Thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)

Patent metadata

Field	Value
Publication number	US-9341418-B2
Application number	US-201313782384-A
Country	US
Kind code	B2
Filing date	Mar 1, 2013
Priority date	Mar 1, 2013
Publication date	May 17, 2016
Grant date	May 17, 2016

Abstract

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to and cool one or more electronic components. The thermal transfer structure includes a thermal spreader, and at least one coolant-carrying tube coupled to the thermal spreader. The coolant-carrying tube(s) includes multiple tube lengths disposed substantially in a common plane, and an out-of-plane tube bend. The out-of-plane tube bend is couples in fluid communication first and second tube lengths of the multiple tube lengths, and extends out-of-plane from the multiple tube lengths disposed in the common plane. The first and second tube lengths may be spaced apart, with a third tube length disposed between them, and the coolant-carrying tube(s) further includes an in-plane tube bend which couples in fluid communication the third tube length and a fourth tube length of the multiple tube lengths.

First claim

What is claimed is:

1. A cooling apparatus comprising:
a thermal transfer structure, the thermal transfer structure comprising:
a thermal spreader;
at least one coolant-carrying tube coupled to and in thermal contact with the thermal spreader, the at least one coolant-carrying tube comprising:
multiple tube lengths disposed substantially in a common plane;
at last one out-of-plane tube bend, one out-of-plane tube bend of the at least one out-of-plane tube bend coupling in fluid communication a first tube length and a second tube length of the multiple tube lengths, the one out-of-plane tube bend extending out-of-plane from the multiple tube lengths disposed in the common plane;
at least one in-plane tube bend, one in-plane tube bend of the at least one in-plane tube bend coupling in fluid communication a third tube length and a fourth tube length of the multiple tube lengths, the one in-plane tube bend extending in the common plane of the multiple tube lengths;
wherein the first tube length and the second tube length are spaced apart, with the third tube length of the multiple tube lengths disposed therebetween; and
wherein the one out-of-plane tube bend coupling the first tube length and the second tube length overlies, at least in part, and extends out-of-plane from the one in-plane tube bend coupling in fluid communication the third tube length and the fourth tube length; and

a support wedge disposed between the one out-of-plane tube bend and the one in-plane tube bend, the support wedge being configured to support the one out-of-plane tube bend.

2. A cooling apparatus comprising:
a thermal transfer structure, the thermal transfer structure comprising:
a thermal spreader; and
at least one coolant-carrying tube coupled to and in thermal contact with the thermal spreader, the at least one coolant-carrying tube comprising:
multiple tube lengths disposed substantially in a common plane;
at last one out-of-plane tube bend, one out-of-plane tube bend of the at least one out-of-plane tube bend coupling in fluid communication a first tube length and a second tube length of the multiple tube lengths, the one out-of-plane tube bend extending out-of-plane from the multiple tube lengths disposed in the common plane;
at least one in-plane tube bend, one in-plane tube bend of the at least one in-plane tube bend coupling in fluid communication a third tube length and a fourth tube length of the multiple tube lengths, the one in-plane tube bend extending in the common plane of the multiple tube lengths;
wherein the first tube length and the second tube length are spaced apart, with the third tube length of the multiple tube lengths disposed therebetween; and
wherein the one out-of-plane tube bend coupling the first tube length and the second tube length overlies, at least in part, and extends out-of-plane from the one in-plane tube bend coupling in fluid communication the third tube length and the fourth tube length; and

wherein the thermal transfer structure comprises a first coolant-carrying tube and a second coolant-carrying tube, the first coolant-carrying tube comprising the first tube length, the second tube length, and the out-of-plane tube bend, and the second coolant-carrying tube comprising the third tube length, the fourth tube length, and the in-plane tube bend.

3. The cooling apparatus of claim 2 , wherein the thermal transfer structure further comprises a coolant supply manifold and a coolant return manifold, the first coolant-carrying tube and the second coolant-carrying tube being fluidically coupled in parallel between the coolant supply manifold and the coolant return manifold of the thermal transfer structure.

