Thermal interface material pad and method of forming the same

Patent metadata

Field	Value
Publication number	US-9338927-B2
Application number	US-201313913068-A
Country	US
Kind code	B2
Filing date	Jun 7, 2013
Priority date	May 2, 2013
Publication date	May 10, 2016
Grant date	May 10, 2016

Abstract

A thermal interface material (TIM) pad is disclosed for dissipating heat from a component. The TIM pad includes a plurality of thermal interface material layers and at least one graphene layer interposed between the plurality of TIM layers. A method for forming the TIM pad includes stacking the plurality of TIM layers with at least one graphene layer interposed between the plurality of TIM layers to reach a length for the TIM pad. The stacked layers are cut corresponding to a thickness for the TIM pad for compression against the component.

First claim

What is claimed is:

1. A thermal interface material (TIM) pad for dissipating heat from a component in an electronic device, the TIM pad comprising:
a plurality of TIM layers; and
at least one graphene layer interposed between the plurality of TIM layers, wherein the at least one graphene layer extends in a direction substantially perpendicular to a major surface of the TIM pad that is configured to contact the component, and wherein the at least one graphene layer extends to the major surface of the TIM pad.

2. The TIM pad of claim 1 , wherein:
the major surface of the TIM pad contacts a surface of the component; and
the at least one graphene layer extends in a direction substantially perpendicular to the surface of the component, such that the thermal conductivity of the TIM pad is greater in the direction substantially perpendicular to the surface of the component than in a direction substantially parallel to the surface of the component.

3. The TIM pad of claim 1 , wherein the at least one graphene layer forms between 5% and 15% of the total volume of the TIM pad.

4. The TIM pad of claim 1 , wherein:
the electronic device comprises a data storage device; and
the TIM pad forms a portion of the data storage device.

5. The TIM pad of claim 4 , wherein the component includes at least one of a system on a chip (SOC), a flash memory, or a double data rate synchronous dynamic random-access memory (DDR SDRAM).

6. The TIM pad of claim 1 , wherein the major surface of the TIM pad contacts a grounded heat spreader plate of the component.

7. The TIM pad of claim 1 , wherein the major surface of the TIM pad contacts a surface of the component and the plurality of TIM layers are flexible, so that an outer TIM layer of the plurality of TIM layers deforms outward in a direction substantially parallel to the surface of the component when compressed against the surface of the component.

8. The TIM pad of claim 1 , wherein the TIM pad is compressed between the component and a frame housing the component.

9. A method for dissipating heat from a component of an electronic device, the method comprising:
forming a thermal interface material (TIM) pad by at least:
stacking a plurality of TIM layers with at least one graphene layer interposed between the plurality of TIM layers to reach a length for the TIM pad; and
cutting the stacked layers corresponding to a thickness for the TIM pad for compression against the component, wherein the at least one graphene layer extends in a direction substantially perpendicular to a major surface of the TIM pad that is configured to contact the component, and wherein the at least one graphene layer extends to the major surface of the TIM pad.

10. The method of claim 9 , further comprising:
placing the major surface of the TIM pad adjacent the component such that the major surface of the TIM pad contacts a surface of the component,
wherein the at least one graphene layer extends in a direction substantially perpendicular to the surface of the component, such that the thermal conductivity of the TIM pad is greater in the direction substantially perpendicular to the surface of the component than in a direction substantially parallel to the surface of the component.

11. The method of claim 9 , wherein the at least one graphene layer forms between 5% and 15% of the total volume of the TIM pad.

12. The method of claim 9 , wherein the plurality of TIM layers include an adhesive property that allow for the plurality of TIM layers to adhere to the at least one graphene layer.

13. The method of claim 9 , wherein the at least one graphene layer is approximately 0.1 mm thick.

14. The method of claim 9 , wherein cutting the stacked layers includes cutting the stacked layers with a laser cutter, saw or razor.

15. The method of claim 9 , wherein the stacked layers are cut to a thickness greater than a space to be filled by the TIM pad.

16. The method of claim 9 , further comprising:
removing the TIM pad from the stacked layers;
placing the major surface of the TIM pad adjacent the component or a frame of the electronic device; and
compressing the TIM pad between the frame and the component.

17. The method of claim 16 , wherein compressing the TIM pad includes fixing a first portion of the frame to a second portion of the frame.

18. The method of claim 16 , wherein compressing the TIM pad includes fixing the frame to a printed circuit board (PCB) of the electronic device.

19. The method of claim 16 , wherein:
the electronic device comprises a data storage device; and
the TIM pad, the frame and the component form a portion of the data storage device.

20. A data storage device comprising:
a component that generates heat; and
a thermal interface material (TIM) pad for dissipating heat from the component, the TIM pad comprising:
a plurality of TIM layers; and
at least one graphene layer interposed between the plurality of TIM layers,

wherein the at least one graphene layer extends in a direction substantially perpendicular to a major surface of the TIM pad that is configured to contact the component, and
wherein the at least one graphene layer extends to the major surface of the TIM pad.

21. The data storage device of claim 20 , wherein the component includes at least one of a system on a chip (SOC), a flash memory, or a double data rate synchronous dynamic random-access memory (DDR SDRAM).

22. The data storage device of claim 20 , wherein the major surface of the TIM pad contacts a grounded heat spreader plate of the component.

23. The data storage device of claim 20 , wherein the major surface of the TIM pad contacts a surface of the component and the plurality of TIM layers are flexible, so that an outer TIM layer of the plurality of TIM layers deforms outward in a direction substantially parallel to the surface of the component when compressed against the surface of the component.

24. The data storage device of claim 20 , further comprising a frame housing the component, wherein the TIM pad is compressed between the component and the frame.

Assignees

• Western Digital Tech Inc

Inventors

• Mataya Richard A
• Salessi Nader M

Classifications

• H05K7/20481 Primary

  characterised by the material composition exhibiting specific thermal properties · CPC title

• H05K7/20454

  with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste · CPC title

• Y10T29/49366

  Sheet joined to sheet · CPC title