Conductive metal ink composition, and method for forming a conductive pattern

Patent metadata

Field	Value
Publication number	US-9340684-B2
Application number	US-201113697337-A
Country	US
Kind code	B2
Filing date	May 6, 2011
Priority date	May 10, 2010
Publication date	May 17, 2016
Grant date	May 17, 2016

Abstract

An exemplary embodiment of the present invention relates to a conductive metal ink composition comprising a conductive metal powder; a non-aqueous solvent; an organo phosphate compound; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition.

First claim

The invention claimed is:

1. A conductive metal ink composition, comprising:
a conductive metal powder;
a non-aqueous solvent comprising a first non-aqueous solvent having a vapor pressure of 3 torr or less at 25° C. and a second non-aqueous solvent having a vapor pressure of more than 3 torr at 25° C.;
an organo phosphate compound; and
a polymer coating property improving agent,
wherein the organo phosphate compound comprises a compound of the following Formula 1:

wherein
R 1 and R 2 are each independently hydrogen, alkyl having 1 to 20 carbon atoms, polyalkylene oxide comprising 1 to 5 repeating units of alkylene oxide having 1 to 4 carbon atoms, or a combination thereof,
R 3 is acrylate or methacrylate, and
A is polyalkylene oxide comprising 1 to 20 repeating units of alkylene oxide having 1 to 4 carbon atoms.

2. The conductive metal ink composition according to claim 1 , wherein the conductive metal ink composition is printed on a substrate by a roll printing process and used for forming a conductive pattern.

3. The conductive metal ink composition according to claim 2 , wherein the conductive metal ink composition is used for forming an electrode of a flat display device.

4. The conductive metal ink composition according to claim 1 , wherein the conductive metal powder comprises one or more metal powders selected from the group consisting of silver (Ag), copper (Cu), gold (Au), chromium (Cr), aluminum (Al), tungsten (W), zinc (Zn), nickel (Ni), iron (Fe), platinum (Pt), palladium (Pd), and lead (Pb).

5. The conductive metal ink composition according to claim 1 , wherein the conductive metal powder has an average particle diameter of 1 to 100 nm.

6. The conductive metal ink composition according to claim 1 , wherein the first non-aqueous solvent comprises one or more selected from the group consisting of an alcohol-based solvent, a glycol-based solvent, a polyol-based solvent, a glycol ether-based solvent, a glycol ether ester-based solvent, a ketone-based solvent, a hydrocarbon-based solvent, a lactate-based solvent, an ester-based solvent, an aprotic sulfoxide-based solvent, and a nitrile-based solvent having the vapor pressure of 3 torr or less at 25° C.

7. The conductive metal ink composition according to claim 1 , wherein the second non-aqueous solvent comprises one or more selected from the group consisting of an alcohol-based solvent, a glycol ether-based solvent, a glycol ether ester-based solvent, a ketone-based solvent, a hydrocarbon-based solvent, a lactate-based solvent, an ester-based solvent, an aprotic sulfoxide-based solvent, and a nitrile-based solvent having the vapor pressure of more than 3 torr at 25° C.

8. The conductive metal ink composition according to claim 1 , wherein the organo phosphate compound is organo phosphoric acid ester.

9. The conductive metal ink composition according to claim 1 , wherein in Formula 1, A is polyalkylene oxide comprising 1 to 20 repeating units of alkylene oxide having 1 to 3 carbon atoms.

10. The conductive metal ink composition according to claim 1 , wherein the polymer coating property improving agent is selected from the group consisting of an epoxy-based polymer, a phenol-based polymer, an alcohol-based polymer, ethylenevinylacetate, a rosin-based resin, a styrene-butadiene-styrene-based polymer, and a polyester-based polymer.

11. The conductive metal ink composition according to claim 1 , further comprising:
an organic silver complex compound formed by a complex by bonding an organic ligand comprising an amine group and a hydroxy group with an aliphatic silver (Ag) carboxylate.

12. The conductive metal ink composition according to claim 11 , wherein the aliphatic silver (Ag) carboxylate is selected from the group consisting of primary or secondary aliphatic acid silver (Ag) salts having 2 to 20 carbon atoms, and the organic ligand is selected from the group consisting of primary amines, secondary amines, tertiary amines, and quaternary amines wherein the amines are further substituted by an alcohol group.

13. The conductive metal ink composition according to claim 11 , wherein in the organic silver complex compound, the organic ligand and the aliphatic silver carboxylate are bonded with each other at an equivalence ratio of 1:1 to 5:1.

14. The conductive metal ink composition according to claim 11 , comprising:
on the basis of 100 parts by weight of the total conductive metal ink composition,
0.1 to 6 parts by weight of the organic silver complex compound.

15. The conductive metal ink composition according to claim 1 , comprising:
on the basis of 100 parts by weight of the total conductive metal ink composition,
15 to 30 parts by weight of the conductive metal powder;
5 to 70 parts by weight of the first non-aqueous solvent;
10 to 74 parts by weight of the second non-aqueous solvent; and
0.01 to 5 parts by weight of the polymer coating property improving agent.

16. The conductive metal ink composition according to claim 1 , comprising:
on the basis of 100 parts by weight of the total conductive metal ink composition,
0.01 to 5 parts by weight of the organo phosphate compound.

17. The conductive metal ink composition according to claim 1 , further comprising a surfactant.

18. The conductive metal ink composition according to claim 1 , wherein the conductive metal ink composition has an initial viscosity of 10 cPs or less.

19. A conductive pattern obtained by transferring the conductive metal ink composition according to claim 1 on a substrate and sintering the transferred pattern.

20. A method for forming a conductive pattern, comprising:
coating the conductive metal ink composition according to claim 1 on a roller;
contacting the conductive metal ink composition with a cliché to form a pattern of the ink composition corresponding to the conductive pattern on the roller, the pattern corresponding to the conductive pattern being intaglioed with the roller;
transferring the ink composition pattern on the roller on a substrate; and
sintering the pattern transferred on the substrate.

21. The method for forming a conductive pattern according to claim 20 , wherein the conductive pattern is an electrode pattern of a flat display device.

22. The method for forming a conductive pattern according to claim 20 , wherein the sintering is performed at 350 to 600° C. for 5 to 50 min.

Assignees

• Jeon Kyoung Su
• Seong Jiehyun
• Heo Soo Yeon
• Hwang Ji Young
• Lee Jong Taik
• Lg Chemical Ltd

Inventors

• Jeon Kyoung Su
• Seong Jiehyun
• Heo Soo Yeon
• Hwang Ji Young
• Lee Jong Taik

Classifications

• H01B1/22

  the conductive material comprising metals or alloys · CPC title

• C09D5/24 Primary

  Electrically-conducting paints {(conductive materials H01B1/00)} · CPC title

• H05K1/092

  Dispersed materials, e.g. conductive pastes or inks · CPC title

• H05K1/095

  for polymer thick films, i.e. having a permanent organic polymeric binder · CPC title

• C09D11/52 Primary

  Electrically conductive inks · CPC title