4. The cooling apparatus of claim 1 , wherein the at least one coolant-carrying tube is at least partially embedded within the thermal spreader, and the multiple tube lengths are disposed in parallel and cover a majority of one side of the thermal spreader.

5. The cooling apparatus of claim 1 , wherein the one out-of-plane tube bend resides over the thermal spreader.

6. The cooling apparatus of claim 1 , wherein the one out-of-plane tube bend extends past an edge of the thermal spreader.

7. The cooling apparatus of claim 1 , wherein the thermal spreader comprises a first thermally conductive material, and the at least one coolant-carrying tube comprises a second thermally conductive material, the first thermally conductive material and the second thermally conductive material being different materials.

8. The cooling apparatus of claim 7 , wherein the first thermally conductive material comprises aluminum and the second thermally conductive material comprises copper, and wherein the thermal spreader is a thermal-spreading plate.

9. The cooling apparatus of claim 1 , wherein one side of the thermal spreader is configured to couple to at least one electronic component to be cooled, and the at least one coolant-carrying tube is at least partially embedded within another side of the thermal spreader, the one side and the another side being opposite main sides of the thermal spreader.

10. The cooling apparatus of claim 9 , wherein at least one tube length of the multiple tube lengths directly contacts an electronic component of the at least one electronic component to be cooled through an opening in the thermal spreader within which the electronic component at least partially resides.

11. A coolant-cooled electronic assembly comprising:
at least one electronic component to be cooled;
a cooling apparatus, the cooling apparatus comprising:
a thermal transfer structure coupled to the at least one electronic component to be cooled to facilitate dissipation of heat from the at least one electronic component, the thermal transfer structure comprising:
a thermal spreader;
at least one coolant-carrying tube coupled to and in thermal contact with the thermal spreader, the at least one coolant-carrying tube comprising:
multiple tube lengths disposed substantially in a common plane;
at least one out-of-plane tube bend, one out-of-plane tube bend of the at least one out-of-plane tube bend coupling in fluid communication a first tube length and a second tube length of the multiple tube lengths, the one out-of-plane tube bend extending out-of-plane from the common plane in which the multiple tube lengths are substantially disposed;
at least one in-plane tube bend, one in-plane tube bend of the at least one in-plane tube bend coupling in fluid communication a third tube length and a fourth tube length of the multiple tube lengths, the one in-plane tube bend extending in the common plane of the multiple tube lengths;
wherein the first tube length and the second tube length are spaced apart, with the third tube length of the multiple tube lengths disposed therebetween; and
wherein the one out-of-plane tube bend coupling the first tube length and the second tube length overlies, at least in part, and extends out-of-plane from the one in-plane tube bend coupling in fluid communication the third tube length and the fourth tube length; and

a support wedge disposed between the one out-of-plane tube bend and the one in-plane tube bend, the support wedge being configured to support the one out-of-plane tube bend.

12. The coolant-cooled electronic assembly of claim 11 , wherein the at least one coolant-carrying tube is at least partially embedded within the thermal spreader, and the multiple tube lengths are disposed in parallel and cover a majority of one side of the thermal spreader.

Assignees

• IBM

Inventors

• Arvelo Amilcar R
• Brandon Mark A
• Campbell Levi A
• Ellsworth Jr Michael J
• Kemink Randall G
• Mckeever Eric J

Classifications

• F28F1/12 Primary

  the means being only outside the tubular element · CPC title

• F28F1/00

  Tubular elements; Assemblies of tubular elements (specially adapted for movement F28F5/00) · CPC title

• H05K7/20763

  Liquid cooling without phase change · CPC title

• Y10T29/4935

  Heat exchanger or boiler making · CPC title

• H05K7/20772 Primary

  within server blades for removing heat from heat source · CPC title