Cisco Tech Inc

Inventors

• Nadeau Mary
• Fangman John
• Stackhouse Duane
• Young Craig
• Piede David
• Patel Vipulkumar

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07554

  changes in dispositions · CPC title

• H01S5/02248

  Electricity · mapped topic

• H01S5/02288

  Electricity · mapped topic

• G02B6/4256 Primary

  Details of housings · CPC title