Cover film

Patent metadata

Field	Value
Publication number	US-9338906-B2
Application number	US-201114112054-A
Country	US
Kind code	B2
Filing date	Apr 18, 2011
Priority date	Apr 18, 2011
Publication date	May 10, 2016
Grant date	May 10, 2016

Abstract

Disclosed is a cover film, which includes at least a base layer, an intermediate layer, a releasing layer and a heat seal layer that can be heat-sealed to a carrier tape, and wherein the heat seal layer contains, as a main component, a styrene-acrylic copolymer that has a mass average molecular weight of 5000 to 20000. This cover film is suppressed in variation in release strength when separated from the carrier tape, and is capable of reducing problems in the mounting process of electronic components such as rupture of the cover film during the separation.

First claim

The invention claimed is:

1. A cover film comprising at least a substrate layer, an intermediate layer, a peel layer and a heat seal layer capable of being heat-sealed to a carrier tape;
wherein the peel layer comprises, as a main component, a hydrogenated aromatic vinyl-conjugated diene copolymer having an aromatic vinyl content of 15 to 35 mass %,
the thickness of the substrate layer is 12 to 25 μm, the thickness of the intermediate layer is 5 to 50 μm, the thickness of the peel layer is 0.1 to 3 μm and the thickness of the heat seal layer is 0.1 to 5 μm, and
the heat seal layer comprises, as a main component, a styrenic-acrylic copolymer having a mass-average molecular weight of 5000 to 20000.

2. The cover film according to claim 1 , wherein the styrenic-acrylic copolymer of the heat seal layer is a resin having a glass transition temperature of 70 to 100° C.

3. The cover film according to claim 1 , wherein the peel layer and/or the heat seal layer comprises a conductive material.

4. The cover film according to claim 3 , wherein the conductive material is conductive microparticles, comprising acicular or spherical microparticles, or a combination thereof.

5. The cover film recited in claim 3 , wherein the conductive material is a carbon nano-material.

6. An electronic component package comprising, as a lid material of a carrier tape having a thermoplastic resin as the main component, the cover film according to claim 1 .

7. The cover film according to claim 1 , wherein the substrate layer comprises a biaxially stretched polyester or a biaxially stretched nylon.

8. The cover film according to claim 1 , wherein the intermediate layer comprises a linear low-density polyethylene (LLDPE).

9. The cover film according to claim 8 , wherein the LLDPE is polymerized by a metallocene catalyst and is a copolymer of ethylene and an olefin having from 3 to 18 carbon atoms.

10. The cover film according to claim 1 , wherein the peel layer comprises a hydrogenated styrene-isoprene-styrene triblock copolymer resin (SEPS) or a hydrogenated styrene-butadiene-styrene triblock copolymer resin (SEBS).

11. The cover film according to claim 1 , wherein the peel layer has a thickness of from 0.1 to 1.5 μm.

12. The cover film according to claim 1 , wherein the styrenic-acrylic copolymer has a mass-average molecular weight of 10,000 to 20,000.

13. The cover film according to claim 1 , wherein the styrenic-acrylic copolymer has a glass transition temperature of 70° C. to 100° C.

14. The cover film according to claim 1 , wherein the heat seal layer has a thickness of from 0.1 to 3 μm.

15. The cover film according to claim 1 , wherein the heat seal layer has a thickness of from 0.1 to 0.5 μm.

Assignees

• Sasaki Akira
• Tokunaga Hisatsugu
• Fujimura Tetsuo
• Denka Company Ltd

Inventors

• Sasaki Akira
• Tokunaga Hisatsugu
• Fujimura Tetsuo

Classifications

• C09J2205/106

  Chemistry & Metallurgy · mapped topic

• B32B27/36

  comprising polyesters · CPC title

• B32B2307/202

  Conductive · CPC title

• C08K3/04

  Carbon · CPC title

• C09J2205/102

  Chemistry & Metallurgy · mapped topic