Device comprising a fluid channel fitted with at least one microelectronic or nanoelectronic system, and method for manufacturing such a device

Patent metadata

Field	Value
Publication number	US-9340410-B2
Application number	US-201414336351-A
Country	US
Kind code	B2
Filing date	Jul 21, 2014
Priority date	Jul 22, 2013
Publication date	May 17, 2016
Grant date	May 17, 2016

Abstract

A device comprising a substrate comprising at least one microelectronic and/or nanoelectronic structure comprising at least one sensitive portion and one fluid channel ( 2 ) defined between said substrate and a cap ( 6 ), where said fluid channel ( 2 ) comprises at least two apertures to provide a flow in said channel, where said microelectronic and/or nanoelectronic structure is located within the fluid channel, where said cap is assembled with the substrate at an assembly interface, where said device comprises electrical connections between said microelectronic and/or nanoelectronic structure and the exterior of the fluid channel ( 2 ), where said electrical connections ( 8 ) are formed by vias made through the substrate ( 4 ) directly below the microelectronic and/or nanoelectronic structure, and in electrical contact with said microelectronic and/or nanoelectronic structure.

First claim

The invention claimed is:

1. A device comprising:
a substrate comprising at least one electronic structure including at least one of a microelectronic structure and a nanoelectronic structure comprising at least one sensitive portion,
a cap, said cap being assembled with the substrate at an assembly interface,
one fluid channel defined between said substrate and said cap, said fluid channel comprising at least two apertures to provide a flow in said channel, said electronic structure being located within the fluid channel,
at least one electrical connection between said electronic structure and the exterior of the fluid channel, the at least one electrical connection being formed by a via made at least partly through the substrate directly below the electronic structure, and in electrical contact with the electronic structure, and
an intermediate layer located only at the assembly interface located between the cap and the substrate.

2. A device comprising:
a substrate comprising at least one electronic structure including at least one of a microelectronic structure and a nanoelectronic structure comprising at least one sensitive portion,
a cap, said cap being assembled with the substrate at an assembly interface,
one fluid channel defined between said substrate and said cap, said fluid channel comprising at least two apertures to provide a flow in said channel, said electronic structure being located within the fluid channel,
at least one electrical connection between said electronic structure and the exterior of the fluid channel, the at least one electrical connection being formed by a via made at least partly through the substrate directly below the electronic structure, and in electrical contact with the electronic structure, and
an intermediate layer located at least partly in the fluid channel, said intermediate layer covering, in the fluid channel, at least partly the electronic structure, except for the sensitive portion thereof.

3. The device according to claim 2 , in which the intermediate layer is an encapsulation layer.

4. The device according to claim 2 , in which the via is in electrical contact with the electronic structure through a contact located in the fluid channel.

5. The device according to claim 2 , in which the intermediate layer comprises an electrically insulating material.

6. The device according to claim 2 , comprising a functionalization layer at least partly covering a part of the sensitive portion of the electronic structure.

7. The device according to claim 2 , comprising several microelectronic or nanoelectronic structures interconnected in said fluid channel.

8. The device according to claim 7 , in which the microelectronic or nanoelectronic structures are interconnected by interconnection lines positioned in the fluid channel.

9. The device according to claim 8 , in which the intermediate layer comprises an electrically insulating material which electrically insulates the interconnection lines.

10. The device according to claim 2 , comprising a dry sealing film interposed between the substrate and the cap.

11. The device according to claim 10 , in which the dry sealing film comprises several beads.

12. The device according to claim 2 , comprising at least one layer of material interposed between the substrate and the cap making a eutectic or metallic sealing, or thermocompression sealing, or screen print sealing, or in which the sealing is a molecular sealing or glass frit.

13. The device according to claim 2 , in which the intermediate layer comprises at least a first planarizing layer and a second layer deposited on the first layer, said second layer being made of a material sensitive to a step of release of the electronic structure.

14. The device according to claim 2 , in which the channel forms a gas chromatography microcolumn.

15. The device according to claim 2 , in which the intermediate layer comprises at least a first planarizing layer and a second layer deposited on the first layer, said second layer being made of a material insensitive to a step of release of the electronic structure.

Assignees

• Commissariat Energie Atomique
• Commissariat Energie Atomique

Inventors

• Ollier Eric
• Marcoux Carine

Classifications

• B81B2201/0214

  Biosensors; Chemical sensors · CPC title

• B81B2201/0292

  Sensors not provided for in B81B2201/0207 - B81B2201/0285 · CPC title

• G01N30/6095 Primary

  Micromachined or nanomachined, e.g. micro- or nanosize · CPC title

• B81C2203/0118

  Bonding a wafer on the substrate, i.e. where the cap consists of another wafer · CPC title

• B81B2201/058

  Microfluidics not provided for in B81B2201/051 - B81B2201/054 · CPC title