Cooling structure for electronic circuit component and inverter apparatus using the same

Patent metadata

Field	Value
Publication number	US-9338926-B2
Application number	US-201313873953-A
Country	US
Kind code	B2
Filing date	Apr 30, 2013
Priority date	Aug 30, 2012
Publication date	May 10, 2016
Grant date	May 10, 2016

Abstract

A cooling structure for a shunt resistor has a semiconductor switching element mounted on a component side of a circuit board, a shunt resistor surface-mounted a solder side of the circuit board, a radiator for releasing heat generated from the semiconductor switching element and the shunt resistor, and an insulating material interposed between the shunt resistor and the radiator and having a high thermal conductivity.

First claim

What is claimed is:

1. A cooling structure for an electronic circuit component, comprising:
a semiconductor switching element mounted on a component side of a circuit board;
a shunt resistor surface-mounted on a solder side opposite to the component side of the circuit board and including a metal lead terminal and a resistor;
a radiator provided on the solder side of the circuit board and configured to release heat generated from the shunt resistor; and
an insulating material interposed between the shunt resistor and the radiator and having a high thermal conductivity,
wherein the heat generated from the semiconductor switching element is released from the radiator through the insulating material,
wherein the heat generated from the shunt resister is released through a heat transfer passage,
wherein the heat is transferred from the resistor to the radiator through the heat transfer passage in which the heat from the resistor is directly transferred via the insulating material to the heat sink.

2. The cooling structure for an electronic circuit component according to claim 1 , wherein
the lead terminal and the resistor comprise the same metal.

3. The cooling structure for an electronic circuit component according to claim 1 , wherein
the insulating material having a high thermal conductivity has a thermal conductivity of 0.1 W/m·K or higher.

4. An inverter apparatus comprising:
the cooling structure for an electronic circuit component according to claim 1 .

5. The cooling structure for an electronic circuit component according to claim 1 , wherein the heat generated from the shunt resister is further released through another heat transfer passage in which the heat is transferred to the radiator via the lead terminal, a wiring pattern, and the heat insulating material, respectively.

6. The cooling structure for an electronic circuit component according to claim 1 , further comprising at least one additional shunt resistor connected in parallel to the shunt resistor, forming a current detecting circuit.

7. The cooling structure for a shunt resistor according to claim 1 , wherein the insulating material directly abuts the resistor of the shunt resistor.

8. The cooling structure for a shunt resistor according to claim 1 , wherein the radiator cools the semiconductor switching element provided on the component side and the shunt resistor provided on the solder side without any electronic component elements.

Assignees

• Mitsubishi Electric Corp

Inventors

• Sotome Hideyuki
• Muto Takaya

Classifications

• H01L2924/0002

  Electricity · mapped topic

• H05K7/209 Primary

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

• H01L2924/00

  Electricity · mapped topic

• H02M7/003

  Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title